GAS COLLECTION APPARATUS
    2.
    发明公开

    公开(公告)号:US20240164056A1

    公开(公告)日:2024-05-16

    申请号:US18550265

    申请日:2022-03-11

    CPC classification number: H05K7/20272 G06F1/203 H05K7/20254

    Abstract: This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.

    Heat Dissipation System and Electronic Device

    公开(公告)号:US20240389264A1

    公开(公告)日:2024-11-21

    申请号:US18564897

    申请日:2022-05-26

    Abstract: A heat dissipation system includes a first heat dissipation panel, a second heat dissipation panel, a first rotating shaft assembly, a second rotating shaft assembly, and a driving apparatus. The first heat dissipation panel is provided with a first liquid channel, and the first liquid channel includes a first interface and a second interface. The second heat dissipation panel is provided with a second liquid channel, and the second liquid channel includes a third interface and a fourth interface. The first interface is in communication with the third interface through the first rotating shaft assembly, and the second interface is in communication with the fourth interface through the second rotating shaft assembly. The driving apparatus is configured to drive a liquid medium to flow between the first heat dissipation panel and the second heat dissipation panel.

    Camera assembly and electronic device

    公开(公告)号:US12085840B2

    公开(公告)日:2024-09-10

    申请号:US17871533

    申请日:2022-07-22

    CPC classification number: G03B17/55 G03B30/00 H04N23/52 H04N23/54 H04N23/55

    Abstract: A camera assembly is provided. The camera assembly includes an auxiliary mount, a rotatable camera module and a flexible heat conducting assembly, the rotatable camera module includes a rotatable mount and a camera function group disposed on the rotatable mount, the rotatable mount is rotatably connected to the auxiliary mount, the flexible heat conducting assembly is fixedly connected to one end of the camera function group, and the flexible heat conducting assembly is further configured to be connected to a non-rotatable camera module component, so that heat generated by the camera function group is transferred to the non-rotatable camera module component. A flexible heat conducting assembly performs a cross-region transfer of heat generated by the rotatable camera module, to help reduce an ambient temperature of the rotatable camera module, so as to improve photography quality of the camera module, and prolong a photography time period of the rotatable camera module.

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