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公开(公告)号：US10130005B2
公开(公告)日：2018-11-13
申请号：US15507597
申请日：2014-08-29
Applicant: Huawei Technologies Co., Ltd.
Inventor： Lei Zhong , Linfang Jin , Jie Zou , Nanbo Kang
Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.
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公开(公告)号：US11789504B2
公开(公告)日：2023-10-17
申请号：US17474564
申请日：2021-09-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Xiaowei Hui , Xiangyang Yang , Shaoxin Zhou
CPC classification number: G06F1/20 , F28D15/0275 , G06F1/203 , H05K7/2039 , H05K7/20336
Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).
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公开(公告)号：US11122710B2
公开(公告)日：2021-09-14
申请号：US16925433
申请日：2020-07-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Guo Yang , Shuainan Lin
IPC: H05K7/20
Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
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公开(公告)号：US20200344915A1
公开(公告)日：2020-10-29
申请号：US16925433
申请日：2020-07-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Guo Yang , Shuainan Lin
IPC: H05K7/20
Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.
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公开(公告)号：US20190391623A1
公开(公告)日：2019-12-26
申请号：US16490822
申请日：2017-07-31
Applicant: Huawei Technologies Co., Ltd.
Inventor： Huawen Jiang , Linfang Jin
Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.
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Patent Agency Ranking
公开(公告)号：US20190354147A1
公开(公告)日：2019-11-21
申请号：US16529075
申请日：2019-08-01
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Xiaowei Hui , Xiangyang Yang , Shaoxin Zhou
Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.
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公开(公告)号：US11864350B2
公开(公告)日：2024-01-02
申请号：US17631256
申请日：2020-07-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
CPC classification number: H05K7/20336 , H05K5/0017 , H05K7/2099
Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
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公开(公告)号：US20220279683A1
公开(公告)日：2022-09-01
申请号：US17631256
申请日：2020-07-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
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公开(公告)号：US20220004235A1
公开(公告)日：2022-01-06
申请号：US17474564
申请日：2021-09-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Xiaowei Hui , Xiangyang Yang , Shaoxin Zhou
Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).
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公开(公告)号：US20210392782A1
公开(公告)日：2021-12-16
申请号：US17284381
申请日：2019-09-25
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongwang Xiao , Linfang Jin , Hualin Li , Naixiang Xu , Guoping Wang
IPC: H05K7/20
Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly. The first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.
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