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公开(公告)号:US20240164053A1
公开(公告)日:2024-05-16
申请号:US18422847
申请日:2024-01-25
Applicant: Huawei Technologies Co., Ltd.
Inventor: Jianliang Wang , Dzmitry Kushner , Jiyang Li , Shuqin Xie , Along Zhou , Jian Shi , Shoubiao Xu
CPC classification number: H05K7/20254 , G06F1/203 , H05K7/20263
Abstract: A liquid cooling plate includes a housing, a support structure, and a coolant. The housing includes a top wall and a bottom wall, the top wall and the bottom wall are covered to form an accommodation cavity, and the accommodation cavity includes a first region and a second region. The support structure is disposed in the first region and is located between the top wall and the bottom wall. The coolant flows in the accommodation cavity to dissipate heat from a heat generating device, the coolant can expand in volume when being heated and shrink in volume when being cooled, and the second region can deform to absorb a volume variation of the coolant.
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公开(公告)号:US20240206126A1
公开(公告)日:2024-06-20
申请号:US18538908
申请日:2023-12-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Dzmitry Kushner , Christoffer Jarpner , Vadim Tsoi , Fredrik Ohlsson , Ying Dong , Marcus Lundh
IPC: H05K7/20
CPC classification number: H05K7/2039 , H05K7/20327
Abstract: An apparatus for transferring heat from a heat source to air, comprising a heat sink with a plurality of fins. A fin of the plurality of fins is configured as follows: the fin comprises a conduit arrangement for a heat-carrying fluid; in a boiling region of the fin, the conduit arrangement comprises a vapour guiding path; and in the boiling region, the conduit arrangement comprises one or more boiling chambers. Each of the one or more boiling chambers has an outer boundary. The respective boiling chamber is located within a chamber region defined by an imaginary quadrilateral having four sides and four vertices. By means of the arrangement and configuration of the boiling chambers and/or of the vapour guiding path, the heat transfer efficiency of the fin is improved.
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