Biometrics sensor module, assembly, manufacturing method and electronic apparatus using such biometrics sensor module
    2.
    发明授权
    Biometrics sensor module, assembly, manufacturing method and electronic apparatus using such biometrics sensor module 有权
    生物识别传感器模块,组装,制造方法和使用这种生物识别传感器模块的电子设备

    公开(公告)号:US09058511B2

    公开(公告)日:2015-06-16

    申请号:US14082530

    申请日:2013-11-18

    Inventor: Bruce C. S. Chou

    Abstract: A biometrics sensor module includes a housing, a biometrics sensor and a coupling electrode. The housing has a first surface and a second surface opposite to the first surface. The biometrics sensor has a sensing surface, which is disposed on the first surface of the housing and has sensing members arranged in an array. The coupling electrode is disposed on the first or second surface of the housing. Two regions, projected from the sensing surface and the coupling electrode to the second surface of the housing, do not overlap with each other. A coupling signal is provided to the coupling electrode and directly or indirectly couples the coupling signal to an object, so that the sensing members of the biometrics sensor sense biometrics messages of the object contacting with the second surface of the housing.

    Abstract translation: 生物测定传感器模块包括壳体,生物测定传感器和耦合电极。 壳体具有与第一表面相对的第一表面和第二表面。 生物测定传感器具有检测表面,其设置在壳体的第一表面上并且具有排列成阵列的感测构件。 耦合电极设置在壳体的第一或第二表面上。 从感测表面和耦合电极突出到壳体的第二表面的两个区域彼此不重叠。 耦合信号被提供给耦合电极并且将耦合信号直接地或间接地耦合到物体,使得生物特征传感器的感测构件感测与物体的第二表面接触的物体的生物测定消息。

    Information sensing device with electroconductive structure and molded body surrounding each other
    3.
    发明授权
    Information sensing device with electroconductive structure and molded body surrounding each other 有权
    具有导电结构和成型体的信息感测装置相互围绕

    公开(公告)号:US07915722B2

    公开(公告)日:2011-03-29

    申请号:US12003159

    申请日:2007-12-20

    Abstract: An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically connected to the electrical output portion and has one bottom chip surface mounted on the substrate, and one top chip surface to be close to or in contact with an object to sense specific information of the object. The electroconductive structure is electrically connected to the electrical output portion. The molded body is in contact with the information sensing chip and the at least one electroconductive structure to expose the top chip surface and a first surface of the electroconductive structure. The top chip surface is disposed opposite the bottom chip surface. The top chip surface and the first surface are exposed outside and disposed on substantially the same plane.

    Abstract translation: 信息感测装置包括基板,一个信息感测芯片,一个导电结构和成型体。 包括输出连接的电输出部分形成在基板上。 信息感测芯片电连接到电输出部分,并且具有安装在基板上的一个底部芯片表面和与物体接近或接触的一个顶部芯片表面以感测对象的特定信息。 导电结构电连接到电输出部分。 模制体与信息感测芯片和至少一个导电结构接触以暴露顶部芯片表面和导电结构的第一表面。 顶部芯片表面设置成与底部芯片表面相对。 顶部芯片表面和第一表面暴露在外部并且设置在基本上相同的平面上。

    IMAGE SENSING DEVICE ADAPTED TO FLAT SURFACE DESIGN
    4.
    发明申请
    IMAGE SENSING DEVICE ADAPTED TO FLAT SURFACE DESIGN 审中-公开
    图像感应装置适用于平面设计

    公开(公告)号:US20100310137A1

    公开(公告)日:2010-12-09

    申请号:US12796169

    申请日:2010-06-08

    Abstract: An image sensing device adapted to a flat surface design includes a carrier and an image sensing structure. The carrier has carrier input pads and carrier output pads respectively electrically connected to the carrier input pads. The image sensing structure has signal input pads and signal output pads respectively electrically connected to the signal input pads. The signal output pads are respectively electrically connected to the carrier input pads. The image sensing structure includes a sensing chip having image sensing members and a processing circuit. The signal input pads and the image sensing members are electrically connected to the processing circuit. The image sensing members sense an image of an object and output sensed signals. The processing circuit processes the sensed signals into processed signals, which are transmitted to the carrier output pads through the signal input pads, the signal output pads and the carrier input pads.

