NITRIDE SEMICONDUCTOR GROWTH SUBSTRATE AND MANUFACTURING METHOD OF THE SAME, NITRIDE SEMICONDUCTOR EPITAXIAL SUBSTRATE AND NITRIDE SEMICONDUCTOR ELEMENT
    1.
    发明申请
    NITRIDE SEMICONDUCTOR GROWTH SUBSTRATE AND MANUFACTURING METHOD OF THE SAME, NITRIDE SEMICONDUCTOR EPITAXIAL SUBSTRATE AND NITRIDE SEMICONDUCTOR ELEMENT 审中-公开
    氮化物半导体生长衬底及其制造方法,氮化物半导体外延衬底和氮化物半导体元件

    公开(公告)号:US20130092950A1

    公开(公告)日:2013-04-18

    申请号:US13615421

    申请日:2012-09-13

    IPC分类号: H01L29/20 H01L21/20

    摘要: A nitride semiconductor growth substrate includes a principal surface including a C-plane of a sapphire substrate, and a convex portion that is formed on the principal surface, has a cone or pyramid shape or a truncated cone or pyramid shape, is disposed to form a lattice pattern in a top view thereof, and includes a side surface inclined at an angle of less than 90 degrees relative to the principal surface. The convex portion has a height of 0.5 to 3 μm from the principal surface. A distance between adjacent ones of the convex portion is 1 to 6 μm. The side surface of the convex portion has a surface roughness (RMS) of not more than 10 nm.

    摘要翻译: 氮化物半导体生长衬底包括包括蓝宝石衬底的C面的主表面和形成在主表面上的具有锥形或棱锥形或截锥形或棱锥形状的凸部,以形成 并且包括相对于主表面以小于90度的角度倾斜的侧表面。 凸部的主面的高度为0.5〜3μm。 相邻的凸部之间的距离为1〜6μm。 凸部的侧面的表面粗糙度(RMS)为10nm以下。

    METAL CHLORIDE GAS GENERATOR, HYDRIDE VAPOR PHASE EPITAXY GROWTH APPARATUS, AND NITRIDE SEMICONDUCTOR TEMPLATE
    2.
    发明申请
    METAL CHLORIDE GAS GENERATOR, HYDRIDE VAPOR PHASE EPITAXY GROWTH APPARATUS, AND NITRIDE SEMICONDUCTOR TEMPLATE 有权
    金属氯化物气体发生器,氢化钙蒸汽相外延生长装置和氮化物半导体模板

    公开(公告)号:US20130043442A1

    公开(公告)日:2013-02-21

    申请号:US13569983

    申请日:2012-08-08

    IPC分类号: C30B25/14 B01J10/00 H01B1/06

    摘要: A metal chloride gas generator includes: a tube reactor including a receiving section for receiving a metal on an upstream side, and a growing section in which a growth substrate is placed on a downstream side; a gas inlet pipe arranged to extend from an upstream end with a gas inlet via the receiving section to the growing section, for introducing a gas from the upstream end to supply the gas to the receiving section, and supplying a metal chloride gas produced by a reaction between the gas and the metal in the receiving section to the growing section; and a heat shield plate placed in the reactor to thermally shield the upstream end from the growing section. The gas inlet pipe is bent between the upstream end and the heat shield plate.

    摘要翻译: 金属氯化物气体发生器包括:管式反应器,包括用于在上游侧接收金属的接收部分和生长基底放置在下游侧的生长部分; 气体入口管,其布置成从具有通过接收部的气体入口的上游端延伸到生长部分,用于从上游端引入气体以将气体供应到接收部分,并且供应由 接收部分中的气体和金属与生长部分之间的反应; 以及放置在反应器中以将上游端与生长部分进行热屏蔽的隔热板。 进气管在上游端和隔热板之间弯曲。

    METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE
    7.
    发明申请
    METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE 有权
    制备氮化物半导体衬底的方法

    公开(公告)号:US20130072005A1

    公开(公告)日:2013-03-21

    申请号:US13598175

    申请日:2012-08-29

    申请人: Hajime FUJIKURA

    发明人: Hajime FUJIKURA

    IPC分类号: H01L21/203

    摘要: To provide a method for manufacturing a nitride semiconductor substrate capable of reducing a cleavage during slicing of a nitride semiconductor single crystal, and capable of improving a yield rate of the nitride semiconductor substrate, comprising: growing a nitride semiconductor single crystal on a seed crystal substrate by vapor phase epitaxy; grinding an outer peripheral surface of the grown nitride semiconductor single crystal; and slicing the nitride semiconductor single crystal with its outer peripheral surface ground, wherein a grinding amount of the outer peripheral surface of the nitride semiconductor single crystal in the step of grinding is 1.5 mm or more.

    摘要翻译: 为了提供一种能够减少氮化物半导体单晶的切割时的切割并能够提高氮化物半导体基板的成品率的氮化物半导体基板的制造方法,其特征在于,包括:在种子晶体基板上生长氮化物半导体单晶 通过气相外延; 研磨生长的氮化物半导体单晶的外周表面; 以及其氮化物半导体单晶的外周面接地切片,其中,所述研磨工序中的所述氮化物半导体单晶的外周面的研磨量为1.5mm以上。

    METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE
    8.
    发明申请
    METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE 有权
    制备氮化物半导体衬底的方法

    公开(公告)号:US20130023128A1

    公开(公告)日:2013-01-24

    申请号:US13489570

    申请日:2012-06-06

    申请人: Hajime FUJIKURA

    发明人: Hajime FUJIKURA

    IPC分类号: H01L21/3065

    摘要: There is provided a method for manufacturing a nitride semiconductor substrate, comprising: etching and flattening a surface of a nitride semiconductor substrate disposed facing a surface plate, by using the surface plate having a surface composed of any one of Ni, Ti, Cr, W, and Mo or nitride of any one of them, disposing the surface of the surface plate and a flattening surface of a nitride semiconductor substrate proximately so as to be faced each other, and supplying gas containing at least hydrogen and ammonia between the surface of the surface plate and the surface of the nitride semiconductor substrate, wherein the surface plate and the nitride semiconductor substrate facing each other are set in a high temperature state of 900° C. or more.

    摘要翻译: 提供了一种用于制造氮化物半导体衬底的方法,包括:通过使用具有由Ni,Ti,Cr,W中的任一种构成的表面的表面板来蚀刻和平坦化面对面板的氮化物半导体衬底的表面 ,以及其中任何一个的Mo或氮化物,将表面板的表面和氮化物半导体衬底的平坦化表面近似设置成彼此面对,并且在该表面之间提供至少包含氢和氨的气体 表面板和氮化物半导体衬底的表面,其中彼此面对的表面板和氮化物半导体衬底被设定在900℃以上的高温状态。