公开(公告)号：US20240351274A1

公开(公告)日：2024-10-24

申请号：US18751092

申请日：2024-06-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jarrid A. Wittkopf ,  Kristopher J. Erickson ,  Lihua Zhao

IPC: B29C64/165 ,  B29C35/08 ,  B29C70/88 ,  B29K105/16 ,  B29K505/00 ,  B29L31/34 ,  B33Y10/00 ,  B33Y70/00 ,  H01C17/065

CPC classification number: B29C64/165 ,  B29C70/882 ,  B33Y10/00 ,  B33Y70/00 ,  H01C17/06526 ,  B29C2035/0827 ,  B29C2795/005 ,  B29K2105/162 ,  B29K2505/00 ,  B29K2995/0005 ,  B29K2995/0006 ,  B29K2995/0007 ,  B29L2031/3406 ,  B29L2031/3487

Abstract: In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.

公开(公告)号：US12005641B2

公开(公告)日：2024-06-11

申请号：US17857362

申请日：2022-07-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony

IPC: B29C64/165 ,  B22F1/054 ,  B22F10/14 ,  B28B1/00 ,  B33Y10/00 ,  B33Y70/00 ,  C04B35/622 ,  C04B35/634 ,  C04B35/64

CPC classification number: B29C64/165 ,  B22F1/054 ,  B22F10/14 ,  B28B1/001 ,  B33Y10/00 ,  B33Y70/00 ,  C04B35/62218 ,  C04B35/634 ,  C04B35/64 ,  B22F2304/05 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3218 ,  C04B2235/3225 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3272 ,  C04B2235/3284 ,  C04B2235/3286 ,  C04B2235/3293 ,  C04B2235/3418 ,  C04B2235/3826 ,  C04B2235/3847 ,  C04B2235/3865 ,  C04B2235/3873 ,  C04B2235/422 ,  C04B2235/442 ,  C04B2235/5454 ,  C04B2235/6026 ,  C04B2235/667 ,  B22F2998/10 ,  B22F10/14 ,  B22F3/02

Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.

公开(公告)号：US11981084B2

公开(公告)日：2024-05-14

申请号：US17414543

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: B29C64/393 ,  B29C64/379 ,  B29C64/386 ,  G06Q10/0635 ,  G06Q10/0639 ,  G06Q10/20 ,  G06Q50/04 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y80/00

CPC classification number: B29C64/386 ,  B29C64/379 ,  G06Q10/0635 ,  G06Q10/0639 ,  G06Q10/20 ,  G06Q50/04 ,  B33Y50/00 ,  B33Y50/02 ,  B33Y80/00 ,  Y02P90/02 ,  Y02P90/30

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier from a storage element associated with a part. An extractor of the system extracts, based on the identifier, lifecycle conditions specific to the part. A controller of the system alters manufacturing operations based on extracted lifecycle conditions for the part.

公开(公告)号：US20240100597A1

公开(公告)日：2024-03-28

申请号：US18534610

申请日：2023-12-09

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John Samuel Dilip Jangam ,  Thomas Anthony ,  Krzysztof Nauka ,  Kristopher J. Erickson

IPC: B22F10/14 ,  B22F1/05 ,  B22F1/142 ,  B22F9/04 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y70/10

CPC classification number: B22F10/14 ,  B22F1/05 ,  B22F1/142 ,  B22F9/04 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y70/10 ,  B29C64/165

Abstract: A powder bed material can include from 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 μm to 150 μm. From 10 wt % to 100 wt % of the metal particles can be surface-activated metal particles having in intact inner volume and an outer volume with structural defects. The structural defects can exhibit an average surface grain density of 50,000 to 5,000,000 per mm2.

公开(公告)号：US11887177B2

公开(公告)日：2024-01-30

申请号：US17414507

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: G06Q30/00 ,  G06Q30/0601 ,  G06K7/10 ,  G06Q10/20

CPC classification number: G06Q30/0633 ,  G06K7/10297 ,  G06Q10/20 ,  G06Q30/0641

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, sensor output data for the part. A transmitter of the system transmits a re-order request for the part based on the sensor output data.

