公开(公告)号：US09073748B2

公开(公告)日：2015-07-07

申请号：US13293917

申请日：2011-11-10

Applicant: Bruce C. S. Chou ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Chen-Chih Fan

IPC: H01L29/84 ,  B81B7/00 ,  H01L23/31

CPC classification number: B81C1/00825 ,  B81B7/0054 ,  B81C1/00301 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.

Abstract translation: 微电子机械系统（MEMS）组件包括载体和设置在载体上的MEMS装置。 缓冲层设置在MEMS器件上。 缓冲层的杨氏模量小于MEMS器件的杨氏模量。

公开(公告)号：US07915722B2

公开(公告)日：2011-03-29

申请号：US12003159

申请日：2007-12-20

Applicant: Bruce C. S. Chou ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Chen-Chih Fan

IPC: H01L23/02

CPC classification number: G06K9/00053 ,  H01L23/3185 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.

Abstract translation: 信息感测装置包括基板，一个信息感测芯片，一个导电结构和成型体。 包括输出连接的电输出部分形成在基板上。 信息感测芯片电连接到电输出部分，并且具有安装在基板上的一个底部芯片表面和与物体接近或接触的一个顶部芯片表面以感测对象的特定信息。 导电结构电连接到电输出部分。 模制体与信息感测芯片和至少一个导电结构接触以暴露顶部芯片表面和导电结构的第一表面。 顶部芯片表面设置成与底部芯片表面相对。 顶部芯片表面和第一表面暴露在外部并且设置在基本上相同的平面上。

公开(公告)号：US20100310137A1

公开(公告)日：2010-12-09

申请号：US12796169

申请日：2010-06-08

Applicant: Bruce C. S. CHOU ,  Chen-Chih Fan

Inventor： Bruce C. S. CHOU ,  Chen-Chih Fan

IPC: G06K9/00 ,  H01L31/0224 ,  H01L31/09

CPC classification number: H01L27/14634 ,  G06K9/00013 ,  G06K9/00026 ,  H01L27/14636 ,  H01L27/14678

Abstract: An image sensing device adapted to a flat surface design includes a carrier and an image sensing structure. The carrier has carrier input pads and carrier output pads respectively electrically connected to the carrier input pads. The image sensing structure has signal input pads and signal output pads respectively electrically connected to the signal input pads. The signal output pads are respectively electrically connected to the carrier input pads. The image sensing structure includes a sensing chip having image sensing members and a processing circuit. The signal input pads and the image sensing members are electrically connected to the processing circuit. The image sensing members sense an image of an object and output sensed signals. The processing circuit processes the sensed signals into processed signals, which are transmitted to the carrier output pads through the signal input pads, the signal output pads and the carrier input pads.

Abstract translation: 适于平坦表面设计的图像感测装置包括载体和图像感测结构。 载体具有分别电连接到载体输入焊盘的载体输入焊盘和载体输出焊盘。 图像感测结构具有分别电连接到信号输入焊盘的信号输入焊盘和信号输出焊盘。 信号输出焊盘分别电连接到载体输入焊盘。 图像感测结构包括具有图像感测构件和处理电路的感测芯片。 信号输入焊盘和图像感测部件电连接到处理电路。 图像感测构件感测物体的图像并输出感测信号。 处理电路将感测到的信号处理成经处理的信号，其通过信号输入焊盘，信号输出焊盘和载体输入焊盘传输到载体输出焊盘。

公开(公告)号：US06900644B2

公开(公告)日：2005-05-31

申请号：US10429733

申请日：2003-05-06

Applicant: Bruce C. S. Chou ,  Wallace Y. W. Cheng ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Wallace Y. W. Cheng ,  Chen-Chih Fan

IPC: G01R27/26 ,  G06K9/00

CPC classification number: G06K9/00053

Abstract: A capacitive fingerprint sensor against ESD damage and contamination interference includes a substrate, a plurality of plate electrodes, a metal mesh, a plurality of ESD units, a plurality of bonding pads, and a protection layer. The plate electrodes, bonding pads and metal mesh are positioned on the substrate at the same level, and are composed of the same material. The ESD units are connected to the metal mesh that is conducted to the ground, and are exposed via a plurality of first openings. Thus, electrostatic charges from a finger may be discharged through this path to the ground. The metal mesh is covered by the protection layer and is not exposed. The number of the ESD units is far less than that of the plate electrodes so as to reduce the contamination interference on the captured fingerprint image.