    Abstract translation: 适于平坦表面设计的图像感测装置包括载体和图像感测结构。 载体具有分别电连接到载体输入焊盘的载体输入焊盘和载体输出焊盘。 图像感测结构具有分别电连接到信号输入焊盘的信号输入焊盘和信号输出焊盘。 信号输出焊盘分别电连接到载体输入焊盘。 图像感测结构包括具有图像感测构件和处理电路的感测芯片。 信号输入焊盘和图像感测部件电连接到处理电路。 图像感测构件感测物体的图像并输出感测信号。 处理电路将感测到的信号处理成经处理的信号,其通过信号输入焊盘,信号输出焊盘和载体输入焊盘传输到载体输出焊盘。

    Thermoelectric sensor for fingerprint thermal imaging
    5.
    发明授权
    Thermoelectric sensor for fingerprint thermal imaging 失效
    用于指纹热成像的热电传感器

    公开(公告)号:US07406185B2

    公开(公告)日:2008-07-29

    申请号:US10414214

    申请日:2003-04-16

    CPC classification number: G06K9/0002 G01J5/12

    Abstract: The present invention provides a fingerprint sensing mechanism using a two-dimensional thermoelectric sensor array to capture the thermal image related to the ridges and valleys on the finger, wherein its fabricating method is totally compatible with integrated circuits processing. Using the body temperature of a human being as the stimulation source for biometrics, a temperature difference is produced from a ridge of a fingerprint contacting the thermoelectric sensor and the temperature gradient is converted into an electrical signal. A plurality of thermoelectric sensors arranged in a two-dimensional array forms a fingerprint sensor so as to obtain the electrical signal output of the ridge profile of the fingerprint.

    Abstract translation: 本发明提供一种使用二维热电传感器阵列捕获与手指上的脊和谷有关的热图像的指纹感测机构,其中其制造方法与集成电路处理完全兼容。 使用人体的体温作为生物测定的刺激源,从与热电传感器接触的指纹的脊产生温差,并将温度梯度转换为电信号。 以二维阵列布置的多个热电传感器形成指纹传感器,以获得指纹的脊形轮廓的电信号输出。

    Capacitive micro pressure sensing member and fingerprint sensor using the same
    6.
    发明授权
    Capacitive micro pressure sensing member and fingerprint sensor using the same 失效
    电容式微压感测元件和使用其的指纹传感器

    公开(公告)号:US07277563B2

    公开(公告)日:2007-10-02

    申请号:US10638371

    申请日:2003-08-12

    Inventor: Bruce C. S. Chou

    CPC classification number: G01L1/146 G01L1/148

    Abstract: A capacitive micro pressure sensing member and a fingerprint sensor using the same. The sensing member includes a substrate, a first suspended structure, a first protrusion structure, and a second suspended structure. The first suspended structure is located above the substrate and includes a suspended thin plate and at least one compliant suspension arm connected to the suspended thin plate, which is movable so that a distance from the suspended thin plate to the substrate is changed. The first protrusion structure is arranged at a center portion of a top surface of the suspended thin plate. The second suspended structure is arranged on a top surface of the first protrusion structure with a center portion of the second suspended structure contacting the first protrusion structure. The second suspended structure covers the first suspended structure to form a sealed chamber together with the substrate.

    Abstract translation: 电容式微压力传感元件和使用其的指纹传感器。 感测构件包括基板,第一悬挂结构,第一突起结构和第二悬挂结构。 第一悬挂结构位于基板上方,并且包括悬挂的薄板和连接到悬挂的薄板的至少一个顺从的悬挂臂,其可移动,使得从悬置的薄板到基板的距离改变。 第一突出结构布置在悬挂薄板的顶表面的中心部分。 第二悬挂结构设置在第一突出结构的顶表面上,第二悬挂结构的中心部分接触第一突出结构。 第二悬挂结构覆盖第一悬挂结构以与基底一起形成密封室。

    Capacitive fingerprint sensor against ESD damage and contamination interference
    7.
    发明授权
    Capacitive fingerprint sensor against ESD damage and contamination interference 有权
    电容式指纹传感器可防止ESD损坏和污染干扰

    公开(公告)号:US06900644B2

    公开(公告)日:2005-05-31

    申请号:US10429733

    申请日:2003-05-06

    CPC classification number: G06K9/00053

    Abstract: A capacitive fingerprint sensor against ESD damage and contamination interference includes a substrate, a plurality of plate electrodes, a metal mesh, a plurality of ESD units, a plurality of bonding pads, and a protection layer. The plate electrodes, bonding pads and metal mesh are positioned on the substrate at the same level, and are composed of the same material. The ESD units are connected to the metal mesh that is conducted to the ground, and are exposed via a plurality of first openings. Thus, electrostatic charges from a finger may be discharged through this path to the ground. The metal mesh is covered by the protection layer and is not exposed. The number of the ESD units is far less than that of the plate electrodes so as to reduce the contamination interference on the captured fingerprint image.

