公开(公告)号：US12057332B2

公开(公告)日：2024-08-06

申请号：US15646039

申请日：2017-07-10

申请人： Ayar Labs, Inc.

发明人： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic

IPC分类号： H01L21/304 ,  B05D1/00 ,  G02B6/12 ,  G02B6/122 ,  G02B6/36 ,  G03F7/16 ,  G03F9/00 ,  H01L21/67 ,  H01S5/026

CPC分类号： H01L21/6715 ,  B05D1/005 ,  G02B6/12004 ,  G02B6/1225 ,  G02B6/3692 ,  G03F7/162 ,  G03F9/708 ,  G03F9/7084 ,  H01S5/0265 ,  G02B2006/12061

摘要： A photoresist material is deposited, patterned, and developed on a backside of a wafer to expose specific regions on the backside of chips for etching. These specific regions are etched to form etched regions through the backside of the chips to a specified depth within the chips. The specified depth may correspond to an etch stop material. Etching of the backside of the wafer can also be done along the chip kerf regions to reduce stress during singulation/dicing of individual chips from the wafer. Etching of the backside of the chips can be done with the chips still part of the intact wafer. Or, the wafer having the pattered and developed photoresist on its backside can be singulated/diced before etching through the backside of the individual chips. The etched region(s) formed through the backside of a chip can be used for attachment of optical component(s) to the chip.

公开(公告)号：US11709319B2

公开(公告)日：2023-07-25

申请号：US17353776

申请日：2021-06-21

申请人： Ayar Labs, Inc.

发明人： Pavan Bhargava ,  Derek Van Orden ,  Mark Wade ,  John Fini ,  Chen Sun ,  Milos Popovic ,  Anatol Khilo

IPC分类号： G02B6/293 ,  G02B27/10 ,  G02B6/27 ,  G02B6/42 ,  H04B10/60

CPC分类号： G02B6/29343 ,  G02B6/272 ,  G02B6/2766 ,  G02B6/2773 ,  G02B6/2934 ,  G02B6/4213 ,  G02B6/4215 ,  G02B27/1006 ,  H04B10/60

摘要： An electro-optic receiver includes a polarization splitter and rotator (PSR) that directs incoming light having a first polarization through a first end of an optical waveguide, and that rotates incoming light from a second polarization to the first polarization to create polarization-rotated light that is directed to a second end of the optical waveguide. The incoming light of the first polarization and the polarization-rotated light travel through the optical waveguide in opposite directions. A plurality of ring resonators is optically coupled the optical waveguide. Each ring resonator is configured to operate at a respective resonant wavelength, such that the incoming light of the first polarization having the respective resonant wavelength optically couples into said ring resonator in a first propagation direction, and such that the polarization-rotated light having the respective resonant wavelength optically couples into said ring resonator in a second propagation direction opposite the first propagation direction.

公开(公告)号：US20230194782A1

公开(公告)日：2023-06-22

申请号：US18168555

申请日：2023-02-13

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

IPC分类号： G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43

CPC分类号： G02B6/12019 ,  G02B6/12016 ,  G02B6/29335 ,  G02B6/125 ,  G02B6/43 ,  G02B2006/12107 ,  H04B10/25

摘要： An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

公开(公告)号：US11579361B2

公开(公告)日：2023-02-14

申请号：US17184537

申请日：2021-02-24

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

IPC分类号： G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43 ,  H04B10/25

摘要： An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

公开(公告)号：US20220224433A1

公开(公告)日：2022-07-14

申请号：US17583185

申请日：2022-01-24

申请人： Ayar Labs, Inc.

发明人： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

IPC分类号： H04J14/02 ,  H04Q11/00 ,  H04B10/50

摘要： A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

公开(公告)号：US11280959B2

公开(公告)日：2022-03-22

申请号：US16856387

申请日：2020-04-23

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Chen Sun ,  Shahab Ardalan ,  John Fini ,  Forrest Sedgwick

IPC分类号： G02B6/13 ,  G02B6/12 ,  H01L21/66 ,  G01M11/00

摘要： An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

公开(公告)号：US11237333B2

公开(公告)日：2022-02-01

申请号：US16831734

申请日：2020-03-26

申请人： Ayar Labs, Inc.

发明人： Pavan Bhargava ,  John Fini ,  Derek Van Orden ,  Chen Sun ,  Mark Wade

IPC分类号： G02B6/26 ,  G02B6/293 ,  G02F1/225

摘要： A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.

公开(公告)号：US11233371B2

公开(公告)日：2022-01-25

申请号：US16777003

申请日：2020-01-30

申请人： Ayar Labs, Inc.

发明人： Milos Popovic ,  Rajeev Ram ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Taylor Wade ,  Alexandra Carroll Wright

IPC分类号： H04J14/02 ,  H01S3/08 ,  H04B10/50 ,  H01S3/00 ,  H01S3/04 ,  H01S3/23 ,  H04B10/25 ,  H04B10/40 ,  H04B10/572

摘要： A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.

公开(公告)号：US20210257021A1

公开(公告)日：2021-08-19

申请号：US17175678

申请日：2021-02-14

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC分类号： G11C11/42 ,  G11C5/04 ,  G11C5/06

摘要： A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

公开(公告)号：US20200310035A1

公开(公告)日：2020-10-01

申请号：US16831734

申请日：2020-03-26

申请人： Ayar Labs, Inc.

发明人： Pavan Bhargava ,  John Fini ,  Derek Van Orden ,  Chen Sun ,  Mark Wade

IPC分类号： G02B6/293 ,  G02F1/225

摘要： A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.