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公开(公告)号：US20100012313A1
公开(公告)日：2010-01-21
申请号：US12505340
申请日：2009-07-17
CPC分类号： F16K31/006 , E21B23/00 , E21B34/066 , F04B17/003 , F04B47/06
摘要： According to one or more aspects of the present disclosure, a piezoelectric pump may include a hydraulic fluid path between a low pressure source and a high pressure tool port; a fluid disposed in the hydraulic fluid path; a piston in communication with the fluid; and a piezoelectric material connected to the piston to pump the fluid through the high pressure tool port.
摘要翻译： 根据本公开的一个或多个方面，压电泵可以包括在低压源和高压工具端口之间的液压流体路径; 设置在液压流体路径中的流体; 与流体连通的活塞; 以及连接到活塞以将流体泵送通过高压工具端口的压电材料。
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公开(公告)号：US08220533B2
公开(公告)日：2012-07-17
申请号：US12505340
申请日：2009-07-17
IPC分类号： E21B34/08
CPC分类号： F16K31/006 , E21B23/00 , E21B34/066 , F04B17/003 , F04B47/06
摘要： According to one or more aspects of the present disclosure, a piezoelectric pump may include a hydraulic fluid path between a low pressure source and a high pressure tool port; a fluid disposed in the hydraulic fluid path; a piston in communication with the fluid; and a piezoelectric material connected to the piston to pump the fluid through the high pressure tool port.
摘要翻译： 根据本公开的一个或多个方面，压电泵可以包括在低压源和高压工具端口之间的液压流体路径; 设置在液压流体路径中的流体; 与流体连通的活塞; 以及连接到活塞以将流体泵送通过高压工具端口的压电材料。
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公开(公告)号：US08469109B2
公开(公告)日：2013-06-25
申请号：US12695110
申请日：2010-01-27
申请人： David Wei Wang , Gary L. Rytlewski
发明人： David Wei Wang , Gary L. Rytlewski
IPC分类号： E21B33/128
摘要： An apparatus and method for plugging a wellbore completion. The apparatus includes a body and a variable diameter ring. The body includes a first portion having a first diameter, and a second portion having a second diameter that is smaller than the first diameter. The variable diameter ring is disposed around the body and slidable on the first and second portions. The ring is configured to engage a flow path reduction device when located on the first portion, and to move past the flow path reduction device when located on the second portion.
摘要翻译： 一种用于堵塞井眼完井的装置和方法。 该装置包括主体和可变直径环。 主体包括具有第一直径的第一部分和具有小于第一直径的第二直径的第二部分。 可变直径环设置在主体周围并可在第一和第二部分上滑动。 环被配置为当位于第一部分上时接合流路减小装置，并且当位于第二部分上时移动通过流路减小装置。
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公开(公告)号：US20110180274A1
公开(公告)日：2011-07-28
申请号：US12695110
申请日：2010-01-27
申请人： David Wei Wang , Gary L. Rytlewski
发明人： David Wei Wang , Gary L. Rytlewski
IPC分类号： E21B33/12
摘要： An apparatus and method for plugging a wellbore completion. The apparatus includes a body and a variable diameter ring. The body includes a first portion having a first diameter, and a second portion having a second diameter that is smaller than the first diameter. The variable diameter ring is disposed around the body and slidable on the first and second portions. The ring is configured to engage a flow path reduction device when located on the first portion, and to move past the flow path reduction device when located on the second portion.
摘要翻译： 一种用于堵塞井眼完井的装置和方法。 该装置包括主体和可变直径环。 主体包括具有第一直径的第一部分和具有小于第一直径的第二直径的第二部分。 可变直径环设置在主体周围并可在第一和第二部分上滑动。 环被配置为当位于第一部分上时接合流路减小装置，并且当位于第二部分上时移动通过流路减小装置。
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公开(公告)号：US08752635B2
公开(公告)日：2014-06-17
申请号：US11638668
申请日：2006-12-13
IPC分类号： E21B17/02
CPC分类号： E21B17/026 , E21B17/1035
摘要： A technique is provided that utilizes one or both of a control line actuation mechanism and a connector protection mechanism for use in a wellbore environment. Upon landing a lower well assembly and an upper well assembly at a desired wellbore location, control line connectors are engaged. The control line actuation mechanism and/or connector protection mechanism facilitate the formation of a desirable control line connection.
