Invention Grant
- Patent Title: Laser processing method, and laser processing device
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Application No.: US16760094Application Date: 2018-10-31
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Publication No.: US11642743B2Publication Date: 2023-05-09
- Inventor: Junji Okuma
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP 2017214432 2017.11.07
- International Application: PCT/JP2018/040566 2018.10.31
- International Announcement: WO2019/093209A 2019.05.16
- Date entered country: 2020-04-29
- Main IPC: B23K26/53
- IPC: B23K26/53 ; B23K26/00 ; B23K26/03 ; B23K26/062 ; B23K26/064 ; G01N21/55 ; G06T7/70 ; B23K103/00

Abstract:
A laser processing method includes a first step of emitting measurement laser light of a first wavelength from the reference surface side to a reference object having a reference surface of which reflectance for the first wavelength is known to obtain a reference light amount as a reflected light amount of the measurement laser light on the reference surface, a second step of emitting the measurement laser light from the first surface side to the object to be processed to obtain a first light amount as a reflected light amount of the measurement laser light on the first surface, and a third step of, after the first step and the second step, calculating a reflectance of the first surface for the first wavelength based on a reflectance of the reference object, the reference light amount, and the first light amount.
Public/Granted literature
- US20200290157A1 LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE Public/Granted day:2020-09-17
Information query
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