摘要:
A disk boat assembly for holding workpieces to be processed within a chemical reaction processing apparatus during the chemical vapor process. The boat assembly includes a pair of electrically conductive rail members held rigidly and radially apart between two dielectric end holding members that electrically isolate the two rail members. A plurality of disk like plates are connected respectively to the two rail members and are interleaved such that adjacent disk plates are electrically isolated. Each disk plate includes pairs of bores formed therein with each pair extending radially outward from the center of the disk. Insertable pins are placed in a respective pair of bores, the distance therebetween of which can be extended by insertion in an additional pair of bores lying further from the center of the disk so that variable diameter workpieces can be held on the broad surfaces of each disk plate.
摘要:
A method and system for delivering iodine gas is presented. The pure iodine gas flow can be at a controlled, known flow rate, and furthermore be held at a positive pressure in relation to a process chamber. In an exemplary embodiment, pure iodine gas is transported without the use of an inert carrier gas. This is facilitated in part by maintaining the iodine gas chamber at a higher pressure than the processing chamber.In one exemplary embodiment, an iodine vessel receives solid iodine supplied by an iodine fill source and is heated to produce pure iodine gas. In addition, a control system monitors and controls the operating conditions in the iodine vessel and maintains a positive pressure in the iodine vessel. The iodine delivery system may include a valve system configured to control the flow of iodine gas through the iodine delivery system and into a process chamber.
摘要:
Method for plasma deposition of silicon from a silicon source gas. By inclusion of a halogen species in the gas flow stream, thermally induced deposition is inhibited so that plasma decomposition predominates. The silicon gas source may comprise the halogen species, which may alternatively be under separate control. The suppression of thermally induced deposition leads to improved thickness uniformity across the workpieces for significantly increased lifetime or runtime without the conductive plates shorting together.
摘要:
A deposition system includes a vacuum reaction chamber with a substrate holder positioned in it. The substrate holder is for carrying a substrate therein. A sputtering apparatus is also positioned in the vacuum reaction chamber. The sputtering apparatus is configured to direct sputtered material towards the substrate to form a sputtered material region thereon. A plasma enhanced chemical vapor deposition (PECVD) apparatus is positioned in the vacuum reaction chamber. The PECVD apparatus is configured to deposit a PECVD material region thereon the substrate. The first PECVD apparatus includes a first PECVD electrode movable from a first position towards the substrate and a second position away from the substrate.
摘要:
A holding fixture for plasma enhanced chemical vapor deposition processing of semiconductor wafers comprising a frame boat assembly for holding disk-shape semiconductor wafer workpieces to be subjected to a flow of reactant gases serially across the workpieces in a direction perpendicular to the broad faces of the workpieces. The boat holding fixture comprises a pair of upright, spaced-apart insulating frame end members having a first set of spaced-apart parallel, elongated insulating rods secured between the end members for holding the boat in assembled relation. An electrode supporting rack is secured within the boat for holding a plurality of flat, spaced-apart, electrically conductive electrodes in an upright position with the flat surfaces parallel to each other and perpendicular to the longitudinal axis of the boat. A workpiece holding rack comprised by at least two spaced-apart, parallel, insulating, workpiece support, elongated rods is provided with each workpiece support rod being seated in longitudinally aligned apertures formed on lower opposite sides of the periphery of the array of flat, spaced-apart parallel electrically conductive electrodes for holding the workpieces suspended directly from the electrodes flat against the opposite flat surfaces of the respective electrodes. The holding fixture is completed by means for applying an electric potential difference between alternate ones of the array of spaced-apart parallel electrodes.
摘要:
A method for deposition of thin conductive layers of low resistivity titanium silicide. The method comprises the co-deposition of titanium and silicon by plasma-enhanced chemical vapor deposition at a low temperature. An anneal above the deposition temperature reduces the layer resistivity, making the layer especially suitable for microelectronic applications.
摘要:
An improved spacer means for separating and inhibiting the shorting together of conductive plates in an RF plasma reactor used in Plasma Enhanced Chemical Vapor Deposition (PECVD) processing of semiconductor devices. The improved spacer means inhibits the accumulation of conductive films on the surface of the separating means by substantially precluding the plasma field, and hence, inhibiting depositions in areas where recessed grooves are in the surface of the separating means. Accordingly, a direct electrical path on the spacer means between the multiple conductive plates of the RF plasma reactor is inhibited. As a result, the reactors can run for longer periods of time and deposit greater thicknesses of conductive films without the conductive plates shorting together causing shutdown of the process.
摘要:
Method and apparatus for improved uniformity in an externally excited non-thermal chemical reaction process. In the inventive process, the reactant is externally activated for a time short compared with the time during which reactant depletion would otherwise occur. The reactant is then deactivated for a period of time comparable to the transit time across the workload. In this way improved uniformity is obtained by reducing the depletion of the reactant as it flows across the workload.