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公开(公告)号：US08614266B2
公开(公告)日：2013-12-24
申请号：US13102029
申请日：2011-05-05
申请人： Haiying Li , William Lee Harrison
发明人： Haiying Li , William Lee Harrison
CPC分类号： H01L23/293 , C08G59/226 , C08G59/32 , C08G59/38 , C08G59/50 , C08L63/00 , C08L2666/22 , C09J163/00 , H01L2924/0002 , H01L2924/00
摘要： A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.
摘要翻译： 公开了一种用于电子部件的灌封材料，电子部件以及将铁氧体定位在电子材料中的工艺。 灌封材料通过固化混合物形成。 该混合物包括环氧组分，有机胺硬化剂，粘度控制剂和二氧化硅。 封装材料具有无机铁氧体热膨胀系数与电子部件的有机基板热膨胀系数之间的热膨胀系数。 灌封材料包括通过一次或多次机械钻孔和激光燃烧钻孔所允许的刚度。
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公开(公告)号：US20110272191A1
公开(公告)日：2011-11-10
申请号：US13102029
申请日：2011-05-05
申请人： Haiying LI , William Lee Harrison
发明人： Haiying LI , William Lee Harrison
CPC分类号： H01L23/293 , C08G59/226 , C08G59/32 , C08G59/38 , C08G59/50 , C08L63/00 , C08L2666/22 , C09J163/00 , H01L2924/0002 , H01L2924/00
摘要： A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.
摘要翻译： 公开了一种用于电子部件的灌封材料，电子部件以及将铁氧体定位在电子材料中的工艺。 灌封材料通过固化混合物形成。 该混合物包括环氧组分，有机胺硬化剂，粘度控制剂和二氧化硅。 封装材料具有无机铁氧体热膨胀系数与电子部件的有机基板热膨胀系数之间的热膨胀系数。 灌封材料包括通过一次或多次机械钻孔和激光燃烧钻孔所允许的刚度。
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公开(公告)号：US07821374B2
公开(公告)日：2010-10-26
申请号：US12006822
申请日：2008-01-04
CPC分类号： H01F41/046 , H01F17/0033 , H01F19/04 , H01F30/16 , H01F2027/2814 , Y10T29/4902
摘要： A method of arranging and fabricating parallel primary and secondary coils of a wideband planar transformer is provided. The spacing and width of the coils are disposed to extend the bandwidth from DC to GHz and allow for high frequency coupling when the core permeability dramatically drops and achieves low reflected energy and low loss over a wide bandwidth. A bottom mold having a pattern of hole-pairs with conductive elements inserted vertically couples to a top mold such that a middle portion of the conductive elements spans between the top and bottom molds. Dielectric material envelopes the middle portion and a displacement feature of the mold creates a vacancy. A ferrite element is deposited to the vacancy. A second top mold spans the bottom mold and dielectric material is deposited to create a molded assembly. A deposited patterned conductive coating connects the element ends to define the transformer coils.
摘要翻译： 提供了一种布置和制造宽带平面变压器并联一次线圈和次级线圈的方法。 线圈的间距和宽度被设置为将带宽从DC扩展到GHz，并且当芯磁导率显着下降并且在宽带宽上实现低反射能量和低损耗时允许高频耦合。 具有垂直插入的导电元件的孔对图案的底模具耦合到顶模，使得导电元件的中间部分跨越顶模和底模之间。 电介质材料包围中间部分，并且模具的位移特征产生空位。 铁素体元素沉积到空位。 第二顶模跨越底模并且沉积介电材料以形成模制组件。 沉积的图案化导电涂层连接元件端部以限定变压器线圈。
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公开(公告)号：US08466769B2
公开(公告)日：2013-06-18
申请号：US13087112
申请日：2011-04-14
IPC分类号： H01F5/00
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/045 , H01F17/062 , H01F2027/2814
摘要： A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.
