公开(公告)号：US12057332B2

公开(公告)日：2024-08-06

申请号：US15646039

申请日：2017-07-10

申请人： Ayar Labs, Inc.

发明人： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic

IPC分类号： H01L21/304 ,  B05D1/00 ,  G02B6/12 ,  G02B6/122 ,  G02B6/36 ,  G03F7/16 ,  G03F9/00 ,  H01L21/67 ,  H01S5/026

CPC分类号： H01L21/6715 ,  B05D1/005 ,  G02B6/12004 ,  G02B6/1225 ,  G02B6/3692 ,  G03F7/162 ,  G03F9/708 ,  G03F9/7084 ,  H01S5/0265 ,  G02B2006/12061

摘要： A photoresist material is deposited, patterned, and developed on a backside of a wafer to expose specific regions on the backside of chips for etching. These specific regions are etched to form etched regions through the backside of the chips to a specified depth within the chips. The specified depth may correspond to an etch stop material. Etching of the backside of the wafer can also be done along the chip kerf regions to reduce stress during singulation/dicing of individual chips from the wafer. Etching of the backside of the chips can be done with the chips still part of the intact wafer. Or, the wafer having the pattered and developed photoresist on its backside can be singulated/diced before etching through the backside of the individual chips. The etched region(s) formed through the backside of a chip can be used for attachment of optical component(s) to the chip.

公开(公告)号：US20230194782A1

公开(公告)日：2023-06-22

申请号：US18168555

申请日：2023-02-13

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

IPC分类号： G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43

CPC分类号： G02B6/12019 ,  G02B6/12016 ,  G02B6/29335 ,  G02B6/125 ,  G02B6/43 ,  G02B2006/12107 ,  H04B10/25

摘要： An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

公开(公告)号：US11579361B2

公开(公告)日：2023-02-14

申请号：US17184537

申请日：2021-02-24

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

IPC分类号： G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43 ,  H04B10/25

摘要： An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

公开(公告)号：US20220224433A1

公开(公告)日：2022-07-14

申请号：US17583185

申请日：2022-01-24

申请人： Ayar Labs, Inc.

发明人： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

IPC分类号： H04J14/02 ,  H04Q11/00 ,  H04B10/50

摘要： A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

公开(公告)号：US11233371B2

公开(公告)日：2022-01-25

申请号：US16777003

申请日：2020-01-30

申请人： Ayar Labs, Inc.

发明人： Milos Popovic ,  Rajeev Ram ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Taylor Wade ,  Alexandra Carroll Wright

IPC分类号： H04J14/02 ,  H01S3/08 ,  H04B10/50 ,  H01S3/00 ,  H01S3/04 ,  H01S3/23 ,  H04B10/25 ,  H04B10/40 ,  H04B10/572

摘要： A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.

公开(公告)号：US20210257021A1

公开(公告)日：2021-08-19

申请号：US17175678

申请日：2021-02-14

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC分类号： G11C11/42 ,  G11C5/04 ,  G11C5/06

摘要： A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

公开(公告)号：US20200264390A1

公开(公告)日：2020-08-20

申请号：US16866528

申请日：2020-05-04

申请人： Ayar Labs, Inc.

发明人： Mark Wade ,  Chen Sun ,  John Fini ,  Roy Edward Meade ,  Vladimir Stojanovic ,  Alexandra Wright

IPC分类号： G02B6/42 ,  H01L29/06

摘要： A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.

公开(公告)号：US10749603B2

公开(公告)日：2020-08-18

申请号：US16194250

申请日：2018-11-16

申请人： Ayar Labs, Inc.

发明人： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden ,  Michael Davenport

IPC分类号： G02B6/12 ,  H04B10/50 ,  H01S5/022 ,  H01S5/40 ,  H01S5/026 ,  H04B10/80 ,  H01S5/024 ,  H01S5/50 ,  G02B6/42

摘要： An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

公开(公告)号：US20180217344A1

公开(公告)日：2018-08-02

申请号：US15886822

申请日：2018-02-01

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Roy Edward Meade ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Alexandra Wright

IPC分类号： G02B6/43 ,  G02B6/42

CPC分类号： G02B6/43 ,  G02B6/4216 ,  H04B10/40 ,  H04B10/801

摘要： An optical module includes a laser light supply system and a chip disposed within a housing. The chip includes a laser input optical port and a transmit data optical port and a receive data optical port. The optical module includes a link-fiber interface exposed at an exterior surface of the housing. The link-fiber interface includes a transmit data connector and a receive data connector. The optical module includes a polarization-maintaining optical fiber connected between a laser output optical port of the laser light supply system and the laser input optical port of the chip. The optical module includes a first non-polarization-maintaining optical fiber connected between the transmit data optical port of the chip and the transmit data connector of the link-fiber interface. The optical module includes a second non-polarization-maintaining optical fiber connected between the receive data optical port of the chip and the receive data connector of the link-fiber interface.

公开(公告)号：US11994724B2

公开(公告)日：2024-05-28

申请号：US17671525

申请日：2022-02-14

申请人： Ayar Labs, Inc.

发明人： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

IPC分类号： G02B6/293 ,  G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4202 ,  G02B6/2934 ,  G02B6/4216 ,  G02B6/4219 ,  G02B6/4287

摘要： An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.