Abstract translation: 针对ESD损伤和污染干扰的电容式指纹传感器包括基板，多个平板电极，金属网，多个ESD单元，多个接合焊盘和保护层。 平板电极，接合焊盘和金属网位于相同水平的基板上，由相同的材料组成。 ESD单元连接到传导到地面的金属网，并且经由多个第一开口露出。 因此，来自手指的静电电荷可以通过该路径被排出到地面。 金属网被保护层覆盖，不露出。 ESD单元的数量远远少于平板电极的数量，以便减少对捕获的指纹图像的污染干扰。

公开(公告)号：US09139420B2

公开(公告)日：2015-09-22

申请号：US13450223

申请日：2012-04-18

Applicant: Chang-Chia Chang ,  Chen-Chih Fan ,  Bruce C. S. Chou

Inventor： Chang-Chia Chang ,  Chen-Chih Fan ,  Bruce C. S. Chou

IPC: H01L29/84 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00269 ,  B81B3/0018 ,  B81B3/0067 ,  B81B3/007 ,  B81B7/00 ,  B81B7/0006 ,  B81B7/0016 ,  B81B7/0029 ,  B81B7/0041 ,  B81B7/0051 ,  B81B7/0058 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00 ,  B81C1/00293 ,  B81C1/00325 ,  B81C2203/0118

Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.

Abstract translation: 微机电系统（MEMS）装置可以包括在第一衬底上方的MEMS结构。 MEMS结构包括中心静态元件，可移动元件和外部静态元件。 在中心静电元件和第一衬底之间的一部分接合材料。 在MEMS结构上方的第二衬底，在中心静态元件和第二衬底之间具有介电层的一部分。 支撑柱包括接合材料部分，中心静电元件和介电材料部分。

公开(公告)号：US07207661B2

公开(公告)日：2007-04-24

申请号：US10890121

申请日：2004-07-14

Applicant: Bruce C. S. Chou ,  Chih-Hsien Yeh ,  Chingfu Tsou ,  Jer-Wei Chang ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Chih-Hsien Yeh ,  Chingfu Tsou ,  Jer-Wei Chang ,  Chen-Chih Fan

IPC: B41J2/05

CPC classification number: B41J2/1412 ,  B41J2/1404 ,  B41J2/14137 ,  B41J2002/14387

Abstract: An ink-jet print head with a chamber sidewall heating mechanism includes a substrate, an insulation layer on the substrate, a main channel penetrating through the substrate, a plurality of V-shaped micro-channels each having a diverging end linking with the main channel and a converging end linking with an ink chamber on the insulation layer, and a nozzle plate with a plurality of orifices formed on the ink chamber. The V-shaped micro-channels are perpendicular to the main channel and parallel to and arranged on the insulation layer. Each chamber sidewall includes a heater structure to evaporate ink in the chamber to form a bubble, which pushes the ink in the chamber to eject from the orifice.

Abstract translation: 具有室侧壁加热机构的喷墨打印头包括基板，基板上的绝缘层，穿过基板的主通道，多个V形微通道，每个V形微通道具有与主通道连接的发散端 以及与绝缘层上的墨水室连接的会聚端和在墨水室上形成有多个孔的喷嘴板。 V形微通道垂直于主通道并平行并布置在绝缘层上。 每个室侧壁包括一个加热器结构，用于蒸发腔室中的墨水以形成气泡，该气泡推动腔室中的墨水从孔口喷出。

公开(公告)号：US08748999B2

公开(公告)日：2014-06-10

申请号：US13452037

申请日：2012-04-20

Applicant: Bruce C. S. Chou ,  Jung-Kuo Tu ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Jung-Kuo Tu ,  Chen-Chih Fan

IPC: H01L29/84 ,  G01P15/08 ,  H04R23/00 ,  G01L9/00 ,  H01L21/00

CPC classification number: B81C1/00158 ,  B81C1/00301 ,  G01P15/125 ,  H01G5/18 ,  H01L28/60

Abstract: A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.

