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公开(公告)号：US11864350B2
公开(公告)日：2024-01-02
申请号：US17631256
申请日：2020-07-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
CPC classification number: H05K7/20336 , H05K5/0017 , H05K7/2099
Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
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公开(公告)号：US20220279683A1
公开(公告)日：2022-09-01
申请号：US17631256
申请日：2020-07-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
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公开(公告)号：US20210388849A1
公开(公告)日：2021-12-16
申请号：US17408278
申请日：2021-08-20
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianliang Wang , Liujun Zou , Jian Shi , Zhiguo Zhang
Abstract: A centrifugal fan is disclosed. The centrifugal fan includes a housing, and the housing is configured to accommodate an impeller. The impeller rotates relative to the housing. A flow channel that cooperates with the impeller is disposed in the housing. The flow channel includes a pressurization area. In the pressurization area, a static pressure and a flow velocity of an air flow are gradually increased along a rotation direction of the impeller. However, an air inlet is disposed on the housing, and there is a specific gap between the impeller and the air inlet. As a result, when air flows through the pressurization area, there is a specific amount of leakage through the gap. Therefore, an air baffle ring is disposed in the centrifugal fan provided in this application.
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公开(公告)号：US20240164053A1
公开(公告)日：2024-05-16
申请号：US18422847
申请日：2024-01-25
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianliang Wang , Dzmitry Kushner , Jiyang Li , Shuqin Xie , Along Zhou , Jian Shi , Shoubiao Xu
CPC classification number: H05K7/20254 , G06F1/203 , H05K7/20263
Abstract: A liquid cooling plate includes a housing, a support structure, and a coolant. The housing includes a top wall and a bottom wall, the top wall and the bottom wall are covered to form an accommodation cavity, and the accommodation cavity includes a first region and a second region. The support structure is disposed in the first region and is located between the top wall and the bottom wall. The coolant flows in the accommodation cavity to dissipate heat from a heat generating device, the coolant can expand in volume when being heated and shrink in volume when being cooled, and the second region can deform to absorb a volume variation of the coolant.
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公开(公告)号：US20130299125A1
公开(公告)日：2013-11-14
申请号：US13667462
申请日：2012-11-02
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jian Shi , Stephen Haworth , Yi Zhang
IPC: F28F9/00
CPC classification number: H01L23/467 , H01L23/3672 , H01L2924/0002 , H04B1/036 , H01L2924/00
Abstract: At least one heat generating radio unit in an active antenna system unit, the cooling system comprising at least one fan and an air duct, where each heat generating radio unit to be cooled by the cooling system is arranged connected to a heat sink unit comprising cooling fins, the heat sink unit being arranged to transfer heat between the radio unit and the ambient air, where the at least one fan is arranged to generate a primary air flow of ambient air in the air duct between at least one air duct inlet and at least one air duct outlet, where the air duct is arranged to extend in the longitudinal direction (A) of the active antenna system unit along each of the said heat sink units and to border on each of the said heat sink units.
Abstract translation: 在有源天线系统单元中的至少一个发热无线电单元，所述冷却系统包括至少一个风扇和风道，其中要由所述冷却系统冷却的每个发热无线电单元布置成连接到散热单元，所述散热单元包括冷却 所述散热单元被布置成在所述无线电单元和所述环境空气之间传递热量，其中所述至少一个风扇被布置成在至少一个空气通道入口和在至少一个空气通道入口之间的空气管道中产生环境空气的一次空气流 至少一个空气管道出口，其中空气管道布置成沿着每个所述散热器单元沿有源天线系统单元的纵向方向（A）延伸并且在每个所述散热器单元上边界。
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Patent Agency Ranking
6.发明申请LIQUID COOLING SYSTEM AND METHOD FOR COOLING AT LEAST ONE HEAT GENERATING COMPONENT 审中-公开用于冷却至少一个发热组件的液体冷却系统和方法公开(公告)号：US20130199208A1
公开(公告)日：2013-08-08
申请号：US13705967
申请日：2012-12-05
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jian Shi , Vadim Tsoi
IPC: F25B21/02
CPC classification number: F25B21/02 , F25B2321/0252 , F25B2400/04 , H01L23/473 , H01L2924/0002 , H05K7/20218 , H01L2924/00
Abstract: A liquid cooling system for cooling at least one heat generating component, comprises a liquid loop in which liquid is arranged to be circulated, and arranged to be cooled by a first stage cooling unit, where the cold side of at least one Thermo Electric Cooling unit is arranged at a position situated downstream of the first stage cooling unit and upstream of the at least one heat generating component to be cooled by liquid, where the at least one Thermo Electric Cooling unit is arranged in its operative state to cool the liquid in order to provide for further cooling power when the cooling power of the first stage cooling unit is not sufficient.
Abstract translation: 一种用于冷却至少一个发热部件的液体冷却系统，包括液体循环，液体被布置成循环，并且被布置成被第一级冷却单元冷却，其中至少一个热电冷却单元 布置在位于第一级冷却单元下游的位置，并且至少一个发热部件的上游将由液体冷却，其中至少一个热电冷却单元布置在其操作状态以依次冷却液体 以在第一级冷却单元的冷却功率不足时提供进一步的冷却功率。
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公开(公告)号：US12117871B2
公开(公告)日：2024-10-15
申请号：US17954203
申请日：2022-09-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhi Yuan , Jian Shi , Hanru Yu , Linfang Jin
CPC classification number: G06F1/1652 , G06F1/203
Abstract: Example mobile terminals are disclosed. One example terminal includes a rotating member, a flexible screen, a bending support part, and a temperature equalization plate. The flexible screen includes two unfolded regions and a bent region that is disposed opposite to the rotating member. The bending support part is located between the flexible screen and the rotating member. The temperature equalization plate is configured to balance temperatures in the two unfolded regions and includes two temperature equalization parts opposite to the two unfolded regions in a one-to-one correspondence and a flexible connection part that connects the two temperature equalization parts. The flexible connection part is located on a side of the bending support part and away from the flexible screen.
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公开(公告)号：US11719256B2
公开(公告)日：2023-08-08
申请号：US17408278
申请日：2021-08-20
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianliang Wang , Liujun Zou , Jian Shi , Zhiguo Zhang
CPC classification number: F04D29/441 , F04D17/16 , F04D29/4226 , G06F1/203
Abstract: A centrifugal fan includes a housing configured to accommodate an impeller. The impeller rotates relative to the housing. A flow channel that cooperates with the impeller is disposed in the housing. The flow channel includes a pressurization area, in which a static pressure and a flow velocity of an air flow are gradually increased along a rotation direction of the impeller. However, an air inlet is disposed on the housing, and there is a specific gap between the impeller and the air inlet. As a result, when air flows through the pressurization area, there is a specific amount of leakage through the gap. Therefore, an air baffle ring is disposed in the centrifugal fan provided in this application.
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公开(公告)号：US11665816B2
公开(公告)日：2023-05-30
申请号：US17598530
申请日：2020-03-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
CPC classification number: H05K1/0272 , H05K1/0203 , H05K1/0219 , H05K3/4644 , H05K2201/064 , H05K2201/10121
Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
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公开(公告)号：US20240164056A1
公开(公告)日：2024-05-16
申请号：US18550265
申请日：2022-03-11
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huipeng Wu , Xinpei Huang , Tao Liu , Along Zhou , Jian Shi
CPC classification number: H05K7/20272 , G06F1/203 , H05K7/20254
Abstract: This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.
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