公开(公告)号：US11144101B2

公开(公告)日：2021-10-12

申请号：US16529075

申请日：2019-08-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

公开(公告)号：US20170102745A1

公开(公告)日：2017-04-13

申请号：US15311927

申请日：2014-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0275 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2039

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

公开(公告)号：US11789504B2

公开(公告)日：2023-10-17

申请号：US17474564

申请日：2021-09-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0275 ,  G06F1/203 ,  H05K7/2039 ,  H05K7/20336

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

公开(公告)号：US20190354147A1

公开(公告)日：2019-11-21

申请号：US16529075

申请日：2019-08-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

公开(公告)号：US20220004235A1

公开(公告)日：2022-01-06

申请号：US17474564

申请日：2021-09-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (° C./W).

公开(公告)号：US10409340B2

公开(公告)日：2019-09-10

申请号：US15311927

申请日：2014-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  F28D15/02 ,  H05K7/20

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.