Abstract translation: 一种器件包括半导体衬底和具有背板的电容传感器，其中所述背板形成所述电容式传感器的第一电容器板。 背板是半导体衬底的一部分。 导电膜通过气隙与半导体衬底间隔开。 电容传感器的电容被配置成响应于多晶硅膜的移动而改变。

公开(公告)号：US07518200B2

公开(公告)日：2009-04-14

申请号：US11723907

申请日：2007-03-22

Applicant: Bruce C. S. Chou ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Chen-Chih Fan

IPC: H01L29/84 ,  H01L23/06 ,  H01L23/053 ,  H01L23/12 ,  H01L23/14 ,  H01L23/58

CPC classification number: G06K9/00053 ,  Y10S977/701 ,  Y10S977/72 ,  Y10S977/721

Abstract: A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface passivation film is formed on the at least one surface. The nano-structure-surface passivation film including nano-particles and a carrier resin protects the IC chip body from encountering any external interference. The IC chip body further has a plurality of fingerprint sensing members for sensing a whole fingerprint or a partial fingerprint.

Abstract translation: 半导体集成电路（IC）芯片包括IC芯片体和纳米结构表面钝化膜。 IC芯片主体具有至少一个表面。 纳米结构表面钝化膜形成在至少一个表面上。 包括纳米颗粒和载体树脂的纳米结构表面钝化膜保护IC芯片体免受任何外部干扰。 IC芯片体还具有用于感测整个指纹或部分指纹的多个指纹感测部件。

公开(公告)号：US07397096B2

公开(公告)日：2008-07-08

申请号：US11476027

申请日：2006-06-28

Applicant: Bruce C. S. Chou ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Chen-Chih Fan

IPC: H01L27/14

CPC classification number: G06K9/0002 ,  G06K9/00026

Abstract: A structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (ESD) includes a semiconductor substrate, and a sweep-type fingerprint sensing chip formed on the semiconductor substrate, a polymer layer and a conducting metal layer. The sweep-type fingerprint sensing chip includes a sensing array region and a peripheral circuit region. The sensing array region has an exposed area for sensing a plurality of fingerprint fragment images as a finger sweeps thereacross. The peripheral circuit region, which is formed on the substrate and located around the sensing array region, controls an operation of the sensing array region. The polymer layer is disposed on the peripheral circuit region and has a flat and smooth outer surface. The conducting metal layer is disposed on the flat and smooth outer surface of the polymer layer. The conducting metal layer discharges the approaching electrostatic charges to the ground to avoid damaging of the sensing chip.

Abstract translation: 能够抵抗静电放电（ESD）的扫描式指纹感测芯片的结构包括半导体衬底和形成在半导体衬底，聚合物层和导电金属层上的扫描型指纹感测芯片。 扫描型指纹感测芯片包括感测阵列区域和外围电路区域。 感测阵列区域具有用于感测多个指纹片段图像的暴露区域，作为手指在其上扫描。 形成在基板上并位于感测阵列区域周围的外围电路区域控制感测阵列区域的操作。 聚合物层设置在外围电路区域上，具有平坦且光滑的外表面。 导电金属层设置在聚合物层的平坦光滑的外表面上。 导电金属层将接近的静电电荷排放到地面以避免损坏感测芯片。

公开(公告)号：US07071708B2

公开(公告)日：2006-07-04

申请号：US10825313

申请日：2004-04-16

Applicant: Bruce C. S. Chou ,  Wallace Y. W. Cheng ,  Chen-Chih Fan

Inventor： Bruce C. S. Chou ,  Wallace Y. W. Cheng ,  Chen-Chih Fan

IPC: G01R27/26

CPC classification number: G06K9/00053

Abstract: A chip-type sensor against ESD and stress damages and contamination interference includes a substrate structure and a protection layer covering over the substrate structure. The protection layer includes, from bottom to top, a first layer for providing a first stress against the substrate structure, a second layer for providing a second stress against the substrate structure, and a third layer for providing a third stress against the substrate structure. The first stress and the third stress belong to one of a tensile stress and a compressive stress, and the second stress belongs to the other of the tensile stress and the compressive stress.

Abstract translation: 防止ESD和应力损坏和污染干扰的芯片型传感器包括衬底结构和覆盖在衬底结构上的保护层。 保护层从底部到顶部包括用于提供针对衬底结构的第一应力的第一层，用于向衬底结构提供第二应力的第二层以及用于向衬底结构提供第三应力的第三层。 第一应力和第三应力属于拉伸应力和压应力之一，第二应力属于拉伸应力和压应力中的另一个。