公开(公告)号：US11415538B2

公开(公告)日：2022-08-16

申请号：US16812071

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Michael D. Willwerth ,  Daniel Thomas McCormick

IPC: G01R27/26 ,  G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US12009236B2

公开(公告)日：2024-06-11

申请号：US16391262

申请日：2019-04-22

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard M. Tedeschi ,  Daniel Sang Byun ,  Philip Allan Kraus ,  Phillip A. Criminale ,  Changhun Lee ,  Rajinder Dhindsa ,  Andreas Schmid ,  Denis M. Koosau

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H03K17/955

CPC classification number: H01L21/67259 ,  H01J37/32477 ,  H01J37/3288 ,  H01L22/12 ,  H03K17/955 ,  H01J2237/022

Abstract: The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.

公开(公告)号：US20210278360A1

公开(公告)日：2021-09-09

申请号：US16812071

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Michael D. Willwerth ,  Daniel Thomas McCormick

IPC: G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US20230343568A2

公开(公告)日：2023-10-26

申请号：US18071444

申请日：2022-11-29

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

CPC classification number: H01J37/32935 ,  H01J37/32807 ,  H01J37/32926 ,  G01N27/228 ,  H01J37/32853 ,  H01J2237/24592 ,  H01J2237/24495 ,  H01J2237/24564

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：US11551905B2

公开(公告)日：2023-01-10

申请号：US15925739

申请日：2018-03-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Yaoling Pan ,  Vijaykumar Krithivasan ,  Shimin Mao ,  Kelvin Chan ,  Michael D. Willwerth ,  Anantha Subramani ,  Ashish Goel ,  Chih-shun Lu ,  Philip Allan Kraus ,  Patrick John Tae ,  Leonard Tedeschi

IPC: H01J37/244 ,  H01L21/67 ,  H01L41/047 ,  H01L41/053 ,  H01L41/29 ,  H01L41/04 ,  H01J37/32 ,  H01L41/31

Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.

公开(公告)号：US20230103165A1

公开(公告)日：2023-03-30

申请号：US18071444

申请日：2022-11-29

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：US11545346B2

公开(公告)日：2023-01-03

申请号：US16812081

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：US20210280400A1

公开(公告)日：2021-09-09

申请号：US16812081

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard Tedeschi ,  Kiyki-Shiy N. Shang ,  Mikhail V. Taraboukhine ,  Charles R. Hardy ,  Sivasankar Nagarajan

IPC: H01J37/32 ,  G01N27/22

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

公开(公告)号：US12163911B2

公开(公告)日：2024-12-10

申请号：US17861034

申请日：2022-07-08

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Michael D. Willwerth ,  Daniel Thomas McCormick

IPC: G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US11581206B2

公开(公告)日：2023-02-14

申请号：US16812066

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Jennifer Sun ,  Philip Allan Kraus ,  Xiaopu Li ,  Kallol Bera ,  Michael D. Willwerth ,  Albert Barrett Hicks, III ,  Lisa J. Enman ,  Mark Joseph Saly ,  Daniel Thomas McCormick

IPC: H01L21/67 ,  G01N27/22 ,  G05B19/418

Abstract: Embodiments disclosed herein comprise a sensor. In an embodiment, the sensor comprises a substrate having a first surface and a second surface opposite from the first surface. In an embodiment, the sensor further comprises a first electrode over the first surface of the substrate, and a second electrode over the first surface of the substrate and adjacent to the first electrode. In an embodiment, the sensor further comprises a barrier layer over the first electrode and the second electrode.