Fluidic die assemblies with rigid bent substrates

    公开(公告)号:US11548287B2

    公开(公告)日:2023-01-10

    申请号:US17251263

    申请日:2018-11-14

    Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.

    ARRAY DROPLET MANIPULATIONS
    7.
    发明申请

    公开(公告)号:US20220410163A1

    公开(公告)日:2022-12-29

    申请号:US17778517

    申请日:2019-12-09

    Abstract: In one example an apparatus can include a controller communicatively coupled to a droplet dispenser to deposit fluid on a digital microfluidic (DMF) array including a plurality of droplet manipulation electrodes, the controller to: select a first droplet manipulation electrode from the plurality of droplet manipulation electrodes to on which to dispense a first volume of fluid via the droplet dispenser; position the droplet dispenser over the selected first droplet manipulation electrode; and deposit the first volume of fluid onto the selected first droplet manipulation electrode.

    Logic circuitry package
    8.
    发明授权

    公开(公告)号:US11407228B2

    公开(公告)日:2022-08-09

    申请号:US16768321

    申请日:2019-10-25

    Abstract: A logic circuitry package for a replaceable print apparatus component includes an I2C interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to respond to communications over the I2C interface that are directed to an initial or reconfigured I2C address. The at least one logic circuit is configured to receive, via the I2C interface, a write command to a first memory address of the logic circuit to initiate a first function of the logic circuit. The at least one logic circuit is configured to generate first data in response to the first function. The at least one logic circuit is configured to receive, via the I2C interface, a first read command to a second memory address of the logic circuit. The at least one logic circuit is configured to transmit, via the I2C interface, the first data in response to the first read command to the second memory address.

    Fluid sensing
    10.
    发明授权

    公开(公告)号:US11366000B2

    公开(公告)日:2022-06-21

    申请号:US16929576

    申请日:2020-07-15

    Abstract: In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip. The temperature sensors output signals indicative of dissipation of heat from the heaters to indicate a level of the liquid in the volume.

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