- 专利标题： COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND AND BISEPOXOIDES
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申请号： US16780939申请日： 2020-02-04
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公开(公告)号： US20200179087A1公开(公告)日： 2020-06-11
- 发明人: Weijing LU , Lingli DUAN , Zukhra NIAZIMBETOVA , Chen CHEN , Maria RZEZNIK
- 申请人： Dow Global Technologies LLC , Rohm and Haas Electronic Materials LLC
- 主分类号： A61C8/00
- IPC分类号： A61C8/00 ; A61C3/02 ; A61C9/00 ; A61B6/03 ; A61B5/055 ; B33Y80/00 ; B33Y50/00 ; A61C1/08 ; A61C13/00
摘要：
Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
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