公开(公告)号：US09735034B2

公开(公告)日：2017-08-15

申请号：US14456682

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Kim Vellore ,  Dinesh Kanawade ,  Stephen Moffatt ,  Aaron Miller ,  Leonid M. Tertitski ,  Norman L. Tam ,  Michael Liu ,  Colin Fox

IPC: H05B3/68 ,  H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67115

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.

公开(公告)号：US10109514B2

公开(公告)日：2018-10-23

申请号：US15675825

申请日：2017-08-14

Applicant: Applied Materials, Inc.

Inventor： Kim Vellore ,  Dinesh Kanawade ,  Stephen Moffatt ,  Aaron Miller ,  Leonid M. Tertitski ,  Norman L. Tam ,  Michael Liu ,  Colin Fox

IPC: H05B3/68 ,  H01L21/67

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.

公开(公告)号：US20230352322A1

公开(公告)日：2023-11-02

申请号：US17733685

申请日：2022-04-29

Applicant: Applied Materials, Inc.

Inventor： Tetsuya Ishikawa ,  Ala Moradian ,  Manjunath Subbanna ,  Kim Vellore ,  Matthew Miller ,  Michael Rice

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/46

CPC classification number: H01L21/67115 ,  C23C16/4586 ,  C23C16/46

Abstract: Embodiments disclosed herein include a lamp module for a semiconductor processing chamber. In an embodiment, the lamp module plate comprises a back plate, a first ring that extends from the back plate, a second ring that extends from the back plate, and a third ring that extends from the back plate. In an embodiment, the lamp module further comprises a first plurality of lamps between the first ring and the second ring, a second plurality of lamps between the second ring and the third ring, and a third plurality of lamps configured to emit infrared radiation that propagates into the third ring.

公开(公告)号：US09696097B2

公开(公告)日：2017-07-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Kallol Bera ,  Kim Vellore ,  Andrew Constant ,  Jacob Newman ,  Jeffrey Blahnik ,  Jason Schaller ,  William Weaver ,  Robert Vopat ,  Benjamin Riordon

IPC: E21B27/00 ,  F28F3/12 ,  H01L21/67 ,  H01L21/673

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

公开(公告)号：US11047039B2

公开(公告)日：2021-06-29

申请号：US16232496

申请日：2018-12-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Lerner ,  Kim Vellore ,  Ami Sade ,  Steven Sansoni ,  Andrew Constant ,  Kevin Moraes ,  Roey Shaviv ,  Niranjan Kumar ,  Jeffrey Brodine ,  Michael Karazim

IPC: C23C14/50 ,  C23C14/04 ,  C23C14/24

Abstract: Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

公开(公告)号：US09953851B2

公开(公告)日：2018-04-24

申请号：US15207226

申请日：2016-07-11

Applicant: Applied Materials, Inc.

Inventor： Jiping Li ,  Aaron Muir Hunter ,  Bruce E. Adams ,  Kim Vellore ,  Samuel C. Howells ,  Stephen Moffatt

IPC: H01L21/00 ,  H01L21/20 ,  H01L21/36 ,  H01L21/26 ,  H01L21/42 ,  H01L21/44 ,  H01L21/67 ,  H01L21/268 ,  B23K26/00 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/066 ,  H01L21/324 ,  B23K101/40

CPC classification number: H01L21/67115 ,  B23K26/009 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/352 ,  B23K2101/40 ,  H01L21/268 ,  H01L21/324

Abstract: Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

公开(公告)号：US09390926B2

公开(公告)日：2016-07-12

申请号：US14159228

申请日：2014-01-20

Applicant: Applied Materials, Inc.

Inventor： Jiping Li ,  Aaron Muir Hunter ,  Bruce E. Adams ,  Kim Vellore ,  Samuel C. Howells ,  Stephen Moffatt

IPC: H01L21/00 ,  H01L21/268 ,  B23K26/00 ,  B23K26/03 ,  H01L21/20 ,  H01L21/26 ,  H01L21/36 ,  H01L21/42 ,  H01L21/44

CPC classification number: H01L21/67115 ,  B23K26/009 ,  B23K26/034 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/352 ,  B23K2101/40 ,  H01L21/268 ,  H01L21/324

Abstract: Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.

Abstract translation: 本文所述的实施例涉及热处理的装置和方法。 更具体地，本文所述的装置和方法涉及通过增加基板表面上的图像中的能量分布的均匀性来对半导体基板进行激光热处理。