公开(公告)号：US20230191696A1

公开(公告)日：2023-06-22

申请号：US18108609

申请日：2023-02-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof Nauka ,  Kristopher J. Erickson ,  Howard S. Tom ,  Lihua Zhao

IPC: B29C64/165 ,  B33Y10/00 ,  B29C64/291 ,  B29C64/336 ,  C04B35/636 ,  C04B35/634 ,  B33Y40/20 ,  B33Y70/10 ,  B22F10/16 ,  B33Y50/02 ,  B28B1/00

CPC classification number: B29C64/165 ,  B33Y10/00 ,  B29C64/291 ,  B29C64/336 ,  C04B35/636 ,  C04B35/634 ,  C04B35/63432 ,  C04B35/63468 ,  C04B35/63408 ,  C04B35/63444 ,  C04B35/63488 ,  B33Y40/20 ,  B33Y70/10 ,  B22F10/16 ,  B33Y50/02 ,  B28B1/001 ,  C04B2235/6026

Abstract: According to an example, a composition may include a high melt temperature build material in the form of a powder; a first low melt temperature binder in the form of a powder; and a second low melt temperature binder in the form of a powder; and in which the first low melt temperature binder melts at a temperature that is different from the second low melt temperature binder.

公开(公告)号：US20220331867A1

公开(公告)日：2022-10-20

申请号：US17857362

申请日：2022-07-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony

IPC: B22F10/14 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/165 ,  B28B1/00 ,  C04B35/622 ,  C04B35/634 ,  C04B35/64 ,  B22F1/054

Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.

公开(公告)号：US20220234289A1

公开(公告)日：2022-07-28

申请号：US17417130

申请日：2019-07-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： William J. Allen ,  Melanie Martin Citta ,  John C. Greeven ,  Kristopher J. Erickson ,  Jarrid Wittkopf ,  Temiloluwa Adegoke

IPC: B29C64/188 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29C64/165

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form 1) a three-dimensional (3D) printed object and a container structure to form part of the 3D printed object. The container structure expels a payload when a predetermined condition is met. The additive manufacturing system also includes a payload distributor to place the payload in the container structure. A controller of the additive manufacturing system controls formation of the 3D printed object and the container structure.

公开(公告)号：US11338510B2

公开(公告)日：2022-05-24

申请号：US16606285

申请日：2018-06-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Krzysztof Nauka ,  Thomas Anthony ,  Kristopher J. Erickson

IPC: B29C64/218 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B29C64/321 ,  B29C64/295 ,  B29C64/393 ,  B29C64/241

Abstract: A three-dimensional (3D) printing device includes a first cylinder. The first cylinder may include a first plurality of holes defined therein. The 3D printing device may include a second cylinder interior and coaxial to the first cylinder that includes a second plurality of holes open to an interior of the first cylinder. The 3D printing device may also include a third cylinder interior to the first cylinder and exterior to the second cylinder, the third cylinder including a longitudinal cutout open to the first cylinder. The 3D printing device may include a supply tube open to the second cylinder, the supply tube to provide an amount of build material to an interior portion of the second cylinder.

公开(公告)号：US11338363B2

公开(公告)日：2022-05-24

申请号：US16077330

申请日：2017-06-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson

IPC: B22F1/10 ,  B22F10/10 ,  B22F12/20 ,  B22F12/90 ,  B22F1/054 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/10

Abstract: At a print temperature, a layer (having a predetermined height) of metal build material particles is formed. Also at the print temperature, a fluid containing metal nanoparticles is selectively applied to at least a portion of the layer, and at a fluid loading that wets the portion through the predetermined height without saturating the portion. The metal nanoparticles are exposed to a sintering temperature that is higher than the print temperature and at least 500° below a melting point of the metal build material particles using a predetermined number of heating events taking place at a predetermined speed or for a predetermined time, and separated by a predetermined delay time, to bind the metal build material particles together to form a bound layer. A build material surface is cooled to or below the print temperature. The forming, selectively applying, exposing, and cooling are repeated to form a part precursor.