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公开(公告)号:US10898975B2
公开(公告)日:2021-01-26
申请号:US15753311
申请日:2016-08-08
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Junji Okuma , Yo Sugimoto
IPC: B23K26/53 , B23K26/0622 , B23K26/08 , B23K26/03 , B23K26/00 , B23K26/364 , B23K26/06
Abstract: A laser processing device includes: a support table; a laser light source; a converging optical system; an imaging unit configured to image a front surface of an object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the object along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the object on the basis of an image of the crack.
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公开(公告)号:US10758999B2
公开(公告)日:2020-09-01
申请号:US15752685
申请日:2016-08-08
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Junji Okuma , Yo Sugimoto
IPC: B23K26/03 , B23K26/53 , B23K26/06 , B23K26/08 , B23K26/0622 , B23K26/082 , B23K26/00 , B23K101/40 , B23K103/00
Abstract: The object to be processed cutting method includes: a crystal orientation identifying step of identifying a crystal orientation of the substrate; a line to cut setting step of setting, for the object to be processed, a line to cut passing through a street region formed between adjacent functional devices, after the crystal orientation identifying step; and a cutting step of cutting the object to be processed along the line to cut, after the line to cut setting step. In the line to cut setting step, in a case where an extending direction of the street region does not match the crystal orientation, the line to cut parallel to the crystal orientation and inclined with respect to the extending direction of the street region, is set for the object to be processed.
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