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公开(公告)号：US12169258B2
公开(公告)日：2024-12-17
申请号：US17778119
申请日：2021-06-07
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Liang Cui , Xue Dong , Lei Wang , Yangbing Li , Yingzi Wang , Yanling Han , Yubo Wang , Yue Gou
Abstract: The present disclosure provides an ultrasonic imaging method and apparatus. The apparatus includes an ultrasonic signal emission source and a receiving array including ultrasonic signal receiving circuits; the method includes: turning on the source to perform emission of ultrasonic waves toward an object to be detected and causing the ultrasonic waves to propagate through the object, a depth-wise direction of which is along a propagation direction of the ultrasonic waves; after a first predetermined time period having elapsed since the source was turned on, turning on the receiving array to receive reflected echoes returning from a first section plane of the object to be detected perpendicular to the depth-wise direction; thereafter, turning off the receiving array, storing the reflected echoes by the ultrasonic signal receiving circuits and acquiring reflected echo signals, and successively reading the reflected echo signals from the ultrasonic signal receiving circuits during a reading time period.
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公开(公告)号：US10548215B2
公开(公告)日：2020-01-28
申请号：US16124896
申请日：2018-09-07
Inventor： Xiaojian Yang , Yubo Wang , Minghui Zhang , Inho Park , Weitao Chen
Abstract: A flexible printed circuit, a method for fabricating the same, and a display device are provided. The circuit includes: a substrate, at least one conductive structure located on the substrate, a contact electrode group, an encapsulation layer configured to encapsulate the conductive structure and the contact electrode group, and a ventilating film. The contact electrode group includes a first and a second contact electrodes, configured to be electrically connected respectively with two ends of the conductive structure; the encapsulation layer and the substrate constitute a cavity and a liquid storage area communicating with each other; the conductive structure includes a liquid conductive substance located in the cavity; and the liquid storage area is configured to store the liquid conductive substance, and the ventilating film is configured to encapsulate the liquid storage area.
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公开(公告)号：US11527095B2
公开(公告)日：2022-12-13
申请号：US17489605
申请日：2021-09-29
Applicant: BOE Technology Group Co., Ltd.
Inventor： Liang Cui , Lei Wang , Yangbing Li , Yubo Wang , Xiufeng Li , Yuanyuan Ma
Abstract: The present disclosure provides a fingerprint sensing sub-circuit, a fingerprint sensing circuit, a fingerprint recognition method, a sensor, a touch display panel and a display device. The fingerprint sensing sub-circuit includes an acoustic wave generation circuit and an acoustic wave reception circuit. The acoustic wave generation circuit is configured to generate an ultrasonic wave. The acoustic wave reception circuit is configured to collect a voltage signal, convert the voltage signal into a current signal, and output the current signal to a signal output end. The acoustic wave generation circuit and the acoustic wave reception circuit are separated from each other, so that the fingerprint sensing sub-circuit operates in a mode where a transmitting operation and a receiving operation are separated from each other.
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4.发明申请公开(公告)号：US20220343669A1
公开(公告)日：2022-10-27
申请号：US17422242
申请日：2020-09-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Liang Cui , Lei Wang , Yangbing Li , Yubo Wang , Xiufeng Li , Yuanyuan Ma
Abstract: A method for identifying a fingerprint, includes: performing a plurality of signal load operations on a plurality of transmit electrodes; in response to performing the signal load operations on the transmit electrodes, acquiring a fingerprint signal by a target electrode of the receive electrodes; and identifying a fingerprint based on acquired fingerprint signals.
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Patent Agency Ranking
5.发明授权公开(公告)号：US11950484B2
公开(公告)日：2024-04-02
申请号：US17280366
申请日：2020-07-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Pengpeng Wang , Haisheng Wang , Xiaoliang Ding , Yangbing Li , Xueyou Cao , Ping Zhang , Likai Deng , Yubo Wang
IPC: H10K59/65 , G09F9/30 , H04N5/33 , H04N23/54 , G02F1/1333
CPC classification number: H10K59/65 , G09F9/30 , H04N5/33 , H04N23/54 , G02F1/1333 , G02F2201/083 , G02F2201/58
Abstract: A display panel includes a display layer, a photosensitive layer and an infrared mask. The display layer is configured to display an image, the display layer has light-transmitting portions, and the light-transmitting portions are configured to transmit infrared light. The photosensitive layer is disposed on a side of the display layer. The infrared mask is disposed on a side of the photosensitive layer proximate to the display layer, the infrared mask has hollowed-out regions, the hollowed-out regions are configured to make the infrared mask have a preset pattern, and a region in the infrared mask except the hollowed-out regions is configured to prevent transmission of the infrared light. The photosensitive layer is configured to receive infrared light passing though the hollowed-out regions and the light-transmitting portions, and convert the infrared light into an image signal.
