公开(公告)号：US20240174907A1

公开(公告)日：2024-05-30

申请号：US18283319

申请日：2021-03-30

申请人： DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

发明人： Chao HE ,  Dorab BHAGWAGAR ,  Ling LING ,  Hongyu CHEN ,  Chen CHEN ,  Jiguang ZHANG

IPC分类号： C09K5/14 ,  C08G77/442 ,  C08K9/06 ,  H01M10/625 ,  H01M10/653

CPC分类号： C09K5/14 ,  C08G77/442 ,  C08K9/06 ,  H01M10/625 ,  H01M10/653 ,  C08K2201/001 ,  H01M2220/20

摘要： A curable polyolefin composition is provided. The curable polyolefin composition comprises: (A) a polyolefin having at least two aliphatic unsaturated bonds per molecule and having a viscosity at 25° C. of less than 2,500 mPa·s; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) a thermal conductive filler. The curable polyolefin composition can be cured to form a soft material with good thermal conductive properties.

公开(公告)号：US20240059946A1

公开(公告)日：2024-02-22

申请号：US18267830

申请日：2020-12-24

申请人： DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

发明人： Chao HE ,  Dorab BHAGWAGAR ,  Jiguang ZHANG ,  Ling LING ,  Hongyu CHEN ,  Peng WEI ,  Yan ZHENG ,  Chen CHEN

IPC分类号： C09K5/06

CPC分类号： C09K5/06

摘要： A thermal interface material is provided. The thermal interface material comprises: (A) a polyolefin having at least two hydroxy groups per molecule; (B) at least one thermally conductive filler; (C) a phase change material with a melting point of 25 to 150° C.; and (D) a coupling agent. A content of component (B) is at least 80 mass %, a content of component (C) is 0.01 to 1 mass %, and a content of component (D) is 0.1 to 1 mass %, each based on a total mass of the thermal interface material. The thermal interface material becomes softer as its temperature increases. Meanwhile, the thermal interface material generally does not exhibit pumping-out in electronic devices during power cycling.

公开(公告)号：US20240141112A1

公开(公告)日：2024-05-02

申请号：US18278649

申请日：2021-03-03

申请人： Chao He ,  Peng WEI ,  Jiguang ZHANG ,  Hongyu CHEN ,  Yan ZHENG ,  Chen CHEN ,  Dorab BHAGWAGAR ,  DOW SILICONES CORPORATION ,  DOW GLOBAL TECHNOLOGIES LLC

发明人： Chao HE ,  Peng WEI ,  Jiguang ZHANG ,  Hongyu CHEN ,  Yan ZHENG ,  Chen CHEN ,  Dorab BHAGWAGAR

IPC分类号： C08G77/442 ,  C08K3/22 ,  C08L91/06 ,  C09K5/06

CPC分类号： C08G77/442 ,  C08K3/22 ,  C08L91/06 ,  C09K5/063 ,  C08K2003/2227 ,  C08K2201/003

摘要： Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100° C.; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass %, content of component (B) is 10 to 75 mass %, and content of component (C) is 1 to 20 mass %, each based on the total mass of components (A) to (D). The composition can be cured to form a cured product capable of storing and releasing thermal energy, and preventing the wax leaking/pumping out during heat cycling.

公开(公告)号：US20190100499A1

公开(公告)日：2019-04-04

申请号：US16112847

申请日：2018-10-11

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Lingli DUAN ,  Chen CHEN ,  Shaoguang FENG ,  Zhkhra I. NIAZIMBETOVA ,  Maria Anna RZEZNIK

IPC分类号： C07D265/33 ,  C07D413/12 ,  C25D7/00 ,  C25D7/12 ,  C07D241/04 ,  C09D179/08 ,  C25D3/32 ,  C08G73/10 ,  C08G73/02 ,  C25D3/38

CPC分类号： C07D265/33 ,  C07D241/04 ,  C07D413/12 ,  C08G73/028 ,  C08G73/0293 ,  C08G73/10 ,  C09D179/08 ,  C25D3/32 ,  C25D3/38 ,  C25D7/00 ,  C25D7/123

