公开(公告)号：US09281222B2

公开(公告)日：2016-03-08

申请号：US14203237

申请日：2014-03-10

Applicant: Applied Materials, Inc.

Inventor： William Tyler Weaver ,  Malcolm N. Daniel, Jr. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67742

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract translation: 晶片处理系统可以包括可以在半导体处理系统的腔室之间沿着非线性轨迹移动晶片的上部和下部连接的机器人臂。 这些特征可以导致半导体处理系统可以操作的更小的占地面积，更小的传送室，处理室中的较小的开口和更小的狭缝阀，同时保持高的晶片生产量。 在一些实施例中，可以提供两个分开的室之间的同时快速晶片交换，例如负载锁和ALD（原子层沉积）转盘。 还提供了晶片处理的方法，以及其它方面。

公开(公告)号：US10586720B2

公开(公告)日：2020-03-10

申请号：US16292790

申请日：2019-03-05

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, Jr. ,  Robert Mitchell

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

公开(公告)号：US10256125B2

公开(公告)日：2019-04-09

申请号：US15172180

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, Jr. ,  Robert Mitchell

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

公开(公告)号：US10427303B2

公开(公告)日：2019-10-01

申请号：US14211049

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Malcolm N. Daniel, Jr. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

IPC: B25J9/16 ,  B25J11/00 ,  H01L21/67 ,  H01L21/677 ,  B25J9/04

Abstract: Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

公开(公告)号：US09378994B2

公开(公告)日：2016-06-28

申请号：US14211123

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, Jr. ,  Robert Mitchell

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。