公开(公告)号：US20170343889A1

公开(公告)日：2017-11-30

申请号：US15675955

申请日：2017-08-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Peter Riel ,  Markus Rossi ,  Daniel Pérez Calero ,  Matthias Gloor ,  Moshe Doron ,  Dmitry Bakin ,  Philippe Bouchilloux

IPC: G03B21/14 ,  G02B7/02 ,  H01L33/58 ,  G02B7/00 ,  H01L33/48 ,  G03B21/20 ,  H01L27/146

CPC classification number: G03B21/142 ,  G02B7/003 ,  G02B7/02 ,  G03B21/2033 ,  H01L27/14618 ,  H01L33/483 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

公开(公告)号：US08606057B1

公开(公告)日：2013-12-10

申请号：US13685193

申请日：2012-11-26

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jukka Alasirnio ,  Philippe Bouchilloux ,  Susanne Westenhoefer ,  Jens Geiger

IPC: G02B6/12

CPC classification number: H05K3/4697 ,  H01L23/49833 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L31/0203 ,  H01L2224/04026 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/10121 ,  H05K2203/063 ,  H01L2224/83 ,  H01L2924/00

Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.

Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。

公开(公告)号：US10566363B2

公开(公告)日：2020-02-18

申请号：US15675955

申请日：2017-08-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Peter Riel ,  Markus Rossi ,  Daniel Pérez Calero ,  Matthias Gloor ,  Moshe Doron ,  Dmitry Bakin ,  Philippe Bouchilloux

IPC: H01L27/146 ,  G02B7/02 ,  H01L33/58 ,  H01L31/0232 ,  H01L33/48 ,  G02B7/00 ,  G03B21/14 ,  G03B21/20

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

公开(公告)号：US20160306265A1

公开(公告)日：2016-10-20

申请号：US14903217

申请日：2015-07-22

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Peter Riel ,  Markus Rossi ,  Daniel Pérez Calero ,  Matthias Gloor ,  Moshe Doron ,  Dmitry Bakin ,  Philippe Bouchilloux

IPC: G03B21/14 ,  G02B7/00 ,  G03B21/20

CPC classification number: G03B21/142 ,  G02B7/003 ,  G02B7/02 ,  G03B21/2033 ,  H01L27/14618 ,  H01L33/483 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract translation: 本公开描述了可以为诸如光发射器或光检测器的光电子器件提供超精密和稳定的封装的各种模块。 这些模块包括在模块制造期间可以根据需要加工的垂直对准特征，以在光电器件与设置在光电器件上的光学元件或光学组件之间建立精确的距离。

公开(公告)号：US09768361B2

公开(公告)日：2017-09-19

申请号：US14903217

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Peter Riel ,  Markus Rossi ,  Daniel Pérez Calero ,  Matthias Gloor ,  Moshe Doron ,  Dmitry Bakin ,  Philippe Bouchilloux

IPC: H01L33/48 ,  G02B7/02 ,  H01L33/58 ,  G02B7/00 ,  G03B21/14 ,  G03B21/20 ,  H01L27/146

CPC classification number: G03B21/142 ,  G02B7/003 ,  G02B7/02 ,  G03B21/2033 ,  H01L27/14618 ,  H01L33/483 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

公开(公告)号：US09383434B2

公开(公告)日：2016-07-05

申请号：US14503611

申请日：2014-10-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Philippe Bouchilloux

IPC: G01S3/786 ,  G01S7/481 ,  G06F3/01 ,  G01S17/46 ,  G01S17/87

CPC classification number: G01S7/4813 ,  G01S17/46 ,  G01S17/87 ,  G06F1/1626 ,  G06F1/1686 ,  G06F3/005 ,  G06F3/017 ,  G06F3/0304

Abstract: Compact opto-electronic sensor modules are described that allow detection of an object's motion occurring in spatial regions (e.g., quadrants) that are located primarily directly about the surface of a device in which the module is located. For example, light (e.g., infra-red) from a light emitting element in the module can illuminate substantially all, or at least a significant percentage of, areas in a plane directly above the surface of the device. Each of multiple light detecting elements in the module can be arranged to receive light from a respective detection zone directly above the surface of the device.

Abstract translation: 描述了紧凑的光电传感器模块，其允许检测在主要直接位于模块所在的设备的表面的空间区域（例如，象限）中发生的物体的运动。 例如，来自模块中的发光元件的光（例如，红外线）可以基本上在装置表面上方的平面内照亮所有或至少相当大的百分比的面积。 模块中的多个光检测元件中的每一个可以被布置成从设备表面正上方的相应检测区域接收光。

公开(公告)号：US20190088801A1

公开(公告)日：2019-03-21

申请号：US16086868

申请日：2017-03-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirniö ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/024 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/58 ,  H01L27/146 ,  H01L51/52 ,  H01S5/022 ,  H01S5/024

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14685 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/024 ,  H01L31/18 ,  H01L33/48 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L33/647 ,  H01L51/5237 ,  H01L51/5275 ,  H01L51/529 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01S5/02469 ,  H05K1/021 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/049

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US20150090884A1

公开(公告)日：2015-04-02

申请号：US14503611

申请日：2014-10-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Philippe Bouchilloux

IPC: G01S3/786

CPC classification number: G01S7/4813 ,  G01S17/46 ,  G01S17/87 ,  G06F1/1626 ,  G06F1/1686 ,  G06F3/005 ,  G06F3/017 ,  G06F3/0304

Abstract: Compact opto-electronic sensor modules are described that allow detection of an object's motion occurring in spatial regions (e.g., quadrants) that are located primarily directly about the surface of a device in which the module is located. For example, light (e.g., infra-red) from a light emitting element in the module can illuminate substantially all, or at least a significant percentage of, areas in a plane directly above the surface of the device. Each of multiple light detecting elements in the module can be arranged to receive light from a respective detection zone directly above the surface of the device.

Abstract translation: 描述了紧凑的光电传感器模块，其允许检测在主要直接位于模块所在的设备的表面的空间区域（例如，象限）中发生的物体的运动。 例如，来自模块中的发光元件的光（例如，红外线）可以基本上在装置表面上方的平面内照亮所有或至少相当大的百分比的面积。 模块中的多个光检测元件中的每一个可以被布置成从设备表面正上方的相应检测区域接收光。