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公开(公告)号：US08614266B2
公开(公告)日：2013-12-24
申请号：US13102029
申请日：2011-05-05
申请人： Haiying Li , William Lee Harrison
发明人： Haiying Li , William Lee Harrison
CPC分类号： H01L23/293 , C08G59/226 , C08G59/32 , C08G59/38 , C08G59/50 , C08L63/00 , C08L2666/22 , C09J163/00 , H01L2924/0002 , H01L2924/00
摘要： A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.
摘要翻译： 公开了一种用于电子部件的灌封材料，电子部件以及将铁氧体定位在电子材料中的工艺。 灌封材料通过固化混合物形成。 该混合物包括环氧组分，有机胺硬化剂，粘度控制剂和二氧化硅。 封装材料具有无机铁氧体热膨胀系数与电子部件的有机基板热膨胀系数之间的热膨胀系数。 灌封材料包括通过一次或多次机械钻孔和激光燃烧钻孔所允许的刚度。
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公开(公告)号：US07821374B2
公开(公告)日：2010-10-26
申请号：US12006822
申请日：2008-01-04
CPC分类号： H01F41/046 , H01F17/0033 , H01F19/04 , H01F30/16 , H01F2027/2814 , Y10T29/4902
摘要： A method of arranging and fabricating parallel primary and secondary coils of a wideband planar transformer is provided. The spacing and width of the coils are disposed to extend the bandwidth from DC to GHz and allow for high frequency coupling when the core permeability dramatically drops and achieves low reflected energy and low loss over a wide bandwidth. A bottom mold having a pattern of hole-pairs with conductive elements inserted vertically couples to a top mold such that a middle portion of the conductive elements spans between the top and bottom molds. Dielectric material envelopes the middle portion and a displacement feature of the mold creates a vacancy. A ferrite element is deposited to the vacancy. A second top mold spans the bottom mold and dielectric material is deposited to create a molded assembly. A deposited patterned conductive coating connects the element ends to define the transformer coils.
摘要翻译： 提供了一种布置和制造宽带平面变压器并联一次线圈和次级线圈的方法。 线圈的间距和宽度被设置为将带宽从DC扩展到GHz，并且当芯磁导率显着下降并且在宽带宽上实现低反射能量和低损耗时允许高频耦合。 具有垂直插入的导电元件的孔对图案的底模具耦合到顶模，使得导电元件的中间部分跨越顶模和底模之间。 电介质材料包围中间部分，并且模具的位移特征产生空位。 铁素体元素沉积到空位。 第二顶模跨越底模并且沉积介电材料以形成模制组件。 沉积的图案化导电涂层连接元件端部以限定变压器线圈。
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公开(公告)号：US08581114B2
公开(公告)日：2013-11-12
申请号：US12699777
申请日：2010-02-03
CPC分类号： H01F17/0033 , H01F17/062 , H05K1/165 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K2201/086 , H05K2201/09036 , H05K2201/097 , H05K2203/1178
摘要： A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion. The packaged structure further includes a ring-typed magnetic component placed in the ring-typed recess; an upper wiring layer above the insulating substrate and a lower wiring layer under the insulating substrate; an inner plated through hole vertically passing through the island portion and connecting the upper wiring layer and the lower wiring layer; an outer plated through hole vertically passing through the surrounding portion and connecting the upper wiring layer and the lower wiring layer, wherein the inner plated through hole, the outer plated through hole, the upper wiring layer and the lower wiring layer form a coil of wire surrounding the ring-typed magnetic component.
摘要翻译： 提供具有磁性部件的封装结构及其制造方法。 封装结构包括具有环形凹部，岛状部分和由环型凹部限定的环绕部分的绝缘基板，其中环形凹部横向在岛部分和周围部分之间。 封装结构还包括放置在环型凹槽中的环型磁性部件; 绝缘基板上方的上布线层和绝缘基板下方的下布线层; 垂直穿过岛部并连接上布线层和下布线层的内电镀通孔; 外部电镀通孔垂直地穿过周围部分并连接上部布线层和下部布线层，其中内部电镀通孔，外部电镀通孔，上部布线层和下部布线层形成线圈 围绕环型磁性元件。
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公开(公告)号：US20110291788A1
公开(公告)日：2011-12-01
申请号：US13087068
申请日：2011-04-14
IPC分类号： H01F5/00
CPC分类号： H01F5/003 , H01F17/0006 , H01F17/062 , H01F27/28 , H01F27/2804
摘要： A planar inductor device includes a substrate, a ferrite body in the substrate, upper and lower conductors, and conductive vias. The substrate vertically extends from an upper surface to an opposite lower surface. The substrate laterally extends from a first edge to a second edge. The upper conductors are disposed above the ferrite body. The lower conductors are disposed below the ferrite body. The conductive vias extend through the substrate and are conductively coupled with the upper conductors and with the lower conductors. The vias, the upper conductors, and the lower conductors form one or more conductive coils that encircle the ferrite body in the substrate. At least one of the first edge or the second edge of the substrate passes through one or more of the vias such that the vias are exposed at the at least one of the first edge or the second edge.