摘要： Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

公开(公告)号：US20180327908A1

公开(公告)日：2018-11-15

申请号：US15775023

申请日：2015-12-18

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Lingli DUAN ,  Chen CHEN ,  Kitho TONG ,  Chit Yiu CHAN ,  Kwok Wai Dennis YEE

IPC分类号： C23C18/54 ,  C23C18/42

CPC分类号： C23C18/54 ,  C23C18/42

摘要： Provided is a cyanide-free non-electrolytic gold plating solution including a specific nitrile compound. The plating solution is sustainable and showed good bath stability and plating performance.

公开(公告)号：US20210205052A9

公开(公告)日：2021-07-08

申请号：US16780939

申请日：2020-02-04

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Weijing LU ,  Lingli DUAN ,  Zukhra NIAZIMBETOVA ,  Chen CHEN ,  Maria RZEZNIK

IPC分类号： A61C8/00 ,  A61C3/02 ,  A61C9/00 ,  A61B6/03 ,  A61B5/055 ,  B33Y80/00 ,  B33Y50/00 ,  A61C1/08 ,  A61C13/00

摘要： Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.

公开(公告)号：US20180135194A1

公开(公告)日：2018-05-17

申请号：US15560228

申请日：2015-04-28

申请人： Dow Global Technologies LLC ,  Rohm and Hass Electric MAterials LLC

发明人： Lingli DUAN ,  Chen CHEN ,  Tong SUN ,  Zukhra I. NIAZIMBETOVA ,  Maria Anna RZEZNIK

IPC分类号： C25D3/32 ,  C25D3/38 ,  C08G73/10 ,  C08K5/17

CPC分类号： C25D3/32 ,  C08G73/00 ,  C08G73/1017 ,  C08G73/1092 ,  C08K5/17 ,  C25D3/30 ,  C25D3/38 ,  C25D7/00 ,  H05K3/241

摘要： Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.

公开(公告)号：US20200179087A1

公开(公告)日：2020-06-11

申请号：US16780939

申请日：2020-02-04

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： Weijing LU ,  Lingli DUAN ,  Zukhra NIAZIMBETOVA ,  Chen CHEN ,  Maria RZEZNIK

IPC分类号： A61C8/00 ,  A61C3/02 ,  A61C9/00 ,  A61B6/03 ,  A61B5/055 ,  B33Y80/00 ,  B33Y50/00 ,  A61C1/08 ,  A61C13/00

摘要： Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.

公开(公告)号：US20180093957A1

公开(公告)日：2018-04-05

申请号：US15559542

申请日：2015-04-28

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： LINGLI DUAN ,  Chen CHEN ,  Shaoguang FENG ,  Zukhra I. NIAZIMBETOVA ,  Maria Anna RZEZNIK

IPC分类号： C07D265/33 ,  C07D413/12 ,  C07D241/04 ,  C25D3/32 ,  C25D3/38 ,  C25D7/12

CPC分类号： C07D265/33 ,  C07D241/04 ,  C07D413/12 ,  C08G73/028 ,  C08G73/0293 ,  C08G73/10 ,  C09D179/08 ,  C25D3/32 ,  C25D3/38 ,  C25D7/00 ,  C25D7/123

摘要： Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.

公开(公告)号：US20180051014A1

公开(公告)日：2018-02-22

申请号：US15559574

申请日：2015-04-28

申请人： Dow Global Technologies LLC ,  Rohm and Haas Elecronic Materials LLC

发明人： Lingli Duan ,  Chen CHEN ,  Shaoguang FENG ,  Zukhra l. NIAZIMBETOVA ,  Maria Anna RZEZNIK

IPC分类号： C07D413/12 ,  C07D413/10 ,  C07D413/06 ,  C07D265/33 ,  C07D241/04 ,  C25D3/30 ,  C25D3/38

摘要： Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.