公开(公告)号：US20240321801A1

公开(公告)日：2024-09-26

申请号：US18614053

申请日：2024-03-22

申请人： BEIJING YOUZHUJU NETWORK TECHNOLOGY CO., LTD.

发明人： Haiying CHEN ,  Lin LIU ,  Meng MEI ,  Jifeng LI ,  Jian WANG

IPC分类号： H01L23/00

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/117 ,  H01L2224/1183 ,  H01L2224/13022 ,  H01L2224/1414 ,  H01L2224/16055 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/30107

摘要： Embodiments of the present disclosure provides a chip and a method of forming the same and a package structure, the chip includes a base substrate and conductive bumps located on the base substrate, a planar shape of each bump has a long axis and a short axis extending through a center of the bump, a length of the long axis is greater than that of the short axis, the conductive bumps include bump unit rows each of which includes initial bump units arranged along a first direction and a first expanded bump unit located between adjacent initial bump units; the bump unit rows are arranged in a second direction, with a second expanded bump unit disposed between adjacent bump unit rows, the conductive bumps include a first pattern, a second pattern and an additional pattern formed by corresponding bumps, and each having bumps with different rotation angles.

公开(公告)号：US20240266245A1

公开(公告)日：2024-08-08

申请号：US18431780

申请日：2024-02-02

申请人： Beijing Youzhuju Network Technology Co., Ltd.

发明人： Sijie LI ,  Haixin HUANG ,  Meng MEI ,  Jifeng LI ,  Jian WANG

IPC分类号： H01L23/367 ,  H01L21/48

CPC分类号： H01L23/3675 ,  H01L21/4878

摘要： The embodiments of the disclosure provides a package structure and a manufacturing method thereof, the package structure includes: a die, including a substrate and a device layer, wherein the substrate has a front side and a back side opposite to each other in a first direction perpendicular to a main surface of the die, and the device layer is at the front side of the substrate; a thermal interface material layer, on the back side of the substrate; and a thermal dissipation component, attached to the die through the thermal interface material layer, the die further includes at least one of a heat dissipation filling structure and a substrate recess, the heat dissipation filling structure is embedded in the substrate and has an exposed part exposed at a sidewall of the substrate; the substrate recess is recessed from the back side of the substrate towards the device layer.