Magnetron sputtering device, magnetron sputtering apparatus and magnetron sputtering method

    公开(公告)号:US10586690B2

    公开(公告)日:2020-03-10

    申请号:US15541883

    申请日:2017-01-03

    Abstract: A magnetron sputtering device, a magnetron sputtering apparatus, and a magnetron sputtering method are provided. The magnetron sputtering device includes: a target material bearing portion, configured to bear a target material thereon; a magnet bearing section, configured to bear a magnet thereon and to be capable of driving the magnet to perform reciprocating motion along a predetermined path with respect to the target material bearing portion; a limit sensor, configured to determine an end-point position of the predetermined path along which the magnet performs reciprocating motion; the end-point position determined by the limit sensor can be adjusted along the predetermined path during a working procedure of the magnetron sputtering device.

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