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公开(公告)号:US11975468B2
公开(公告)日:2024-05-07
申请号:US17312349
申请日:2019-07-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Si-lam J. Choy , Michael W. Cumbie
CPC classification number: B29C45/14508 , B29C45/14065 , B29C45/322 , B41J2/1601 , B41J2/1637 , B29K2063/00 , B29K2995/0012 , B29L2031/767
Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.
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公开(公告)号:US20240116055A1
公开(公告)日:2024-04-11
申请号:US17960942
申请日:2022-10-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , Chien-Hua Chen , Viktor Shkolnikov
CPC classification number: B01L3/502792 , B01L3/502715 , B01L3/50273 , C12M23/16 , B01L2200/027 , B01L2300/0645 , B01L2300/0816 , B01L2300/161 , B01L2300/165 , B01L2400/0427
Abstract: An example digital microfluidic device can include a hydrophobic electrowetting surface including an array of electrodes. The individual electrodes can have a shape with three or more sides. The array of electrodes can include a parking electrode and an adjacent electrode that is adjacent to the parking electrode. A cover can be positioned over the electrowetting surface at a gap distance sufficient to accommodate a liquid droplet between the cover and the electrowetting surface. A plurality of droplet barriers can be positioned on three or more sides of the parking electrode. The droplet barriers can constrain movement of a liquid droplet from the parking electrode to the adjacent electrode.
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公开(公告)号:US11904312B2
公开(公告)日:2024-02-20
申请号:US16643264
申请日:2017-11-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Hilary Ely , Adam Higgins , Rachel M. White , Erik D. Torniainen , Tod Woodford , Michael W. Cumbie , Chien-Hua Chen
CPC classification number: B01L3/502715 , B01L3/50273 , B01L3/502723 , B01L2300/041 , B01L2300/048 , B01L2300/06 , B01L2300/0627 , B01L2300/0654 , B01L2300/0681 , B01L2300/0819 , B01L2300/12 , B01L2300/18 , B01L2400/0406 , B81B1/00
Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.
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公开(公告)号:US11642884B2
公开(公告)日:2023-05-09
申请号:US16766525
申请日:2019-02-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , Scott A. Linn , Anthony M. Fuller , James Michael Gardner
IPC: B41J2/14
CPC classification number: B41J2/14072 , B41J2/14056 , B41J2002/14491 , B41J2202/13
Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.
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公开(公告)号:US20230018474A1
公开(公告)日:2023-01-19
申请号:US17951929
申请日:2022-09-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , James Michael Gardner , Scott A. Linn , George H. Corrigan, III
Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
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公开(公告)号:US11548287B2
公开(公告)日:2023-01-10
申请号:US17251263
申请日:2018-11-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie
Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.
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公开(公告)号:US20220410163A1
公开(公告)日:2022-12-29
申请号:US17778517
申请日:2019-12-09
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Viktor Shkolnikov , Chien-Hua Chen
IPC: B01L3/00
Abstract: In one example an apparatus can include a controller communicatively coupled to a droplet dispenser to deposit fluid on a digital microfluidic (DMF) array including a plurality of droplet manipulation electrodes, the controller to: select a first droplet manipulation electrode from the plurality of droplet manipulation electrodes to on which to dispense a first volume of fluid via the droplet dispenser; position the droplet dispenser over the selected first droplet manipulation electrode; and deposit the first volume of fluid onto the selected first droplet manipulation electrode.
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公开(公告)号:US11407228B2
公开(公告)日:2022-08-09
申请号:US16768321
申请日:2019-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Scott A. Linn , Michael W. Cumbie , James Michael Gardner
IPC: B41J2/175 , B41J2/045 , G06F13/42 , G06F21/44 , G06F1/12 , G06F1/08 , H03K19/0175 , B33Y30/00 , B29C64/259 , G06F3/12 , G01F23/24 , G01F23/80
Abstract: A logic circuitry package for a replaceable print apparatus component includes an I2C interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to respond to communications over the I2C interface that are directed to an initial or reconfigured I2C address. The at least one logic circuit is configured to receive, via the I2C interface, a write command to a first memory address of the logic circuit to initiate a first function of the logic circuit. The at least one logic circuit is configured to generate first data in response to the first function. The at least one logic circuit is configured to receive, via the I2C interface, a first read command to a second memory address of the logic circuit. The at least one logic circuit is configured to transmit, via the I2C interface, the first data in response to the first read command to the second memory address.
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公开(公告)号:US11383230B2
公开(公告)日:2022-07-12
申请号:US16085253
申请日:2016-03-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Jeffrey A. Nielsen , Michael W. Cumbie , Devin Alexander Mourey , Silam J. Choy , Kenneth Ward , Christie Dudenhoefer
IPC: B01L3/02
Abstract: A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.
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公开(公告)号:US11366000B2
公开(公告)日:2022-06-21
申请号:US16929576
申请日:2020-07-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Robert N. K. Browning
Abstract: In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip. The temperature sensors output signals indicative of dissipation of heat from the heaters to indicate a level of the liquid in the volume.
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