公开(公告)号：US20240141112A1

公开(公告)日：2024-05-02

申请号：US18278649

申请日：2021-03-03

Applicant: Chao He ,  Peng WEI ,  Jiguang ZHANG ,  Hongyu CHEN ,  Yan ZHENG ,  Chen CHEN ,  Dorab BHAGWAGAR ,  DOW SILICONES CORPORATION ,  DOW GLOBAL TECHNOLOGIES LLC

Inventor： Chao HE ,  Peng WEI ,  Jiguang ZHANG ,  Hongyu CHEN ,  Yan ZHENG ,  Chen CHEN ,  Dorab BHAGWAGAR

IPC: C08G77/442 ,  C08K3/22 ,  C08L91/06 ,  C09K5/06

CPC classification number: C08G77/442 ,  C08K3/22 ,  C08L91/06 ,  C09K5/063 ,  C08K2003/2227 ,  C08K2201/003

Abstract: Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100° C.; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass %, content of component (B) is 10 to 75 mass %, and content of component (C) is 1 to 20 mass %, each based on the total mass of components (A) to (D). The composition can be cured to form a cured product capable of storing and releasing thermal energy, and preventing the wax leaking/pumping out during heat cycling.

公开(公告)号：US20240059946A1

公开(公告)日：2024-02-22

申请号：US18267830

申请日：2020-12-24

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

Inventor： Chao HE ,  Dorab BHAGWAGAR ,  Jiguang ZHANG ,  Ling LING ,  Hongyu CHEN ,  Peng WEI ,  Yan ZHENG ,  Chen CHEN

IPC: C09K5/06

CPC classification number: C09K5/06

Abstract: A thermal interface material is provided. The thermal interface material comprises: (A) a polyolefin having at least two hydroxy groups per molecule; (B) at least one thermally conductive filler; (C) a phase change material with a melting point of 25 to 150° C.; and (D) a coupling agent. A content of component (B) is at least 80 mass %, a content of component (C) is 0.01 to 1 mass %, and a content of component (D) is 0.1 to 1 mass %, each based on a total mass of the thermal interface material. The thermal interface material becomes softer as its temperature increases. Meanwhile, the thermal interface material generally does not exhibit pumping-out in electronic devices during power cycling.

公开(公告)号：US20220340713A1

公开(公告)日：2022-10-27

申请号：US17639458

申请日：2019-09-03

Applicant: DOW SILICONES CORPORATION

Inventor： Peng LI ,  Xiaocong XU ,  Hongjun MA ,  Yan ZHENG ,  Shuhua ZHANG ,  Yejun WU ,  Hui ZHU

IPC: C08G77/08 ,  C08G77/18

Abstract: A method for producing an organopolysiloxane having at least one silicon atom-bonded alkoxysilylalkyl group per molecule is provided. The method comprises the following steps: (i) treating an organopolysiloxane having at least one silicon atom-bonded hydrogen atom per molecule with an alkali salt of carboxylic acid; (ii) removing the alkali salt from the organopolysiloxane; and (iii) reacting the organopolysiloxane with an alkenyl group-containing alkoxysilane in the presence of a platinum-based catalyst. The organopolysiloxane is generally obtained by the method without hydrolyzing any alkoxysilylalkyl groups, and is useful as a surface modifier for various types of fillers.

公开(公告)号：US20250019497A1

公开(公告)日：2025-01-16

申请号：US18687324

申请日：2022-08-25

Applicant: DOW SILICONES CORPORATION

Inventor： Rui WANG ,  Yan ZHENG ,  Yusheng CHEN ,  Zhihai ZHANG ,  Yi GUO

IPC: C08G77/04 ,  C08G77/00 ,  C08G77/08 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K5/05 ,  C08K5/5419 ,  C08K9/06

Abstract: Provided are hydrosilylation (addition) curable thermally conductive silicone rubber compositions containing high levels (e.g., greater than 80 wt. %) of thermally conductive fillers, a method for their preparation, and cured silicone-based products made from the compositions which have a thermal conductivity of at least 1.5 W/mK whilst retaining adequate physical properties such as tensile strength and elasticity. The use of such materials is also disclosed.

公开(公告)号：US20210269643A1

公开(公告)日：2021-09-02

申请号：US17253744

申请日：2018-06-27

Applicant: DOW SILICONES CORPORATION

Inventor： Yan ZHENG ,  Zhongwei CAO ,  Qiang HUANG ,  Rui YANG ,  Sandrine TEIXEIRA de CARVALHO ,  Lujing XIE

IPC: C08L83/04 ,  C08K5/00 ,  H01M10/625 ,  H01M10/66

Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.