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公开(公告)号：US20220086364A1
公开(公告)日：2022-03-17
申请号：US17021992
申请日：2020-09-15
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US20230343568A2
公开(公告)日：2023-10-26
申请号：US18071444
申请日：2022-11-29
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
CPC classification number: H01J37/32935 , H01J37/32807 , H01J37/32926 , G01N27/228 , H01J37/32853 , H01J2237/24592 , H01J2237/24495 , H01J2237/24564
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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公开(公告)号：US11284018B1
公开(公告)日：2022-03-22
申请号：US17021992
申请日：2020-09-15
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US20230345137A1
公开(公告)日：2023-10-26
申请号：US18214417
申请日：2023-06-26
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC classification number: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US11736818B2
公开(公告)日：2023-08-22
申请号：US17668363
申请日：2022-02-09
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC classification number: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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Patent Agency Ranking
公开(公告)号：US20220272278A1
公开(公告)日：2022-08-25
申请号：US17668363
申请日：2022-02-09
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaral Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US12114083B2
公开(公告)日：2024-10-08
申请号：US18214417
申请日：2023-06-26
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
CPC classification number: H04N23/90 , H01L21/67276 , H04N23/56 , H04N23/555
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US20230103165A1
公开(公告)日：2023-03-30
申请号：US18071444
申请日：2022-11-29
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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公开(公告)号：US11545346B2
公开(公告)日：2023-01-03
申请号：US16812081
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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公开(公告)号：US20210280400A1
公开(公告)日：2021-09-09
申请号：US16812081
申请日：2020-03-06
Applicant: Applied Materials, Inc.
Inventor： Yaoling Pan , Patrick John Tae , Michael D. Willwerth , Leonard Tedeschi , Kiyki-Shiy N. Shang , Mikhail V. Taraboukhine , Charles R. Hardy , Sivasankar Nagarajan
Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.
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