摘要翻译： 提供了一种利用控制线致动机构和连接器保护机构中的一个或两个用于井眼环境中的技术。 在下井井组件和上井组件在期望的井眼位置处着陆时，控制线连接器被接合。 控制线致动机构和/或连接器保护机构有助于形成期望的控制线连接。
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公开(公告)号：US07981725B2
公开(公告)日：2011-07-19
申请号：US12714646
申请日：2010-03-01
申请人： Geng-Shin Shen , David Wei Wang
发明人： Geng-Shin Shen , David Wei Wang
IPC分类号： H01L21/00
CPC分类号： H01L24/90 , H01L24/12 , H01L24/16 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/13565 , H01L2224/1601 , H01L2224/16145 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/73265 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/83192 , H01L2224/83194 , H01L2224/83856 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A fabricating process of a chip package structure is provided. First, a first substrate having a plurality of first bonding pads and a second substrate having a plurality of second bonding pads are provided, wherein bumps are formed on the first bonding pads of the first substrate. A first two-stage adhesive layer is formed on the first substrate and is B-stagized to form a first B-staged adhesive layer. A second two-stage adhesive layer is formed on the second substrate and is B-stagized to form a second B-staged adhesive layer. Then, the first substrate and the second substrate are bonded via the first and second B-staged adhesive layer such that the bumps pierce through the second B-staged adhesive layer and are electrically connected to the second bonding pads, wherein each of the first bonding pads is respectively electrically connected to one of the second bonding pads via one of the bumps.
摘要翻译： 提供了芯片封装结构的制造工艺。 首先，提供具有多个第一接合焊盘的第一基板和具有多个第二接合焊盘的第二基板，其中在第一基板的第一接合焊盘上形成凸块。 在第一基板上形成第一两层粘合剂层，并将其B层状化以形成第一B阶粘合剂层。 在第二基板上形成第二两层粘合剂层，并且被B阶段化以形成第二B阶粘合剂层。 然后，第一基板和第二基板经由第一和第二B阶粘合剂层接合，使得凸块穿过第二B阶粘合剂层并电连接到第二接合焊盘，其中第一接合 焊盘经由凸块之一分别电连接到第二接合焊盘之一。
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公开(公告)号：US07638880B2
公开(公告)日：2009-12-29
申请号：US12198536
申请日：2008-08-26
申请人： Geng-Shin Shen , David Wei Wang
发明人： Geng-Shin Shen , David Wei Wang
IPC分类号： H01L23/12
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49513 , H01L23/49575 , H01L24/31 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73215 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： A chip package including a carrier having an opening, a first chip, bumps, a second chip, bonding wires, a first adhesive layer and a molding compound is provided. The first chip and the second chip are disposed at two opposite side of the carrier. The bumps are disposed between the carrier and a first active surface of the first chip to electrically connect with the first chip and the carrier. The bonding wires pass through the opening of the carrier and are electrically connected with the carrier and the second chip. The first adhesive layer adhered between the first active surface of the first chip and the carrier includes a first B-staged adhesive layer adhered on the first active surface of the first chip and a second B-staged adhesive layer adhered between the first B-staged adhesive layer and the carrier.