摘要翻译： 多层电感器件包括平面衬底，铁氧体，以及外导体线圈和内导电线圈。 基板包括多个电介质层，其中铁氧体主体设置在基板中。 外导电线圈和内导电线圈螺旋缠绕在铁氧体上。 外导电线圈包括第一上导体，第一下导体和垂直延伸穿过衬底并与第一上导体和下导体导电耦合的第一导电通孔。 内导电线圈包括第二上导体，第二下导体和垂直延伸穿过衬底并与第二上导体和下导体导电耦合的第二导电通孔。 内部导电线圈设置在外部导电线圈和铁氧体之间。
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5.发明授权Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors 有权制造和使用平面嵌入式磁体作为分立元件和集成连接器公开(公告)号：US08203418B2
公开(公告)日：2012-06-19
申请号：US12592771
申请日：2009-12-01
CPC分类号： H01F19/04 , H01F17/0033 , H01F30/16 , H01F41/046 , H01R13/6633 , H01R13/719 , H01R24/64 , H05K1/0233 , H05K1/183 , H05K2201/086 , H05K2201/10189
摘要： The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor. The integrated planar transformer and electronic component further includes at least one electronic component connected to at least one terminal of the wide-band planar transformer.
摘要翻译： 本发明提供了一种集成平面变压器和电子部件，其包括设置在平面基板中的至少一个宽带平面变压器，其中每个宽带平面变压器包括处于完全固化和刚性状态的平面基板，嵌入平面 衬底，其中铁氧体材料被包裹在弹性和非导电材料中，围绕在埋入的铁氧体材料周围的导体，其中顶部和底部导体通过绝缘粘合剂结合。 顶部和底部导体通过设置在铁氧体材料的每一侧上的导电通孔以相互连接的形式连接，并跨越导体层。 平面变压器还包括连接到至少一个互缠绕导体的至少一个中心抽头。 集成平面变压器和电子部件还包括连接到宽带平面变压器的至少一个端子的至少一个电子部件。
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公开(公告)号：US09440378B2
公开(公告)日：2016-09-13
申请号：US13407161
申请日：2012-02-28
CPC分类号： B29C39/10 , H01F17/0033 , H01F41/046 , H01F2017/048 , Y10T29/49124
摘要： A method of manufacturing a planar board substrate for receiving a magnetic core. The method includes providing a cover layer having a layer side and providing a base layer having first and second sides. The base layer includes a material hole that extends completely through the base layer between the first and second sides. The method also includes coupling the cover and base layers to each other along the first side and the layer side. The cover layer extends over at least a portion of the material hole. The method also includes providing a dielectric member within the material hole, wherein a core-holding channel exists between the dielectric member and the base layer. The core-holding channel extends circumferentially around the dielectric member and is configured to have a magnetic core therein.
摘要翻译： 一种制造用于接收磁芯的平面板基板的方法。 该方法包括提供具有层侧的覆盖层，并提供具有第一和第二侧面的基底层。 基层包括在第一和第二面之间完全延伸通过基底层的材料孔。 该方法还包括沿着第一侧和层侧将盖和基底层彼此连接。 覆盖层在材料孔的至少一部分上延伸。 所述方法还包括在所述材料孔内提供电介质构件，其中在所述电介质构件和所述基底层之间存在芯保持通道。 芯保持通道围绕电介质构件周向延伸并且构造成在其中具有磁芯。
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公开(公告)号：US20110291789A1
公开(公告)日：2011-12-01
申请号：US13087112
申请日：2011-04-14
IPC分类号： H01F5/00
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/045 , H01F17/062 , H01F2027/2814
摘要： A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.
摘要翻译： 多层电感器件包括平面衬底，铁氧体，以及外导体线圈和内导电线圈。 基板包括多个电介质层，其中铁氧体主体设置在基板中。 外导电线圈和内导电线圈螺旋缠绕在铁氧体上。 外导电线圈包括第一上导体，第一下导体和垂直延伸穿过衬底并与第一上导体和下导体导电耦合的第一导电通孔。 内导电线圈包括第二上导体，第二下导体和垂直延伸穿过衬底并与第二上导体和下导体导电耦合的第二导电通孔。 内部导电线圈设置在外部导电线圈和铁氧体之间。
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公开(公告)号：US20110242713A1
公开(公告)日：2011-10-06
申请号：US13053729
申请日：2011-03-22
IPC分类号： H02H9/04
CPC分类号： H05K1/165 , H01H57/00 , H01H2057/006 , H04M3/18 , H04M11/062 , H05K1/0233 , H05K1/0239 , H05K1/0254 , H05K1/162 , H05K1/185
摘要： A voltage protection assembly includes a planar substrate, an input terminal, a capacitive element, an inductive element, and an output terminal. The substrate includes conductive traces with the input terminal conductively coupled with at least one of the traces. The capacitive element is electrically coupled with the input terminal. The inductive element is conductively coupled with the capacitive element. The output terminal is disposed on the substrate and is conductively coupled with the inductive element. The output terminal, the inductive element, the capacitive element, and the input terminal are connected in series to form a voltage protection circuit that filters one or more frequencies of a data signal transmitted through the voltage protection circuit. At least one of the capacitive element or the inductive element is entirely disposed within the thickness dimension of the substrate.
