Invention Grant
US07518200B2 Semiconductor integrated circuit chip with a nano-structure-surface passivation film
有权
具有纳米结构表面钝化膜的半导体集成电路芯片
- Patent Title: Semiconductor integrated circuit chip with a nano-structure-surface passivation film
- Patent Title (中): 具有纳米结构表面钝化膜的半导体集成电路芯片
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Application No.: US11723907Application Date: 2007-03-22
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Publication No.: US07518200B2Publication Date: 2009-04-14
- Inventor: Bruce C. S. Chou , Chen-Chih Fan
- Applicant: Bruce C. S. Chou , Chen-Chih Fan
- Applicant Address: TW Taipei
- Assignee: EGIS Technology Inc.
- Current Assignee: EGIS Technology Inc.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW95110191A 20060324
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L23/06 ; H01L23/053 ; H01L23/12 ; H01L23/14 ; H01L23/58
Abstract:
A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface passivation film is formed on the at least one surface. The nano-structure-surface passivation film including nano-particles and a carrier resin protects the IC chip body from encountering any external interference. The IC chip body further has a plurality of fingerprint sensing members for sensing a whole fingerprint or a partial fingerprint.
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