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    Laser machining device
    1.
    发明授权
    Laser machining device 有权

    公开(公告)号：US11833611B2

    公开(公告)日：2023-12-05

    申请号：US17289011

    申请日：2019-10-30

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Takeshi Sakamoto ,  Junji Okuma

    IPC: B23K26/08 ,  B23K26/351 ,  B23K26/06 ,  B23K101/40

    CPC classification number: B23K26/0823 ,  B23K26/0604 ,  B23K26/0853 ,  B23K26/0884 ,  B23K26/351 ,  B23K2101/40

    Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

    Laser machining device and laser machining method
    2.
    发明授权
    Laser machining device and laser machining method 有权

    公开(公告)号：US10898975B2

    公开(公告)日：2021-01-26

    申请号：US15753311

    申请日：2016-08-08

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Junji Okuma ,  Yo Sugimoto

    IPC: B23K26/53 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/03 ,  B23K26/00 ,  B23K26/364 ,  B23K26/06

    Abstract: A laser processing device includes: a support table; a laser light source; a converging optical system; an imaging unit configured to image a front surface of an object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the object along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the object on the basis of an image of the crack.

    Laser machining device and laser output device
    3.
    发明授权
    Laser machining device and laser output device 有权

    公开(公告)号：US12202070B2

    公开(公告)日：2025-01-21

    申请号：US16072626

    申请日：2017-01-24

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Junji Okuma ,  Mitsuhiro Nagao ,  Yasunori Igasaki

    IPC: B23K26/06 ,  B23K26/03 ,  B23K26/064 ,  B23K26/08 ,  B23K26/53 ,  H01S3/00 ,  H01S3/10 ,  B23K103/00 ,  H01S3/23

    Abstract: A laser processing device includes: a device frame; a support unit attached to the device frame and configured to support an object to be processed; a laser output unit attached to the device frame; and a laser converging unit attached to the device frame so as to be movable with respect to the laser output unit. The laser output unit includes a laser light source configured to emit laser light, and the laser converging unit includes: a reflective spatial light modulator configured to reflect the laser light while modulating the laser light; a converging optical system configured to converge the laser light at the object to be processed; and an imaging optical system constituting a double telecentric optical system in which a reflective surface of the reflective spatial light modulator and an entrance pupil plane of the converging optical system are in an imaging relationship.

    Laser machining head and laser machining device
    6.
    发明授权
    Laser machining head and laser machining device 有权

    公开(公告)号：US12145214B2

    公开(公告)日：2024-11-19

    申请号：US17288821

    申请日：2019-10-30

    Applicant: HAMAMATSU PHOTONICS K.K.

    Inventor： Takeshi Sakamoto ,  Junji Okuma

    IPC: B23K26/04 ,  B23K26/03 ,  B23K26/064 ,  G01B11/14 ,  G02B13/22 ,  G02B27/10

    Abstract: A laser processing head includes: a housing; an entrance portion; an adjustment portion; and a condensing portion. A distance between a third wall portion and a fourth wall portion facing each other in a second direction is shorter than a distance between a first wall portion and a second wall portion facing each other in a first direction. The housing is configured to be attached to an attachment portion of a laser processing apparatus, with at least one of the first wall portion, the second wall portion, the third wall portion, and a fifth wall portion disposed on the side of the attachment portion. The condensing portion is disposed on a sixth wall portion, and is offset toward the fourth wall portion in the second direction.

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