摘要:
A metal chloride gas generator includes: a tube reactor including a receiving section for receiving a metal on an upstream side, and a growing section in which a growth substrate is placed on a downstream side; a gas inlet pipe arranged to extend from an upstream end with a gas inlet via the receiving section to the growing section, for introducing a gas from the upstream end to supply the gas to the receiving section, and supplying a metal chloride gas produced by a reaction between the gas and the metal in the receiving section to the growing section; and a heat shield plate placed in the reactor to thermally shield the upstream end from the growing section. The gas inlet pipe is bent between the upstream end and the heat shield plate.
摘要:
There is provided a nitride semiconductor epitaxial substrate having a group III nitride semiconductor layer with C-plane as a surface, grown on a substrate via a buffer layer of the group III nitride semiconductor containing Al, wherein the buffer layer has an inversion domain on the surface.
摘要:
A nitride semiconductor template includes a substrate, and a group III nitride semiconductor layer having an oxygen-doped layer formed on the substrate, and a silicon-doped layer formed on the oxygen-doped layer. A total thickness of the group III nitride semiconductor layer is not smaller than 4 μm and not greater than 10 μm, and an average silicon carrier concentration in the silicon-doped layer is not lower than 1×1018 cm−3 and not higher than 5×1018 cm−3.
摘要:
In a light emitting diode, a light-emitting region is including an active layer provided between a first conductivity type cladding layer formed on the semiconductor substrate and a second conductivity type cladding layer. A transparent conductive film made of a metal oxide is located over the light-emitting region. A layer for preventing exfoliation of the transparent conductive film, the preventing layer being made of a compound semiconductor contains at least aluminum and is located between the light-emitting region and the transparent conductive film. The layer for preventing exfoliation of the transparent conductive film contains a conductivity type determining impurity in a concentration of 1×1019 cm−3 or higher.
摘要:
A light emitting element according to an embodiment of the invention includes a semiconductor substrate, a light emitting part having a first conductivity type first cladding layer; a second conductivity type second cladding layer different from the first cladding layer in the conductivity type and an active layer sandwiched between the first cladding layer and the second cladding layer, a reflecting part for reflecting a light emitted from the active layer, disposed between the semiconductor substrate and the light emitting part so as to have a thickness of 1.7 μm to 8.0 μm and an electric current dispersing layer disposed on a side of the light emitting part opposite to the reflecting part, having a uneven part on the surface thereof, wherein the reflecting part is formed so as to have at least three pair layers formed of a first semiconductor layer and a second semiconductor layer different from the first semiconductor layer, the first semiconductor layer has a thickness TA defined by the formula (1), if peak wavelength of the light emitted from the active layer is λP, refractive index of the first semiconductor layer is nA, refractive index of the second semiconductor layer is nB, refractive index of the first cladding layer is nIn, and incident angle of light to the second semiconductor layer is θ, the second semiconductor layer has a thickness TB defined by the formula (2), and a plurality of pair layers of the reflecting part have a different thickness to each other according as values of the incident angle of light θ in the formulae (1) and (2) are different with respect to each pair layer, and at least one pair layer includes the first semiconductor layer and the second semiconductor layer defined by that the incident angle of light θ is not less than 50 degrees. T A = λ p 4 n A 1 - ( n In sin θ n A ) 2 ( 1 ) T B = λ p 4 n B 1 - ( n In sin θ n B ) 2 ( 2 )
摘要:
A Si substrate 1, a metal adhesion layer 2, a reflective metal film 3 comprising a multilayer of metallic material having a light reflectivity, a SiO2 film 4, an ohmic contact portion 5 provided at a predetermined position of the SiO2 film 4, a GaP layer 6 including a Mg-doped GaP layer 6A and a Zn-doped GaP layer 6B, a p-type GaInP interposed layer 7, a p-type AlGaInP cladding layer 8, an undoped MQW active layer 9, an n-type AlGaInP cladding layer 10, an n-type AlGaInP window layer 11, an n-type GaAs contact layer 12, a first electrode 13, and a second electrode 14 are formed. The ohmic contact portion 5 is distant from the light emitting part including the p-type AlGaInP cladding layer 8, the undoped MQW active layer 9 and the n-type AlGaInP cladding layer 10 by not less than 300 nm.
摘要:
An epitaxial wafer, a light-emitting element, a method of fabricating the epitaxial wafer and a method of fabricating the light-emitting element, which have a high output and a low forward voltage, and can be fabricated without increasing fabricating cost, are provided. The epitaxial wafer is formed with a light-emitting portion, a reflective portion provided between a semiconductor substrate and the light-emitting portion and a current dispersing layer having first and second current dispersing layers, wherein the reflective portion has plural pairs of layers having first and second semiconductor layers wherein the first semiconductor layer has a thickness of TA defined by Equation (1), T A = λ p 4 n A 1 - ( n I n sin θ n A ) 2 ( 1 ) the second semiconductor layer has a thickness of TB defined by Equation (2), T B = λ p 4 n B 1 - ( n I n sin θ n B ) 2 ( 2 ) and the second current dispersing layer has a high carrier density or a high impurity density and is provided with the convexoconcave portion on the surface.
摘要翻译:提供外延晶片,发光元件,制造外延晶片的方法和制造发光元件的方法,其具有高输出和低正向电压,并且可以在不增加制造成本的情况下制造。 。 外延晶片形成有发光部分,设置在半导体基板和发光部分之间的反射部分和具有第一和第二电流分散层的电流分散层,其中反射部分具有多对具有第一 和第二半导体层,其中第一半导体层具有由等式(1)定义的TA的厚度,TA =λp 4 n n A 1 - (n I n n sin sinté; n A)2(1) 第二半导体层具有由等式(2)定义的TB的厚度,TB =λp 4 n n B 1 - (n I n n sin sin t e n t n n n 2)(2)和第二电流分散 层具有高载流子密度或高杂质浓度,并且在表面上设置凸凹部。
摘要:
A light-emitting element includes a semiconductor substrate, a light emitting portion including an active layer sandwiched between a first cladding layer of a first conductivity type and a second cladding layer of a second conductivity type different from the first conductivity type, a reflective portion provided between the semiconductor substrate and the light emitting portion for reflecting light emitted from the active layer, and a current spreading layer provided on the light emitting portion opposite to the reflective portion and including a concavo-convex portion on a surface thereof. The reflective portion includes a plurality of pair layers each including a first semiconductor layer and a second semiconductor layer different from the first semiconductor layer, and the first semiconductor layer has a thickness TA1 defined by formulas (1) and (3), and the second semiconductor layer has a thickness TB1 defined by formulas (2) and (4).