Abstract:
A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.
Abstract:
A biometrics sensor module includes a housing, a biometrics sensor and a coupling electrode. The housing has a first surface and a second surface opposite to the first surface. The biometrics sensor has a sensing surface, which is disposed on the first surface of the housing and has sensing members arranged in an array. The coupling electrode is disposed on the first or second surface of the housing. Two regions, projected from the sensing surface and the coupling electrode to the second surface of the housing, do not overlap with each other. A coupling signal is provided to the coupling electrode and directly or indirectly couples the coupling signal to an object, so that the sensing members of the biometrics sensor sense biometrics messages of the object contacting with the second surface of the housing.
Abstract:
An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.
Abstract:
An image sensing device adapted to a flat surface design includes a carrier and an image sensing structure. The carrier has carrier input pads and carrier output pads respectively electrically connected to the carrier input pads. The image sensing structure has signal input pads and signal output pads respectively electrically connected to the signal input pads. The signal output pads are respectively electrically connected to the carrier input pads. The image sensing structure includes a sensing chip having image sensing members and a processing circuit. The signal input pads and the image sensing members are electrically connected to the processing circuit. The image sensing members sense an image of an object and output sensed signals. The processing circuit processes the sensed signals into processed signals, which are transmitted to the carrier output pads through the signal input pads, the signal output pads and the carrier input pads.
Abstract:
The present invention provides a fingerprint sensing mechanism using a two-dimensional thermoelectric sensor array to capture the thermal image related to the ridges and valleys on the finger, wherein its fabricating method is totally compatible with integrated circuits processing. Using the body temperature of a human being as the stimulation source for biometrics, a temperature difference is produced from a ridge of a fingerprint contacting the thermoelectric sensor and the temperature gradient is converted into an electrical signal. A plurality of thermoelectric sensors arranged in a two-dimensional array forms a fingerprint sensor so as to obtain the electrical signal output of the ridge profile of the fingerprint.
Abstract:
A capacitive micro pressure sensing member and a fingerprint sensor using the same. The sensing member includes a substrate, a first suspended structure, a first protrusion structure, and a second suspended structure. The first suspended structure is located above the substrate and includes a suspended thin plate and at least one compliant suspension arm connected to the suspended thin plate, which is movable so that a distance from the suspended thin plate to the substrate is changed. The first protrusion structure is arranged at a center portion of a top surface of the suspended thin plate. The second suspended structure is arranged on a top surface of the first protrusion structure with a center portion of the second suspended structure contacting the first protrusion structure. The second suspended structure covers the first suspended structure to form a sealed chamber together with the substrate.
Abstract:
A capacitive fingerprint sensor against ESD damage and contamination interference includes a substrate, a plurality of plate electrodes, a metal mesh, a plurality of ESD units, a plurality of bonding pads, and a protection layer. The plate electrodes, bonding pads and metal mesh are positioned on the substrate at the same level, and are composed of the same material. The ESD units are connected to the metal mesh that is conducted to the ground, and are exposed via a plurality of first openings. Thus, electrostatic charges from a finger may be discharged through this path to the ground. The metal mesh is covered by the protection layer and is not exposed. The number of the ESD units is far less than that of the plate electrodes so as to reduce the contamination interference on the captured fingerprint image.
Abstract:
A multi-functional storage apparatus and a control method thereof for executing the steps of: receiving a first command outputted from an operation system through a driver and responding to the first command to make the operation system identify an attribute of the multi-functional storage apparatus; transferring an application program stored in a storage device of the multi-functional storage apparatus according to an executing request of the operation system; executing, by the operation system, the application program to generate a second command, wherein the first command and the second command pertain to a control transfer command (CTC) for enabling a control transfer; and receiving the second command to control a signal generator of the multi-functional storage apparatus to generate an external signal, transferring the external signal back to the operation system; and converting the CTC into a bulk transfer command (BTC) for enabling a bulk transfer.
Abstract:
A biometrics method based on a thermal image of a finger includes the steps of: acquiring the thermal image of the finger; and extracting a finger-print image or a finger-vein image from the thermal image and thus verifying a user's identity according to the finger-print image or the finger-vein image.
Abstract:
A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface passivation film is formed on the at least one surface. The nano-structure-surface passivation film including nano-particles and a carrier resin protects the IC chip body from encountering any external interference. The IC chip body further has a plurality of fingerprint sensing members for sensing a whole fingerprint or a partial fingerprint.