GAS COLLECTION APPARATUS
    1.
    发明公开

    公开(公告)号:US20240164056A1

    公开(公告)日:2024-05-16

    申请号:US18550265

    申请日:2022-03-11

    IPC分类号: H05K7/20 G06F1/20

    摘要: This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.

    FILM-LIKE HEAT DISSIPATION MEMBER, BENDABLE DISPLAY APPARATUS, AND TERMINAL DEVICE

    公开(公告)号:US20200245501A1

    公开(公告)日:2020-07-30

    申请号:US16851337

    申请日:2020-04-17

    IPC分类号: H05K7/20 F28F3/02 G09F9/30

    摘要: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

    Film-like heat dissipation member, bendable display apparatus, and terminal device

    公开(公告)号:US11406044B2

    公开(公告)日:2022-08-02

    申请号:US16851337

    申请日:2020-04-17

    IPC分类号: H05K7/20 F28F3/02 G09F9/30

    摘要: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.