Abstract:
Providing for single and multi-bit error correction of electronic memory is described herein. As an example, error correction can be accomplished by establishing a suspect region between bit level distributions of a set of analyzed memory cells. The suspect region can define potential error bits for the distributions. If a bit error is detected for the distributions, error correction can first be applied to the potential error bits in the suspect region. By identifying suspected error bits and limiting initial error correction to such identified bits, complexities involved in applying error correction to all bits of the distributions can be mitigated or avoided, improving efficiency of bit error corrections for electronic memory.
Abstract:
Providing for single and multi-bit error correction of electronic memory is described herein. As an example, error correction can be accomplished by establishing a suspect region between bit level distributions of a set of analyzed memory cells. The suspect region can define potential error bits for the distributions. If a bit error is detected for the distributions, error correction can first be applied to the potential error bits in the suspect region. By identifying suspected error bits and limiting initial error correction to such identified bits, complexities involved in applying error correction to all bits of the distributions can be mitigated or avoided, improving efficiency of bit error corrections for electronic memory.
Abstract:
Providing for single and multi-bit error correction of electronic memory is described herein. As an example, error correction can be accomplished by establishing a suspect region between bit level distributions of a set of analyzed memory cells. The suspect region can define potential error bits for the distributions. If a bit error is detected for the distributions, error correction can first be applied to the potential error bits in the suspect region. By identifying suspected error bits and limiting initial error correction to such identified bits, complexities involved in applying error correction to all bits of the distributions can be mitigated or avoided, improving efficiency of bit error corrections for electronic memory.
Abstract:
Providing for single and multi-bit error correction of electronic memory is described herein. As an example, error correction can be accomplished by establishing a suspect region between bit level distributions of a set of analyzed memory cells. The suspect region can define potential error bits for the distributions. If a bit error is detected for the distributions, error correction can first be applied to the potential error bits in the suspect region. By identifying suspected error bits and limiting initial error correction to such identified bits, complexities involved in applying error correction to all bits of the distributions can be mitigated or avoided, improving efficiency of bit error corrections for electronic memory.
Abstract:
A resistive memory device includes a first metallic layer comprising a source of positive metallic ions, a switching media having an upper surface and a lower surface, wherein the upper surface is adjacent to the first metallic layer, wherein the switching media comprises conductive filaments comprising positive metallic ions from the source of positive metallic ions formed from the upper surface towards the lower surface, a semiconductor substrate, a second metallic layer disposed above the semiconductor substrate, a non-metallic conductive layer disposed above the second metallic layer, and an interface region between the non-metallic conductive layer and the switching media having a negative ionic charge.
Abstract:
An integrated circuit device. The integrated circuit device includes a semiconductor substrate having a surface region. A gate dielectric layer overlies the surface region of the substrate. The device includes a MOS device having a p+ active region. The p+ active region forms a first electrode for a resistive switching device. The resistive switching device includes an amorphous silicon switching material overlying the p+ active region and a metal electrode overlies the first metal conductor structure. The metal electrode includes a metal material, upon application of a positive bias to the metal electrode, forms a metal region in the amorphous silicon switching material. The MOS device provides for a select transistor for the integrated circuit device.
Abstract:
Providing for a serial array memory transistor architecture that achieves high read speeds compared with conventional serial array memory is described herein. By way of example, the serial array memory can be connected to and can drive a gate voltage of a small capacitance pass transistor, to facilitate sensing memory transistors of the serial array. The pass transistor modulates current flow or voltage at an adjacent metal bitline, which can be utilized to sense a program or erase state(s) of the memory transistors. Due to the small capacitance of the pass transistor, read latency for the serial array can be significantly lower than conventional serial array memory (e.g., NAND memory). Further, various mechanisms for forming an amplifier region of the serial array memory comprising discrete pass transistor are described to facilitate efficient fabrication of the serial array memory transistor architecture.
Abstract:
A non-volatile memory device includes a first select transistor, a second select transistor, and a first string of first memory cells provided between the first and second select transistors. Each first memory cell has a first resistive memory cell and a first transistor. The first resistive memory cell is in series with a gate of the first transistor. The non-volatile memory device further includes a first bit line coupled to a drain of the first select transistor and a plurality of word lines. Each word line is coupled to one of the first memory cells.
Abstract:
Providing for a serial array memory transistor architecture that achieves high read speeds compared with conventional serial array memory is described herein. By way of example, the serial array memory can be connected to and can drive a gate voltage of a small capacitance pass transistor, to facilitate sensing memory transistors of the serial array. The pass transistor modulates current flow or voltage at an adjacent metal bitline, which can be utilized to sense a program or erase state(s) of the memory transistors. Due to the small capacitance of the pass transistor, read latency for the serial array can be significantly lower than conventional serial array memory (e.g., NAND memory). Further, various mechanisms for forming an amplifier region of the serial array memory comprising discrete pass transistor are described to facilitate efficient fabrication of the serial array memory transistor architecture.
Abstract:
A system comprising a program component that programs one or more non-volatile memory (“NVM”) cells of an array of pairs of NVM cells using FN tunneling, an erase component that erases the one or more NVM cells of the array of pairs of NVM cells using FN tunneling, and a read component that reads the one or more NVM cells of the array of pairs of NVM cells.