公开(公告)号：US09735034B2

公开(公告)日：2017-08-15

申请号：US14456682

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Kim Vellore ,  Dinesh Kanawade ,  Stephen Moffatt ,  Aaron Miller ,  Leonid M. Tertitski ,  Norman L. Tam ,  Michael Liu ,  Colin Fox

IPC: H05B3/68 ,  H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67115

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.

公开(公告)号：US09281222B2

公开(公告)日：2016-03-08

申请号：US14203237

申请日：2014-03-10

Applicant: Applied Materials, Inc.

Inventor： William Tyler Weaver ,  Malcolm N. Daniel, Jr. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67742

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract translation: 晶片处理系统可以包括可以在半导体处理系统的腔室之间沿着非线性轨迹移动晶片的上部和下部连接的机器人臂。 这些特征可以导致半导体处理系统可以操作的更小的占地面积，更小的传送室，处理室中的较小的开口和更小的狭缝阀，同时保持高的晶片生产量。 在一些实施例中，可以提供两个分开的室之间的同时快速晶片交换，例如负载锁和ALD（原子层沉积）转盘。 还提供了晶片处理的方法，以及其它方面。

公开(公告)号：US10427303B2

公开(公告)日：2019-10-01

申请号：US14211049

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Malcolm N. Daniel, Jr. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: B25J9/16 ,  B25J11/00 ,  H01L21/67 ,  H01L21/677 ,  B25J9/04

Abstract: Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

公开(公告)号：US10109514B2

公开(公告)日：2018-10-23

申请号：US15675825

申请日：2017-08-14

Applicant: Applied Materials, Inc.

Inventor： Kim Vellore ,  Dinesh Kanawade ,  Stephen Moffatt ,  Aaron Miller ,  Leonid M. Tertitski ,  Norman L. Tam ,  Michael Liu ,  Colin Fox

IPC: H05B3/68 ,  H01L21/67

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.

公开(公告)号：US20140271050A1

公开(公告)日：2014-09-18

申请号：US14203237

申请日：2014-03-10

Applicant: Applied Materials, Inc.

Inventor： William Tyler Weaver ,  Malcolm N. Daniel, JR. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67742

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract translation: 晶片处理系统可以包括可以在半导体处理系统的腔室之间沿着非线性轨迹移动晶片的上部和下部连接的机器人臂。 这些特征可以导致半导体处理系统可以操作的更小的占地面积，更小的传送室，处理室中的较小的开口和更小的狭缝阀，同时保持高的晶片生产量。 在一些实施例中，可以提供两个分开的室之间的同时快速晶片交换，例如负载锁和ALD（原子层沉积）转盘。 还提供了晶片处理的方法，以及其它方面。

公开(公告)号：US20140271055A1

公开(公告)日：2014-09-18

申请号：US14211049

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Malcolm N. Daniel, JR. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: H01L21/677 ,  B25J9/16 ,  B25J11/00

CPC classification number: B25J9/1682 ,  B25J9/043 ,  B25J11/0095 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S901/29 ,  Y10T74/20305

Abstract: Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

Abstract translation: 描述电子设备处理系统。 该系统包括主体壳体，其具有传送室，第一小面，与第一小面相对的第二小面，第三小面和与第三小面相对的第四小面，耦合到第一小面的第一旋转木马组件，第二转盘组件 耦合到第三小面，耦合到第二小面的第一负载锁定，耦合到第四小面的第二负载锁和适于在传送室中操作以从第一和第二转盘交换衬底的机器人。 还有许多其他方面描述了用于传输基底的方法和多轴机器人。