公开(公告)号：US12092880B2

公开(公告)日：2024-09-17

申请号：US17700367

申请日：2022-03-21

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Roy Edward Meade ,  Derek Van Orden ,  Mark Wade

IPC分类号： G02B6/42

CPC分类号： G02B6/4214 ,  G02B6/4206 ,  G02B6/4212 ,  G02B6/423

摘要： A beam steering structure includes an alignment structure shaped to receive and align an optical fiber such that an axis of a core of the optical fiber is oriented in a first direction. The beam steering structure includes an end portion having an angled optical surface oriented at a non-zero angle relative to the first direction. The end portion is shaped and positioned so that light propagating along the first direction from the optical fiber passes through the end portion to reach the angled optical surface. A reflecting system is positioned on the angled optical surface across the first direction. The reflecting system is configured to reflect incident light propagating along the first direction into a first reflected beam of a first polarization and a second reflected beam of a second polarization. The first and second reflected beams are directed into first and second optical communication channels, respectively.

公开(公告)号：US12057332B2

公开(公告)日：2024-08-06

申请号：US15646039

申请日：2017-07-10

申请人： Ayar Labs, Inc.

发明人： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic

IPC分类号： H01L21/304 ,  B05D1/00 ,  G02B6/12 ,  G02B6/122 ,  G02B6/36 ,  G03F7/16 ,  G03F9/00 ,  H01L21/67 ,  H01S5/026

CPC分类号： H01L21/6715 ,  B05D1/005 ,  G02B6/12004 ,  G02B6/1225 ,  G02B6/3692 ,  G03F7/162 ,  G03F9/708 ,  G03F9/7084 ,  H01S5/0265 ,  G02B2006/12061

摘要： A photoresist material is deposited, patterned, and developed on a backside of a wafer to expose specific regions on the backside of chips for etching. These specific regions are etched to form etched regions through the backside of the chips to a specified depth within the chips. The specified depth may correspond to an etch stop material. Etching of the backside of the wafer can also be done along the chip kerf regions to reduce stress during singulation/dicing of individual chips from the wafer. Etching of the backside of the chips can be done with the chips still part of the intact wafer. Or, the wafer having the pattered and developed photoresist on its backside can be singulated/diced before etching through the backside of the individual chips. The etched region(s) formed through the backside of a chip can be used for attachment of optical component(s) to the chip.

公开(公告)号：US11694935B2

公开(公告)日：2023-07-04

申请号：US17079357

申请日：2020-10-23

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Anatol Khilo ,  Forrest Sedgwick ,  Alexandra Wright

IPC分类号： H01L21/66 ,  H04B10/073 ,  G02B6/12 ,  G02B6/13 ,  G01R31/3185 ,  F21V8/00 ,  H04B10/50

CPC分类号： H01L22/30 ,  G01R31/318511 ,  G02B6/12 ,  G02B6/13 ,  H04B10/0731 ,  G02B6/0028 ,  H04B10/503

摘要： A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.

公开(公告)号：US20220224433A1

公开(公告)日：2022-07-14

申请号：US17583185

申请日：2022-01-24

申请人： Ayar Labs, Inc.

发明人： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

IPC分类号： H04J14/02 ,  H04Q11/00 ,  H04B10/50

摘要： A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

公开(公告)号：US11280959B2

公开(公告)日：2022-03-22

申请号：US16856387

申请日：2020-04-23

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Chen Sun ,  Shahab Ardalan ,  John Fini ,  Forrest Sedgwick

IPC分类号： G02B6/13 ,  G02B6/12 ,  H01L21/66 ,  G01M11/00

摘要： An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

公开(公告)号：US20210257021A1

公开(公告)日：2021-08-19

申请号：US17175678

申请日：2021-02-14

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC分类号： G11C11/42 ,  G11C5/04 ,  G11C5/06

摘要： A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

公开(公告)号：US20200264390A1

公开(公告)日：2020-08-20

申请号：US16866528

申请日：2020-05-04

申请人： Ayar Labs, Inc.

发明人： Mark Wade ,  Chen Sun ,  John Fini ,  Roy Edward Meade ,  Vladimir Stojanovic ,  Alexandra Wright

IPC分类号： G02B6/42 ,  H01L29/06

摘要： A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.

公开(公告)号：US10749603B2

公开(公告)日：2020-08-18

申请号：US16194250

申请日：2018-11-16

申请人： Ayar Labs, Inc.

发明人： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden ,  Michael Davenport

IPC分类号： G02B6/12 ,  H04B10/50 ,  H01S5/022 ,  H01S5/40 ,  H01S5/026 ,  H04B10/80 ,  H01S5/024 ,  H01S5/50 ,  G02B6/42

摘要： An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

公开(公告)号：US10670807B2

公开(公告)日：2020-06-02

申请号：US15841210

申请日：2017-12-13

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  John Fini ,  Mark Wade

IPC分类号： G02B6/14 ,  G02B6/42 ,  G02B6/30 ,  G02B6/255 ,  G02B6/32 ,  G02B6/028

摘要： A lens assembly for an optical fiber includes an optical gap structure and a multi-mode optical fiber. The optical gap structure has first and second ends and a length measured therebetween. The first end of the optical gap structure is configured to attach to an end of a single-mode optical fiber. The multi-mode optical fiber has first and second ends and a length measured therebetween. The first end of the multi-mode optical fiber is attached to the second end of the optical gap structure. The length of the optical gap structure and the length of the multi-mode optical fiber are set to provide a prescribed working distance and a prescribed light beam waist diameter. The prescribed working distance is a distance measured from the second end of the multi-mode optical fiber to a location of the prescribed light beam waist diameter.

公开(公告)号：US20200158961A1

公开(公告)日：2020-05-21

申请号：US16683123

申请日：2019-11-13

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Roy Edward Meade ,  Derek Van Orden ,  Forrest Sedgwick

IPC分类号： G02B6/34 ,  G02B6/122 ,  G02B6/293 ,  G02B6/42

摘要： A grating coupler reflector (retro reflector) is formed within a photonics chip and includes a vertical scattering region, an optical waveguide, and a reflector. The optical waveguide is optically coupled to the vertical scattering region. The reflector is positioned at an end of the optical waveguide. The reflector is configured to reflect light that propagates through the optical waveguide from the vertical scattering region back toward the vertical scattering region. The location of the grating coupler reflector on the photonics chip is determinable by scanning a light emitting active optical fiber over the chip and detecting when light is reflected back into the active optical fiber from the grating coupler reflector. The determined location of the grating coupler reflector on the photonics chip is usable as a reference location for aligning optical fiber(s) to corresponding optical grating couplers on the photonics chip.