摘要翻译： 平面电感器件包括衬底，衬底中的铁氧体，上导体和下导体以及导电通孔。 基板从上表面垂直延伸到相对的下表面。 衬底从第一边缘横向延伸到第二边缘。 上部导体设置在铁氧体的上方。 下部导体设置在铁氧体下方。 导电通孔延伸穿过基板，并与上导体和下导体导电耦合。 通孔，上导体和下导体形成环绕衬底中的铁氧体的一个或多个导电线圈。 衬底的第一边缘或第二边缘中的至少一个穿过一个或多个通孔，使得通孔在第一边缘或第二边缘中的至少一个处露出。
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公开(公告)号：US20110272191A1
公开(公告)日：2011-11-10
申请号：US13102029
申请日：2011-05-05
申请人： Haiying LI , William Lee Harrison
发明人： Haiying LI , William Lee Harrison
CPC分类号： H01L23/293 , C08G59/226 , C08G59/32 , C08G59/38 , C08G59/50 , C08L63/00 , C08L2666/22 , C09J163/00 , H01L2924/0002 , H01L2924/00
摘要： A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.
摘要翻译： 公开了一种用于电子部件的灌封材料，电子部件以及将铁氧体定位在电子材料中的工艺。 灌封材料通过固化混合物形成。 该混合物包括环氧组分，有机胺硬化剂，粘度控制剂和二氧化硅。 封装材料具有无机铁氧体热膨胀系数与电子部件的有机基板热膨胀系数之间的热膨胀系数。 灌封材料包括通过一次或多次机械钻孔和激光燃烧钻孔所允许的刚度。
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公开(公告)号：US20110108317A1
公开(公告)日：2011-05-12
申请号：US12699777
申请日：2010-02-03
IPC分类号： H05K1/11
CPC分类号： H01F17/0033 , H01F17/062 , H05K1/165 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K2201/086 , H05K2201/09036 , H05K2201/097 , H05K2203/1178
摘要： A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion. The packaged structure further includes a ring-typed magnetic component placed in the ring-typed recess; an upper wiring layer above the insulating substrate and a lower wiring layer under the insulating substrate; an inner plated through hole vertically passing through the island portion and connecting the upper wiring layer and the lower wiring layer; an outer plated through hole vertically passing through the surrounding portion and connecting the upper wiring layer and the lower wiring layer, wherein the inner plated through hole, the outer plated through hole, the upper wiring layer and the lower wiring layer form a coil of wire surrounding the ring-typed magnetic component.
摘要翻译： 提供具有磁性部件的封装结构及其制造方法。 封装结构包括具有环形凹部，岛状部分和由环型凹部限定的环绕部分的绝缘基板，其中环形凹部横向在岛部分和周围部分之间。 封装结构还包括放置在环型凹槽中的环型磁性部件; 绝缘基板上方的上布线层和绝缘基板下方的下布线层; 垂直穿过岛部并连接上布线层和下布线层的内电镀通孔; 外部电镀通孔垂直地穿过周围部分并连接上部布线层和下部布线层，其中内部电镀通孔，外部电镀通孔，上部布线层和下部布线层形成线圈 围绕环型磁性元件。
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公开(公告)号：US20090002111A1
公开(公告)日：2009-01-01
申请号：US12006822
申请日：2008-01-04
CPC分类号： H01F41/046 , H01F17/0033 , H01F19/04 , H01F30/16 , H01F2027/2814 , Y10T29/4902
摘要： A method of arranging and fabricating parallel primary and secondary coils of a wideband planar transformer is provided. The spacing and width of the coils are disposed to extend the bandwidth from DC to GHz and allow for high frequency coupling when the core permeability dramatically drops and achieves low reflected energy and low loss over a wide bandwidth. A bottom mold having a pattern of hole-pairs with conductive elements inserted vertically couples to a top mold such that a middle portion of the conductive elements spans between the top and bottom molds. Dielectric material envelopes the middle portion and a displacement feature of the mold creates a vacancy. A ferrite element is deposited to the vacancy. A second top mold spans the bottom mold and dielectric material is deposited to create a molded assembly. A deposited patterned conductive coating connects the element ends to define the transformer coils.
