公开(公告)号：US20150302974A1

公开(公告)日：2015-10-22

申请号：US14684256

申请日：2015-04-10

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun ZHAO ,  Edward LAW ,  Sampath Komarapalayam KARIKALAN ,  Neal Andrew KISTLER ,  Rezaur Rahman KHAN ,  Pieter VORENKAMP

IPC: H01F27/28 ,  H05K1/18 ,  H01F41/02 ,  H01F41/04 ,  H01F27/24 ,  H01F27/40

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/045 ,  H01F38/14 ,  H01F41/046 ,  H01F2017/0053 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L2224/16225

Abstract: A 3-dimensional (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.

Abstract translation: 三维（3-D）磁芯装置包括基板，形成在基板上的第一磁性壳以及嵌入在形成于第一磁性壳上的第一绝缘体层中的第一组导电迹线。 磁芯平面形成在第一绝缘体层上，第二组导电迹线嵌入形成在磁芯平面上的第二绝缘体层中。 第二磁性壳体形成在第二绝缘体层上，并且第一和第二组导电迹线通过使用导电通孔导电耦合。

公开(公告)号：US20160155728A1

公开(公告)日：2016-06-02

申请号：US15018818

申请日：2016-02-08

Applicant: Broadcom Corporation

Inventor： Sam Ziqun ZHAO ,  Rezaur Rahman KHAN ,  Pieter VORENKAMP ,  Sampath K.V. KARIKALAN ,  Kevin Kunzhong HU ,  Xiangdong CHEN

IPC: H01L25/10 ,  H01L21/78 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L21/50 ,  H01L21/78 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/24011 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/821 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2224/92133 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the, top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement.

Abstract translation: 本公开的示例性实施方案包括具有来自位于底部重构晶片的底模上方的顶部重构晶片的顶模的堆叠封装。 顶部模具和底部模具通过绝缘装置彼此绝缘。 顶模和底模也通过绝缘装置互连。 绝缘装置可以包括在顶模侧面的顶部模塑料和位于底模侧面的底部模塑料。 顶模和底模可以通过至少顶部模塑料相互连接。 此外，顶模和底模可以通过在绝缘装置内延伸的导电通孔相互连接。

公开(公告)号：US20150235992A1

公开(公告)日：2015-08-20

申请号：US14701388

申请日：2015-04-30

Applicant: BROADCOM CORPORATION

Inventor： Sampath K. KARIKALAN ,  Sam Ziqun ZHAO ,  Kevin Kunzhong HU ,  Rezaur Rahman KHAN ,  Pieter VORENKAMP ,  Xiangdong CHEN

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L23/48 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/538 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/80 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/152 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs).

Abstract translation: 这里公开了包括桥插入器的半导体封装的各种实施方式。 一个示例性实现包括具有位于桥插入件上方的第一部分的第一有源管芯和不位于桥插入件上的第二部分。 半导体封装还包括具有位于桥插入件上方的第一部分的第二有源管芯和不位于桥插入件上的第二部分。 第一有源裸片的第二部分和第二有源裸片的第二部分包括安装在封装衬底上的焊球，并且被配置为使用焊球将电信号传送到封装衬底，并且不使用贯穿半导体通孔（TSV ）。

公开(公告)号：US20130227313A1

公开(公告)日：2013-08-29

申请号：US13849391

申请日：2013-03-22

Applicant: Broadcom Corporation

Inventor： Pieter VORENKAMP ,  Agnes Woo ,  Anil Tammineedi ,  Ichiro Fujimori ,  David Chin ,  John Perzow

IPC: G06F1/26

CPC classification number: G06F1/26 ,  G06F1/266 ,  H04B3/44 ,  H04L12/10 ,  H04L12/40045 ,  H04L25/02 ,  Y10S370/91 ,  Y10T307/724

Abstract: Power over Ethernet (PoE) communication systems provide power and data communications over the same communications link, where a power source device (PSE) provides DC power to a powered device (PD). The DC power is transmitted simultaneously over the same communications medium with the high speed data from one node to the other node. The PSE controller measures the voltage, current, and temperature of the outgoing and incoming DC supply lines to characterize the power requirements of the PD. The PSE controller may detect and validate a compatible PD, determine a power classification signature for the validated PD, supply power to the PD, monitor the power, and reduce or remove the power from the PD when the power is no longer requested or required. If the PSE finds the PD to be non-compatible, the PSE can prevent the application of power to that PD device, protecting the PD from possible damage.

Abstract translation: 以太网供电（PoE）通信系统通过相同的通信链路提供电力和数据通信，其中电源设备（PSE）向有功设备（PD）提供直流电。 DC功率通过相同的通信介质同时传输，高速数据从一个节点到另一个节点。 PSE控制器测量输出和输入直流电源线路的电压，电流和温度，以表征PD的功率需求。 PSE控制器可以检测和验证兼容的PD，确定已验证的PD的功率分类签名，PD的供电，监控电源，以及在不再需要电源时，从PD中减少或移除电源。 如果PSE发现PD不兼容，则PSE可以阻止对该PD设备施加电源，从而保护PD免受可能的损坏。