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6.发明申请公开(公告)号：US20190285963A1
公开(公告)日：2019-09-19
申请号：US16146557
申请日：2018-09-28
Inventor： Huaxu Bao , Minghui Zhang , Bing Bai , Yubo Wang , Xiaohu Li , Inho Park , Weitao Chen
Abstract: A luminous display substrate includes a base substrate, a light reflective and electrically conductive film layer on the base substrate, and a light-transmittance metal film layer on a side of the light reflective and electrically conductive film layer away from the base substrate. A side of the light reflective and electrically conductive film layer adjacent to the light-transmittance metal film layer is recessed towards the base substrate to form a curved surface.
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公开(公告)号：US11796858B2
公开(公告)日：2023-10-24
申请号：US16966581
申请日：2019-08-05
Applicant: BOE Technology Group Co., Ltd.
Inventor： Pengpeng Wang , Haisheng Wang , Xiaoliang Ding , Yangbing Li , Yapeng Li , Ping Zhang , Likai Deng , Yubo Wang
IPC: G02F1/13357 , G01S17/08 , G01S17/89
CPC classification number: G02F1/133603 , G01S17/08 , G01S17/89 , G02F1/133606 , G02F1/133621
Abstract: The present disclosure provides a backlight substrate, a manufacturing method thereof, and a display device. The backlight substrate includes: a base substrate; a plurality of first light emitting elements on the base substrate and configured to emit first light; a plurality of second light emitting elements on the base substrate and configured to emit second light having a different wavelength from the first light; a plurality of depth sensors on the base substrate and configured to receive the second light emitted from the plurality of second light emitting elements and reflected by an object and determine depth information of the object based on the received second light; and a diffusion layer in direct contact with light emitting surfaces of the plurality of first light emitting elements and configured to diffuse the first light emitted from the plurality of first light emitting elements.
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公开(公告)号：US11521417B2
公开(公告)日：2022-12-06
申请号：US17355776
申请日：2021-06-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Liang Cui , Haisheng Wang , Xiaoliang Ding , Yingming Liu , Pengpeng Wang , Ping Zhang , Yubo Wang , Xiufeng Li , Yuanyuan Ma
Abstract: The present disclosure provides a touch panel including: a touch region having a plurality of ultrasonic signal detection circuits and a reference region having a plurality of reference circuits, each ultrasonic signal detection circuit includes an ultrasonic sensor and a first driving circuit; the ultrasonic sensor includes a first electrode, a second electrode, and a dielectric layer between the first electrode and the second electrode, the first driving circuit is configured to drive the ultrasonic sensor; each of the plurality of reference circuits includes a reference transceiver and a second driving circuit, the reference transceiver includes a third electrode, a fourth electrode, and a dielectric layer between the third electrode and the fourth electrode; the second driving circuit is configured to drive the reference transceiver; the dielectric layer of the ultrasonic sensor has piezoelectric sensitivity; the dielectric layer of the reference transceiver does not have the piezoelectric sensitivity.
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公开(公告)号：US09936586B2
公开(公告)日：2018-04-03
申请号：US14910801
申请日：2015-07-30
Inventor： Jie Ge , Peng Wang , Xueling Gao , Yubo Wang , Boning Wang
CPC classification number: H05K3/30 , B65H20/18 , B65H23/26 , B65H35/06 , B65H37/04 , G02F1/1333 , H01L24/75 , H05K2201/10681 , H05K2203/0195
Abstract: An attaching apparatus for chip-on-films includes: a base; a rotary table; a first driving device configured to drive the rotary table to rotate around the axis of the rotary table; a TCP side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the TCP adhesive-attaching region; a PCB side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the PCB adhesive-attaching region; and a pre-pressing mechanism configured to pre-press conductive films attached on a chip-on-film on a carrier located in the pre-pressing region. The rotary table is in a first operating position, a second operating position, a third operating position and a fourth operating position successively during a rotation around its axis. When the rotary table is in any one of the operating positions, there is always one carrier in each region of the base.
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