MASK BLANK SUBSTRATE, SUBSTRATE WITH MULTILAYER REFLECTIVE FILM, REFLECTIVE MASK BLANK, REFLECTIVE MASK, METHOD OF MANUFACTURING MASK BLANK SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    7.
    发明申请
    MASK BLANK SUBSTRATE, SUBSTRATE WITH MULTILAYER REFLECTIVE FILM, REFLECTIVE MASK BLANK, REFLECTIVE MASK, METHOD OF MANUFACTURING MASK BLANK SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    掩模基板,具有多层反射膜的基板,反射掩模布,反射掩模,制造掩模基板的方法,用反射膜制造基板的方法和制造半导体器件的方法

    公开(公告)号:US20150331312A1

    公开(公告)日:2015-11-19

    申请号:US14655190

    申请日:2013-12-27

    CPC classification number: G03F1/60 G03F1/24 G03F1/80 G03F1/84 G03F7/20 G03F7/2004

    Abstract: An object of the present invention is to provide a mask blank substrate and the like that enables critical defects to be reliably detected as a result of reducing the number of detected defects, including pseudo defects, even when using highly sensitive defect inspection apparatuses that use light of various wavelengths. The present invention relates to a mask blank substrate that is used in lithography, wherein the power spectral density at a spatial frequency of 1×10−2 μm−1 to 1 μm−1, obtained by measuring a 0.14 mm×0.1 mm region on a main surface of the mask blank substrate on the side of which a transfer pattern is formed at 640×480 pixels with a white-light interferometer, is not more than 4×106 nm4, and the power spectral density at a spatial frequency of not less than 1 μm−1, obtained by measuring a 1 μm×1 μm region on the main surface with an atomic force microscope, is not more than 10 nm4.

    Abstract translation: 本发明的目的是提供一种掩模板基板等,即使使用使用光的高灵敏度缺陷检查装置,由于减少包括伪缺陷在内的检测缺陷的数量,能够可靠地检测临界缺陷 的各种波长。 本发明涉及一种用于光刻的掩模坯料基板,其中通过测量0.14mm×0.1mm的区域得到的空间频率为1×10 -2μm-1 -1μm-1的功率谱密度 用白光干涉仪在640×480像素上形成转印图案的掩模坯料基板的主表面不大于4×106nm 4,空间频率处的功率谱密度不为 通过用原子力显微镜测量主表面上的1μm×1μm的区域获得的小于1μm的不超过10nm 4。

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