Method for manufacturing piezoelectric film, piezoelectric element and ink jet recording head
    10.
    发明授权
    Method for manufacturing piezoelectric film, piezoelectric element and ink jet recording head 有权
    制造压电薄膜,压电元件和喷墨记录头的方法

    公开(公告)号:US06884649B2

    公开(公告)日:2005-04-26

    申请号:US10665422

    申请日:2003-09-22

    摘要: The invention provides a method for manufacturing a piezoelectric element including a coating step of coating a substrate with a coating liquid for forming the piezoelectric element thereby forming a coated film, a drying step of drying the coated film, a preliminary sintering step of preliminarily sintering the coated film thereby forming an oxide film, a final sintering step of finally sintering the oxide film thereby forming a piezoelectric film, and a cooling step of cooling the piezoelectric film, wherein the steps are executed in the presence of a moisture-containing gas; in the coating step the substrate has a temperature equal to or less than 50° C. and the moisture-containing gas has a relative humidity of 60% RH or less at 25° C.; in the drying step, the substrate has a temperature equal to or less than 200° C. and the relative humidity is 10 to 70% RH; in the preliminary sintering step the substrate has a temperature of 200 to 450° C. and the relative humidity is 70 to 100% RH; in the final sintering step the substrate has a temperature of 500 to 800° C. and the relative humidity is 70 to 100% RH.

    摘要翻译: 本发明提供了一种制造压电元件的方法,该压电元件包括​​用用于形成压电元件的涂布液涂覆基材的涂布步骤,从而形成涂膜,干燥涂膜的干燥步骤,预烧结步骤 从而形成氧化膜,最终烧结氧化膜从而形成压电膜的最终烧结步骤以及冷却压电膜的冷却步骤,其中步骤在含水气体存在下进行; 在涂布步骤中,基材的温度等于或低于50℃,含湿气体在25℃下的相对湿度为60%RH或更低。 在干燥工序中,基板的温度为200℃以上,相对湿度为10〜70%RH, 在预烧结步骤中,基板的温度为200〜450℃,相对湿度为70〜100%RH; 在最终烧结步骤中,基板的温度为500〜800℃,相对湿度为70〜100%RH。