Wireless charging device
    1.
    发明授权

    公开(公告)号:US11778772B2

    公开(公告)日:2023-10-03

    申请号:US17859259

    申请日:2022-07-07

    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

    Wireless charging device
    2.
    发明授权

    公开(公告)号:US11419238B2

    公开(公告)日:2022-08-16

    申请号:US16759890

    申请日:2018-10-27

    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

    Heat dissipation structure for electronic device and electronic device

    公开(公告)号:US11122710B2

    公开(公告)日:2021-09-14

    申请号:US16925433

    申请日:2020-07-10

    Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

    Heat Dissipation Structure for Electronic Device and Electronic Device

    公开(公告)号:US20200344915A1

    公开(公告)日:2020-10-29

    申请号:US16925433

    申请日:2020-07-10

    Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

    WIRELESS CHARGING DEVICE
    5.
    发明申请

    公开(公告)号:US20210185854A1

    公开(公告)日:2021-06-17

    申请号:US16759890

    申请日:2018-10-27

    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

    Heat dissipation structure for electronic device and electronic device

    公开(公告)号:US10729036B2

    公开(公告)日:2020-07-28

    申请号:US16337052

    申请日:2017-09-27

    Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

    Heat Dissipation Apparatus
    7.
    发明申请

    公开(公告)号:US20170314877A1

    公开(公告)日:2017-11-02

    申请号:US15651873

    申请日:2017-07-17

    Abstract: A heat dissipation apparatus, including a base plate, a guide fin group, and a heat dissipation fin group, where the guide fin group is formed on a surface of the base plate, the guide fin group is disposed with at least two guide fins that are disposed at an interval, and the at least two guide fins extend along a surface of the base plate from an edge of the base plate, and a flow path for flowing of an airflow is formed between two adjacent guide fins, and the heat dissipation fin group includes at least one heat dissipation fin, where the at least one heat dissipation fin is fixedly connected to the top of the at least two guide fins to dissipate heat of the at least two guide fins. The heat dissipation apparatus further includes, guide fins and a stopper fin.

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