摘要翻译： 提供了一种布置和制造宽带平面变压器并联一次线圈和次级线圈的方法。 线圈的间距和宽度被设置为将带宽从DC扩展到GHz，并且当芯磁导率显着下降并且在宽带宽上实现低反射能量和低损耗时允许高频耦合。 具有垂直插入的导电元件的孔对图案的底模具耦合到顶模，使得导电元件的中间部分跨越顶模和底模之间。 电介质材料包围中间部分，并且模具的位移特征产生空位。 铁素体元素沉积到空位。 第二顶模跨越底模并且沉积介电材料以形成模制组件。 沉积的图案化导电涂层连接元件端部以限定变压器线圈。
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公开(公告)号：US20080219289A1
公开(公告)日：2008-09-11
申请号：US11985330
申请日：2007-11-13
IPC分类号： H04L29/04
CPC分类号： H04L12/66
摘要： A method of power management in a 10GBase-T Ethernet transceiver is provided. The 10GBase-T Ethernet transceiver is according to an IEEE 802.3an standard. The method includes determining a cable length from a transmitter to a receiver in the Ethernet. A low-power mode of the transceiver is enabled when the cable length is determined to be 30-meters or less, and the low-power mode of the transceiver is disabled when the cable length is determined to be greater than 30-meters. The cable length determination can be accomplished using time domain reflectometry prior to an auto-negotiation process, during the auto-negotiation process, or through interrogation of a management interface. The transceiver can be monitored, where an operational link speed is reduced when transmit and receive data is below a predetermined level for a predetermined duration.
摘要翻译： 提供了一种10GBase-T以太网收发器中的电源管理方法。 10GBase-T以太网收发器符合IEEE 802.3标准。 该方法包括确定以太网中从发射机到接收机的电缆长度。 当电缆长度确定为30米或更小时，使能收发器的低功耗模式，并且当电缆长度确定为大于30米时，收发器的低功耗模式被禁用。 电缆长度确定可以在自动协商过程之前，在自动协商过程中，或者通过询问管理接口，使用时域反射测量来完成。 可以监视收发器，其中当发送和接收数据低于预定电平达预定持续时间时，操作链路速度降低。
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公开(公告)号：US08466769B2
公开(公告)日：2013-06-18
申请号：US13087112
申请日：2011-04-14
IPC分类号： H01F5/00
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/045 , H01F17/062 , H01F2027/2814
摘要： A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.
摘要翻译： 多层电感器件包括平面衬底，铁氧体，以及外导体线圈和内导电线圈。 基板包括多个电介质层，其中铁氧体主体设置在基板中。 外导电线圈和内导电线圈螺旋缠绕在铁氧体上。 外导电线圈包括第一上导体，第一下导体和垂直延伸穿过衬底并与第一上导体和下导体导电耦合的第一导电通孔。 内导电线圈包括第二上导体，第二下导体和垂直延伸穿过衬底并与第二上导体和下导体导电耦合的第二导电通孔。 内部导电线圈设置在外部导电线圈和铁氧体之间。
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10.发明授权Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors 有权制造和使用平面嵌入式磁体作为分立元件和集成连接器公开(公告)号：US08203418B2
公开(公告)日：2012-06-19
申请号：US12592771
申请日：2009-12-01
CPC分类号： H01F19/04 , H01F17/0033 , H01F30/16 , H01F41/046 , H01R13/6633 , H01R13/719 , H01R24/64 , H05K1/0233 , H05K1/183 , H05K2201/086 , H05K2201/10189
摘要： The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor. The integrated planar transformer and electronic component further includes at least one electronic component connected to at least one terminal of the wide-band planar transformer.
摘要翻译： 本发明提供了一种集成平面变压器和电子部件，其包括设置在平面基板中的至少一个宽带平面变压器，其中每个宽带平面变压器包括处于完全固化和刚性状态的平面基板，嵌入平面 衬底，其中铁氧体材料被包裹在弹性和非导电材料中，围绕在埋入的铁氧体材料周围的导体，其中顶部和底部导体通过绝缘粘合剂结合。 顶部和底部导体通过设置在铁氧体材料的每一侧上的导电通孔以相互连接的形式连接，并跨越导体层。 平面变压器还包括连接到至少一个互缠绕导体的至少一个中心抽头。 集成平面变压器和电子部件还包括连接到宽带平面变压器的至少一个端子的至少一个电子部件。
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