公开(公告)号：US20180209027A1

公开(公告)日：2018-07-26

申请号：US15710067

申请日：2017-09-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhongpeng Tian ,  Yimin Chen ,  Xuewei Gao ,  Jie Wu ,  Lei Xiao

IPC: C23C14/04 ,  C23C14/35 ,  C23C14/50

CPC classification number: C23C14/04 ,  C23C14/042 ,  C23C14/35 ,  C23C14/50

Abstract: A mask and a sputtering device are provided for sputtering film formation. The mask includes a mask body which further includes a sputtering face with a plurality of protrusions positioned thereupon.

公开(公告)号：US10586690B2

公开(公告)日：2020-03-10

申请号：US15541883

申请日：2017-01-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhongpeng Tian ,  Xuewei Gao ,  Lei Xiao ,  Jianhua Du

IPC: H01J37/34 ,  C23C14/35 ,  C23C14/54

Abstract: A magnetron sputtering device, a magnetron sputtering apparatus, and a magnetron sputtering method are provided. The magnetron sputtering device includes: a target material bearing portion, configured to bear a target material thereon; a magnet bearing section, configured to bear a magnet thereon and to be capable of driving the magnet to perform reciprocating motion along a predetermined path with respect to the target material bearing portion; a limit sensor, configured to determine an end-point position of the predetermined path along which the magnet performs reciprocating motion; the end-point position determined by the limit sensor can be adjusted along the predetermined path during a working procedure of the magnetron sputtering device.