摘要:
An integrated memory transistor and a memory unit including a plurality of integrated memory transistors is disclosed. Generally, the integrated memory transistor includes an electron source, a channel region, a control region, a charge storage region, a source-side pocket doping region, and a drain-side pocket doping region. The electron source is operable to transport electrons to the channel region when the integrated memory transistor operates in a read mode. Further, the electron source includes a drain terminal region and a source terminal region. The channel region is arranged between the drain terminal region and source terminal region. The charge storage region is arranged between the control region and the channel region. The source-side doping region is arranged nearer to the source terminal region than to the drain terminal region. The drain-side pocket doping region is arranged asymmetrical to the source-side pocket doping region.
摘要:
An integrated memory transistor and a memory unit including a plurality of integrated memory transistors is disclosed. Generally, the integrated memory transistor includes an electron source, a channel region, a control region, a charge storage region, a source-side pocket doping region, and a drain-side pocket doping region. The electron source is operable to transport electrons to the channel region when the integrated memory transistor operates in a read mode. Further, the electron source includes a drain terminal region and a source terminal region. The channel region is arranged between the drain terminal region and source terminal region. The charge storage region is arranged between the control region and the channel region. The source-side doping region is arranged nearer to the source terminal region than to the drain terminal region. The drain-side pocket doping region is arranged asymmetrical to the source-side pocket doping region.
摘要:
A bit line structure and associated fabrication method are provided for a semiconductor element or circuit arrangement. The bit line structure contains a surface bit line and a buried bit line. The buried bit line is formed in an upper section of a trench and is connected to an associated first doping region via a first connection layer. A first trench filling layer, which is insulated from the buried bit line by a second trench insulating layer, is situated in a lower section of the trench.
摘要:
A nonvolatile memory element and associated production methods and memory element arrangements are presented. The nonvolatile memory element has a changeover material and a first and second electrically conductive electrode present at the changeover material. To reduce a forming voltage, a first electrode has a field amplifier structure for amplifying a field strength of an electric field generated by a second electrode in a changeover material. The field amplifier structure is a projection of the electrodes which projects into the changeover material. The memory element arrangement has multiple nonvolatile memory elements which are arranged in matrix form and can be addressed via bit lines arranged in column form and word lines arranged in row form.
摘要:
A memory circuit arrangement and a fabrication method are disclosed. The memory circuit arrangement has a memory cell area. The memory cell area contains memory cell transistors, one column of which are selected using a triple gate area selection transistor. The transistor has gate area that extends into isolating trenches. The isolating trenches isolate the memory cell in different columns of the memory cell array.
摘要:
A nonvolatile memory element and associated production methods and memory element arrangements are presented. The nonvolatile memory element has a changeover material and a first and second electrically conductive electrode present at the changeover material. To reduce a forming voltage, a first electrode has a field amplifier structure for amplifying a field strength of an electric field generated by a second electrode in a changeover material. The field amplifier structure is a projection of the electrodes which projects into the changeover material. The memory element arrangement has multiple nonvolatile memory elements which are arranged in matrix form and can be addressed via bit lines arranged in column form and word lines arranged in row form.
摘要:
The invention is concerned with novel benzimidazole derivatives of formula (I) wherein R1 to R8 are as defined in the description and in the claims, as well as physiologically acceptable salts and esters thereof. These compounds bind to Farnesoid-X-receptors (FXR) and can be used to treat diseases which are modulated by FXR agonists such as diabetes and dyslipidemia.
摘要:
The disclosure relates to a bit line structure and an associated production method for the bit line structure. In the bit line structure, at least in a region of a second contact and a plurality of first contact adjoining the latter, an isolation trench is filled with an electrically conductive trench filling layer. The isolation trench connects to the first doping regions adjoining the second contact for the purpose of realizing a buried contact bypass line.
摘要:
A memory cell, memory cell arrangement, and method for producing a memory cell arrangement is described where electric charge carriers can be introduced from a trench structure, which delivers charge carriers, into a charge storage area by applying a predefined electrical potential to the cell. The memory cell provides for programming with a reduced energy requirement
摘要:
A nonvolatile memory element and associated production methods and memory element arrangements are presented. The nonvolatile memory element has a changeover material and a first and second electrically conductive electrode present at the changeover material. To reduce a forming voltage, a first electrode has a field amplifier structure for amplifying a field strength of an electric field generated by a second electrode in a changeover material. The field amplifier structure is a projection of the electrodes which projects into the changeover material. The memory element arrangement has multiple nonvolatile memory elements which are arranged in matrix form and can be addressed via bit lines arranged in column form and word lines arranged in row form.