公开(公告)号：US11969945B2

公开(公告)日：2024-04-30

申请号：US17414803

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: B29C64/379 ,  B29C64/393 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y50/02 ,  G06K19/06 ,  G06K19/07 ,  G06K19/077

CPC classification number: B29C64/379 ,  B29C64/393 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y50/02 ,  G06K19/0723 ,  G06K19/07758

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.

公开(公告)号：US20220134651A1

公开(公告)日：2022-05-05

申请号：US17416572

申请日：2019-07-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： William J. Allen ,  Melanie Martin Citta ,  John C. Greeven ,  Kristopher J. Erickson ,  Jarrid Wittkopf ,  Temiloluwa Adegoke

IPC: B29C64/188 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29C64/165

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a placement device to embed at least a portion of a container structure into the 3D printed object. The container structure expels a payload when a predetermined condition is met. A controller of the additive manufacturing system controls additive manufacturing and placement of the portion of the container structure.

公开(公告)号：US20220118707A1

公开(公告)日：2022-04-21

申请号：US17414532

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: B29C64/393 ,  B33Y10/00 ,  B33Y50/02 ,  G06K19/077 ,  G06K19/07

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a scanner to read three-dimensional (3D) print information from a storage element to be embedded in a 3D printed object. The system also includes a controller. The controller 1) instructs an additive manufacturing device to form the 3D printed object based on the 3D print information stored in the storage element and 2) embeds the storage element into the 3D printed object.

公开(公告)号：US11307683B2

公开(公告)日：2022-04-19

申请号：US16075637

申请日：2017-01-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jarrid Wittkopf ,  Robert Ionescu ,  Ning Ge ,  Helen A Holder

IPC: G06F3/041 ,  G06F3/044 ,  H03K17/96

Abstract: In an example implementation, a touch-sensitive illuminating display includes a transparent flexible touch layer, a transparent top conductive layer adjacent the flexible touch layer, a bottom conductive layer, and an electroluminescent layer and variable-thickness dielectric layer sandwiched between the top and bottom conductive layers. Pressure against the flexible touch layer is to reduce the dielectric layer thickness and bring the top and bottom conductive layers closer together, causing the electroluminescent layer to emit light where the pressure is applied.

公开(公告)号：US20220072773A1

公开(公告)日：2022-03-10

申请号：US17414175

申请日：2019-05-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Aja Hartman ,  Lihua Zhao

IPC: B29C64/194 ,  B29C64/153 ,  B29C64/295 ,  B29C64/205 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y40/00

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes a build material distributor to deposit layers of powdered build material onto a bed to form a three-dimensional (3D) printed object. The additive manufacturing system also includes a controller to interrupt printing of the 3D printed object and to resume printing of the 3D printed object. The additive manufacturing system also includes a heat source to, during an interruption in printing, maintain a temperature of a top surface of the powdered build material between a solidification temperature and a melting temperature for the build material.

公开(公告)号：US11834739B2

公开(公告)日：2023-12-05

申请号：US17047015

申请日：2018-06-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Robert Ionescu ,  Helen A Holder ,  Ning Ge ,  Jarrid Wittkopf

IPC: C23C16/04 ,  C01B32/186 ,  C23C16/26 ,  C23C16/30 ,  C23C16/48

CPC classification number: C23C16/047 ,  C01B32/186 ,  C23C16/26 ,  C23C16/305 ,  C23C16/483 ,  C23C16/487

Abstract: Graphene printing is disclosed. A disclosed example graphene printing apparatus includes a gas source to cause a graphene precursor gas to flow across a surface of a substrate, and a localized heat source to locally heat portions of the surface to cause graphene to grow at the portions of the surface based on a printing pattern.

公开(公告)号：US11685114B2

公开(公告)日：2023-06-27

申请号：US17258315

申请日：2019-01-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher Erickson ,  Jarrid Wittkopf ,  Lihua Zhao

IPC: B29C64/188 ,  B29C64/393 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/264 ,  B29C64/209 ,  B29L31/34

CPC classification number: B29C64/188 ,  B29C64/165 ,  B29C64/209 ,  B29C64/264 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29L2031/34

Abstract: Some examples include an additive manufacturing system including a processor and a memory to store instructions. The instructions cause the processor to generate print data from received data related to a three-dimensional build object. The generated print data includes defined print data to dispensing a first agent at a build area of a build material layer, defined print data to selectively dispensing a second agent at a component receiving area within the build area of the build material layer, the second agent to locally reduce a viscosity of the build material at the component receiving area to a viscous state, and defined print data to position a component within the component receiving area at a time of the component receiving area being in a viscous state.

公开(公告)号：US20220097307A1

公开(公告)日：2022-03-31

申请号：US17414677

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: B29C64/386 ,  B33Y30/00 ,  B33Y50/00

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device of the additive manufacturing system is to embed a sensing system into build material used to form the 3D printed object. The sensing system is to measure a manufacturing condition during formation of the 3D printed object. The additive manufacturing system also includes a controller to associate manufacturing condition with the 3D printed object.

公开(公告)号：US20220097306A1

公开(公告)日：2022-03-31

申请号：US17414543

申请日：2019-06-18

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Jarrid Wittkopf ,  Rafael Ballagas ,  David Wayne George ,  Lihua Zhao ,  William J. Allen

IPC: B29C64/386 ,  G06Q10/06 ,  B29C64/379 ,  G06Q10/00 ,  G06Q50/04

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier from a storage element associated with a part. An extractor of the system extracts, based on the identifier, lifecycle conditions specific to the part. A controller of the system alters manufacturing operations based on extracted lifecycle conditions for the part.

公开(公告)号：US20210331388A1

公开(公告)日：2021-10-28

申请号：US17258315

申请日：2019-01-15

Applicant: Hewlett- Packard Development Company, L.P.

Inventor： Kristopher Erickson ,  Jarrid Wittkopf ,  Lihua Zhao

IPC: B29C64/188 ,  B29C64/165 ,  B29C64/393 ,  B29C64/209 ,  B29C64/264 ,  B33Y50/02 ,  B33Y10/00 ,  B33Y30/00

Abstract: Some examples include an additive manufacturing system including a processor and a memory to store instructions. The instructions cause the processor to generate print data from received data related to a three-dimensional build object. The generated print data includes defined print data to dispensing a first agent at a build area of a build material layer, defined print data to selectively dispensing a second agent at a component receiving area within the build area of the build material layer, the second agent to locally reduce a viscosity of the build material at the component receiving area to a viscous state, and defined print data to position a component within the component receiving area at a time of the component receiving area being in a viscous state.