APPARATUS AND METHOD FOR GENERATING CIRCUIT CLOCK SIGNAL

    公开(公告)号:US20240305284A1

    公开(公告)日:2024-09-12

    申请号:US18597096

    申请日:2024-03-06

    IPC分类号: H03K5/08 H03K5/133 H03K5/15

    摘要: Embodiments of the present disclosure provide an apparatus and a method for generating a circuit clock signal. The apparatus comprises: a clock buffer configured to buffer an original clock signal to obtain a buffered clock signal; a clock delay unit configured to delay the original clock signal to obtain a plurality of delayed clock signals, the plurality of delayed clock signals being respectively delayed by different amounts of time relative to the original clock signal; a broadened clock generator configured to generate a broadened clock signal based on the original clock signal and the plurality of delayed clock signals, the frequency of the broadened clock signal being lower than that of the original clock signal; and a clock selector configured to select one of the buffered clock signal and the broadened clock signal as the circuit clock signal based on a selection signal.

    CHIP, CHIP SYSTEM, AND TIMESTAMP SYNCHRONIZATION METHOD

    公开(公告)号:US20240345620A1

    公开(公告)日:2024-10-17

    申请号:US18634421

    申请日:2024-04-12

    IPC分类号: G06F1/12

    CPC分类号: G06F1/12

    摘要: A chip, a chip system, and a timestamp synchronization method. The chip is configured to be in communication connection to another chip, and includes a signal generating module, a first signal response module and a first delay module. The signal generating module is configured to generate a synchronization request signal and transmit the synchronization request signal to the first signal response module and the another chip, so that the another chip records a second timestamp of the another chip in response to receiving the synchronization request signal. The first delay module is configured to perform delay processing on the synchronization request signal to obtain a delayed synchronization request signal. The first signal response module is configured to record a first timestamp of the chip in response to receiving the delayed synchronization request signal, wherein the first timestamp and the second timestamp are used for performing a timestamp synchronization operation.

    COPROCESSOR, HOST PROCESSOR, CRASH DETECTION METHOD AND ELECTRONIC DEVICE

    公开(公告)号:US20240256373A1

    公开(公告)日:2024-08-01

    申请号:US18417955

    申请日:2024-01-19

    IPC分类号: G06F11/07

    CPC分类号: G06F11/0751 G06F11/0724

    摘要: Embodiments of the present disclosure relate to a coprocessor, a host processor, a crash detection method and an electronic device. In this method, the coprocessor sends a handshake request to the host processor capable of running an operating system. The host processor performs an operation triggered by the handshake request. The host processor sends a positive response to the handshake request to the coprocessor if the operation is performed successfully; and the host processor sends, to the coprocessor, a negative response to the handshake request or no response if the operation is performed successfully. The coprocessor monitors a response to the handshake request from the host processor and determines a detection result of hardware crash associated with the operating system at least based on a monitoring result of this response.

    CLOCK SYNCHRONIZATION METHOD AND APPARATUS, ELECTRONIC DEVICE AND STORAGE MEDIUM

    公开(公告)号:US20240168516A1

    公开(公告)日:2024-05-23

    申请号:US18513433

    申请日:2023-11-17

    IPC分类号: G06F1/12

    CPC分类号: G06F1/12

    摘要: A clock synchronization method and apparatus, an electronic device and a storage medium are provided. The clock synchronization method includes: sending a trigger signal to a second processing module and recording a current count value of the first timer upon sending the trigger signal as a first count value; and reading a second count value from the second processing module, the second count value is a current count value of a second timer of the second processing module upon the second processing module receiving the trigger signal, and a count value of the second timer is used as a timing reference of the second processing module and sequentially increasing; the first count value and the second count value are used for a clock compensation to synchronize a first clock domain where the first processing module is located with a second clock domain where the second processing module is located.

    METHOD AND APPARATUS FOR PROCESSING MULTI-CLOUD SERVICE, ELECTRONIC DEVICE AND STORAGE MEDIUM

    公开(公告)号:US20240146735A1

    公开(公告)日:2024-05-02

    申请号:US18498805

    申请日:2023-10-31

    IPC分类号: H04L9/40 G06F21/53

    CPC分类号: H04L63/10 G06F21/53

    摘要: A method and an apparatus for processing a multi-cloud service, an electronic device, a storage medium and a system are provided. The method includes acquiring a target multi-cloud scheduling instruction, where the target multi-cloud scheduling instruction includes a multi-cloud scheduling demand and description of schedule-required information; transmitting an application for the schedule-required information to a target user in a trusted environment based on the description of the schedule-required information, to obtain the schedule-required information; generating a scheduling strategy in the trusted environment based on the target multi-cloud scheduling instruction and the schedule-required information; and initiating scheduling to a target cloud vendor based on the scheduling strategy to obtain a scheduling result.

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240266245A1

    公开(公告)日:2024-08-08

    申请号:US18431780

    申请日:2024-02-02

    IPC分类号: H01L23/367 H01L21/48

    CPC分类号: H01L23/3675 H01L21/4878

    摘要: The embodiments of the disclosure provides a package structure and a manufacturing method thereof, the package structure includes: a die, including a substrate and a device layer, wherein the substrate has a front side and a back side opposite to each other in a first direction perpendicular to a main surface of the die, and the device layer is at the front side of the substrate; a thermal interface material layer, on the back side of the substrate; and a thermal dissipation component, attached to the die through the thermal interface material layer, the die further includes at least one of a heat dissipation filling structure and a substrate recess, the heat dissipation filling structure is embedded in the substrate and has an exposed part exposed at a sidewall of the substrate; the substrate recess is recessed from the back side of the substrate towards the device layer.