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公开(公告)号：US10130005B2
公开(公告)日：2018-11-13
申请号：US15507597
申请日：2014-08-29
Applicant: Huawei Technologies Co., Ltd.
Inventor： Lei Zhong , Linfang Jin , Jie Zou , Nanbo Kang
Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.
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Patent Agency Ranking
公开(公告)号：US10602603B2
公开(公告)日：2020-03-24
申请号：US15578992
申请日：2015-06-04
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhiguo Zhang , Yingchun Zhang , Haitao Zhen , Nanbo Kang
Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
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公开(公告)号：US10088879B2
公开(公告)日：2018-10-02
申请号：US15508890
申请日：2014-06-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Linfang Jin , Nanbo Kang , Jie Zou , Xiaowei Hui
IPC: G06F1/20 , F28D15/02 , H01L23/427 , F28D15/04
Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.
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公开(公告)号：US20170290197A1
公开(公告)日：2017-10-05
申请号：US15507597
申请日：2014-08-29
Applicant: Huawei Technologies Co., Ltd.
Inventor： Lei Zhong , Linfang Jin , Jie Zou , Nanbo Kang
CPC classification number: H05K7/20172 , H01C7/008 , H01H15/005 , H01H23/164 , H05K1/181 , H05K5/0213 , H05K7/1427 , H05K7/20181 , H05K7/20209 , H05K2201/10053 , H05K2201/10196
Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.
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公开(公告)号：US11051393B2
公开(公告)日：2021-06-29
申请号：US16807522
申请日：2020-03-03
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhiguo Zhang , Yingchun Zhang , Haitao Zhen , Nanbo Kang
Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
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公开(公告)号：US20180146539A1
公开(公告)日：2018-05-24
申请号：US15578992
申请日：2015-06-04
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhiguo Zhang , Yingchun Zhang , Haitao Zhen , Nanbo Kang
Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
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