摘要翻译： 电压保护组件包括平面基板，输入端子，电容元件，电感元件和输出端子。 衬底包括导电迹线，其中输入端与至少一个迹线导电耦合。 电容元件与输入端电连接。 电感元件与电容元件导电耦合。 输出端子设置在基板上并与感应元件导电耦合。 输出端子，电感元件，电容元件和输入端子串联连接形成一个电压保护电路，滤波器通过电压保护电路传输的数据信号的一个或多个频率。 电容元件或电感元件中的至少一个完全设置在基板的厚度尺寸内。
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9.发明申请Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors 有权制造和使用平面嵌入式磁体作为分立元件和集成连接器公开(公告)号：US20100295646A1
公开(公告)日：2010-11-25
申请号：US12592771
申请日：2009-12-01
CPC分类号： H01F19/04 , H01F17/0033 , H01F30/16 , H01F41/046 , H01R13/6633 , H01R13/719 , H01R24/64 , H05K1/0233 , H05K1/183 , H05K2201/086 , H05K2201/10189
摘要： The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor. The integrated planar transformer and electronic component further includes at least one electronic component connected to at least one terminal of the wide-band planar transformer.
摘要翻译： 本发明提供了一种集成平面变压器和电子部件，其包括设置在平面基板中的至少一个宽带平面变压器，其中每个宽带平面变压器包括处于完全固化和刚性状态的平面基板，嵌入平面 衬底，其中铁氧体材料被包裹在弹性和非导电材料中，围绕在埋入的铁氧体材料周围的导体，其中顶部和底部导体通过绝缘粘合剂结合。 顶部和底部导体通过设置在铁氧体材料的每一侧上的导电通孔以相互连接的形式连接，并跨越导体层。 平面变压器还包括连接到至少一个互缠绕导体的至少一个中心抽头。 集成平面变压器和电子部件还包括连接到宽带平面变压器的至少一个端子的至少一个电子部件。
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公开(公告)号：US08581114B2
公开(公告)日：2013-11-12
申请号：US12699777
申请日：2010-02-03
CPC分类号： H01F17/0033 , H01F17/062 , H05K1/165 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K2201/086 , H05K2201/09036 , H05K2201/097 , H05K2203/1178
摘要： A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion. The packaged structure further includes a ring-typed magnetic component placed in the ring-typed recess; an upper wiring layer above the insulating substrate and a lower wiring layer under the insulating substrate; an inner plated through hole vertically passing through the island portion and connecting the upper wiring layer and the lower wiring layer; an outer plated through hole vertically passing through the surrounding portion and connecting the upper wiring layer and the lower wiring layer, wherein the inner plated through hole, the outer plated through hole, the upper wiring layer and the lower wiring layer form a coil of wire surrounding the ring-typed magnetic component.
摘要翻译： 提供具有磁性部件的封装结构及其制造方法。 封装结构包括具有环形凹部，岛状部分和由环型凹部限定的环绕部分的绝缘基板，其中环形凹部横向在岛部分和周围部分之间。 封装结构还包括放置在环型凹槽中的环型磁性部件; 绝缘基板上方的上布线层和绝缘基板下方的下布线层; 垂直穿过岛部并连接上布线层和下布线层的内电镀通孔; 外部电镀通孔垂直地穿过周围部分并连接上部布线层和下部布线层，其中内部电镀通孔，外部电镀通孔，上部布线层和下部布线层形成线圈 围绕环型磁性元件。
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