    Abstract translation: 针对ESD损伤和污染干扰的电容式指纹传感器包括基板,多个平板电极,金属网,多个ESD单元,多个接合焊盘和保护层。 平板电极,接合焊盘和金属网位于相同水平的基板上,由相同的材料组成。 ESD单元连接到传导到地面的金属网,并且经由多个第一开口露出。 因此,来自手指的静电电荷可以通过该路径被排出到地面。 金属网被保护层覆盖,不露出。 ESD单元的数量远远少于平板电极的数量,以便减少对捕获的指纹图像的污染干扰。

    Multi-functional storage apparatus and control method thereof
    8.
    发明授权
    Multi-functional storage apparatus and control method thereof 有权
    多功能存储装置及其控制方法

    公开(公告)号:US07620761B2

    公开(公告)日:2009-11-17

    申请号:US11905134

    申请日:2007-09-27

    Abstract: A multi-functional storage apparatus and a control method thereof for executing the steps of: receiving a first command outputted from an operation system through a driver and responding to the first command to make the operation system identify an attribute of the multi-functional storage apparatus; transferring an application program stored in a storage device of the multi-functional storage apparatus according to an executing request of the operation system; executing, by the operation system, the application program to generate a second command, wherein the first command and the second command pertain to a control transfer command (CTC) for enabling a control transfer; and receiving the second command to control a signal generator of the multi-functional storage apparatus to generate an external signal, transferring the external signal back to the operation system; and converting the CTC into a bulk transfer command (BTC) for enabling a bulk transfer.

    Abstract translation: 一种多功能存储装置及其控制方法,用于执行以下步骤:通过驱动器接收从操作系统输出的第一命令,并响应于所述第一命令使所述操作系统识别所述多​​功能存储装置的属性 ; 根据所述操作系统的执行请求传送存储在所述多功能存储装置的存储装置中的应用程序; 由所述操作系统执行所述应用程序以生成第二命令,其中所述第一命令和所述第二命令涉及用于实现控制传送的控制传送命令(CTC); 以及接收所述第二命令以控制所述多功能存储装置的信号发生器以产生外部信号,将所述外部信号传送回所述操作系统; 并将CTC转换为大容量传输命令(BTC)以实现批量传输。

    Biometrics method based on a thermal image of a finger
    9.
    发明授权
    Biometrics method based on a thermal image of a finger 有权
    基于手指热图像的生物识别方法

    公开(公告)号:US07519205B2

    公开(公告)日:2009-04-14

    申请号:US12068068

    申请日:2008-02-01

    Inventor: Bruce C. S. Chou

    CPC classification number: G06K9/00013 G06K2009/00932

    Abstract: A biometrics method based on a thermal image of a finger includes the steps of: acquiring the thermal image of the finger; and extracting a finger-print image or a finger-vein image from the thermal image and thus verifying a user's identity according to the finger-print image or the finger-vein image.

    Abstract translation: 基于手指的热图像的生物识别方法包括以下步骤:获取手指的热图像; 以及从热图像提取指纹图像或手指静脉图像,从而根据指纹图像或手指静脉图像验证用户的身份。

    Semiconductor integrated circuit chip with a nano-structure-surface passivation film
    10.
    发明授权
    Semiconductor integrated circuit chip with a nano-structure-surface passivation film 有权
    具有纳米结构表面钝化膜的半导体集成电路芯片

    公开(公告)号:US07518200B2

    公开(公告)日:2009-04-14

    申请号:US11723907

    申请日:2007-03-22

    CPC classification number: G06K9/00053 Y10S977/701 Y10S977/72 Y10S977/721

    Abstract: A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface passivation film is formed on the at least one surface. The nano-structure-surface passivation film including nano-particles and a carrier resin protects the IC chip body from encountering any external interference. The IC chip body further has a plurality of fingerprint sensing members for sensing a whole fingerprint or a partial fingerprint.

    Abstract translation: 半导体集成电路(IC)芯片包括IC芯片体和纳米结构表面钝化膜。 IC芯片主体具有至少一个表面。 纳米结构表面钝化膜形成在至少一个表面上。 包括纳米颗粒和载体树脂的纳米结构表面钝化膜保护IC芯片体免受任何外部干扰。 IC芯片体还具有用于感测整个指纹或部分指纹的多个指纹感测部件。

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