摘要翻译： 提供了包括具有开口的载体，第一芯片，凸块，第二芯片，接合线，第一粘合层和模塑料的芯片封装。 第一芯片和第二芯片设置在载体的相对两侧。 凸块设置在载体和第一芯片的第一有源表面之间以与第一芯片和载体电连接。 接合线穿过载体的开口并与载体和第二芯片电连接。 附着在第一芯片的第一活性表面和载体之间的第一粘合剂层包括附着在第一芯片的第一有源表面上的第一B阶粘合剂层和粘附在第一B层之间的第二B阶粘合剂层 粘合剂层和载体。
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公开(公告)号：US20080251948A1
公开(公告)日：2008-10-16
申请号：US12147929
申请日：2008-06-27
申请人： Geng-Shin Shen , David Wei Wang
发明人： Geng-Shin Shen , David Wei Wang
IPC分类号： H01L23/498
CPC分类号： H01L25/0657 , H01L24/73 , H01L24/81 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83193 , H01L2224/83194 , H01L2224/83856 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A chip package structure including a first substrate, a second substrate, a plurality of bumps, a first B-staged adhesive layer and a second B-staged adhesive layer is provided. The first substrate has a plurality of first bonding pads. The second substrate has a plurality of second bonding pads, and the second substrate is disposed above the first substrate. The bumps are disposed between the first substrate and the second substrate, wherein each of the first bonding pads is respectively electrically connected to one of the second bonding pads via one of the bumps. The first B-staged adhesive layer is adhered on the first substrate. The second B-staged adhesive layer is adhered between the first B-staged adhesive layer and the second substrate, wherein the first B-staged adhesive layer and the second B-staged adhesive layer encapsulate the bumps.
摘要翻译： 提供了包括第一基板，第二基板，多个凸块，第一B阶粘合剂层和第二B阶粘合剂层的芯片封装结构。 第一基板具有多个第一接合焊盘。 第二基板具有多个第二接合焊盘，第二基板设置在第一基板的上方。 所述凸块设置在所述第一基板和所述第二基板之间，其中所述第一接合焊盘中的每一个分别经由所述凸块之一电连接到所述第二接合焊盘中的一个。 第一B级粘合剂层粘附在第一基底上。 第二B阶粘合剂层粘附在第一B阶粘合剂层和第二基底之间，其中第一B阶粘合剂层和第二B阶粘合剂层包封凸块。
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公开(公告)号：US20130119530A1
公开(公告)日：2013-05-16
申请号：US13588363
申请日：2012-08-17
申请人： AN HONG LIU , David Wei Wang , Shi Fen Huang , Yi Chang Lee , Hsiang Ming Huang
发明人： AN HONG LIU , David Wei Wang , Shi Fen Huang , Yi Chang Lee , Hsiang Ming Huang
IPC分类号： H01L23/34
CPC分类号： H01L23/36 , H01L23/373 , H01L23/3737 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： A thermally enhanced packaging structure includes a chip carrier; a high power chip disposed on the chip carrier; a molding compound covering the high power chip; a heat dissipating layer disposed on the molding compound, wherein the heat dissipating layer comprises a plurality of carbon nanocapsules (CNCs); and a non-fin type heat dissipating device, disposed either on the heat dissipating layer or between the molding compound and the heat dissipating layer. The molding compound can also comprise a plurality of CNCs.
摘要翻译： 热增强包装结构包括芯片载体; 设置在芯片载体上的大功率芯片; 覆盖大功率芯片的模塑料; 设置在所述模塑料上的散热层，其中所述散热层包括多个碳纳米胶囊（CNCs）; 以及设置在散热层上或模塑料和散热层之间的非鳍式散热装置。 模塑料也可以包括多个CNCs。
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10.发明授权公开(公告)号：US08338935B2
公开(公告)日：2012-12-25
申请号：US13116278
申请日：2011-05-26
申请人： An Hong Liu , David Wei Wang
发明人： An Hong Liu , David Wei Wang
CPC分类号： H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147
摘要： A thermally enhanced electronic package comprises a chip, a substrate, an adhesive, and an encapsulation. The adhesive or the encapsulation is mixed with carbon nanocapsules. The substrate includes an insulation layer and a wiring layer formed on the substrate. The adhesive covers the chip and the substrate. The chip is electrically connected to the wiring layer. The encapsulation covers the chip and the substrate.
摘要翻译： 热增强型电子封装包括芯片，衬底，粘合剂和封装。 将粘合剂或包封与碳纳米胶囊混合。 基板包括绝缘层和形成在基板上的布线层。 粘合剂覆盖芯片和基板。 芯片电连接到布线层。 封装覆盖芯片和基板。
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