知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.012 seconds)

    Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
    1.
    发明授权
    Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems 有权

    公开(公告)号：US10916451B2

    公开(公告)日：2021-02-09

    申请号：US16453740

    申请日：2019-06-26

    Applicant: Applied Materials, Inc.

    Inventor： Mohsin Waqar ,  Marvin L. Freeman

    IPC: G05B19/04 ,  G05B19/18 ,  H01L21/67 ,  H01L21/687

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    Wafer handling systems and methods
    2.
    发明授权
    Wafer handling systems and methods 有权
    晶圆处理系统和方法

    公开(公告)号：US09281222B2

    公开(公告)日：2016-03-08

    申请号：US14203237

    申请日：2014-03-10

    Applicant: Applied Materials, Inc.

    Inventor： William Tyler Weaver ,  Malcolm N. Daniel, Jr. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

    IPC: H01L21/67 ,  H01L21/677

    CPC classification number: H01L21/67196 ,  H01L21/67742

    Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

    Abstract translation: 晶片处理系统可以包括可以在半导体处理系统的腔室之间沿着非线性轨迹移动晶片的上部和下部连接的机器人臂。 这些特征可以导致半导体处理系统可以操作的更小的占地面积，更小的传送室，处理室中的较小的开口和更小的狭缝阀，同时保持高的晶片生产量。 在一些实施例中，可以提供两个分开的室之间的同时快速晶片交换，例如负载锁和ALD（原子层沉积）转盘。 还提供了晶片处理的方法，以及其它方面。

    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS
    3.
    发明申请
    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS 审中-公开

    公开(公告)号：US20190318940A1

    公开(公告)日：2019-10-17

    申请号：US16453740

    申请日：2019-06-26

    Applicant: Applied Materials, Inc.

    Inventor： Mohsin Waqar ,  Marvin L. Freeman

    IPC: H01L21/67

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
    4.
    发明授权
    Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems 有权

    公开(公告)号：US10361099B2

    公开(公告)日：2019-07-23

    申请号：US15632031

    申请日：2017-06-23

    Applicant: Applied Materials, Inc.

    Inventor： Mohsin Waqar ,  Marvin L. Freeman

    IPC: G05B19/18 ,  H01L21/67 ,  H01L21/687

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS
    5.
    发明申请
    SYSTEMS AND METHODS OF GAP CALIBRATION VIA DIRECT COMPONENT CONTACT IN ELECTRONIC DEVICE MANUFACTURING SYSTEMS 审中-公开

    公开(公告)号：US20180374719A1

    公开(公告)日：2018-12-27

    申请号：US15632031

    申请日：2017-06-23

    Applicant: Applied Materials, Inc.

    Inventor： Mohsin Waqar ,  Marvin L. Freeman

    IPC: H01L21/67

    CPC classification number: H01L21/67011 ,  G05B2219/45031 ,  H01L21/67201 ,  H01L21/67259 ,  H01L21/687

    Abstract: An electronic device manufacturing system includes a motion control system for calibrating a gap between surfaces of process chamber or loadlock components by moving those component surfaces into direct contact with each other. The component surfaces may include a surface of a substrate and/or a substrate support and a surface of process delivery apparatus, which may be, e.g., a pattern mask and/or a plasma or gas distribution assembly. The motion control system may include a motion controller, a software program executable by the motion controller, a network, one or more actuator drivers, a software program executable by the one or more actuator drivers, one or more actuators, and one or more feedback devices. Methods of calibrating a gap via direct contact of process chamber or loadlock component surfaces are also provided, as are other aspects.

    Methods and systems providing misalignment correction in robots
    6.
    发明授权
    Methods and systems providing misalignment correction in robots 有权

    公开(公告)号：US10099377B2

    公开(公告)日：2018-10-16

    申请号：US15197039

    申请日：2016-06-29

    Applicant: Applied Materials, Inc.

    Inventor： Gregory J. Freeman ,  Marvin L. Freeman ,  Adam Cranmer

    IPC: B25J9/16 ,  B25J9/00 ,  B25J9/04

    Abstract: Methods of correcting positional misalignment of blades in robots, such as dual-bladed robots, are described. The methods include, in one or more embodiments, a robot including moveable arms and an end effector attached to one of the moveable arms, a flag disposed on one of the moveable arms or the end effector, a chamber adapted to be serviced by the end effector, a beam sensor positioned at a distance from the chamber, and correcting misalignment of the end effector wherein the misalignment occurs between an initial linear center-finding location and the estimated center of the chamber. Systems of such electronic device calibration are also disclosed. Numerous other aspects are provided.

    METHODS AND SYSTEMS PROVIDING MISALIGNMENT CORRECTION IN ROBOTS
    9.
    发明申请
    METHODS AND SYSTEMS PROVIDING MISALIGNMENT CORRECTION IN ROBOTS 审中-公开

    公开(公告)号：US20180001478A1

    公开(公告)日：2018-01-04

    申请号：US15197039

    申请日：2016-06-29

    Applicant: Applied Materials, Inc.

    Inventor： Gregory J. Freeman ,  Marvin L. Freeman ,  Adam Cranmer

    IPC: B25J9/16 ,  B25J9/00

    CPC classification number: B25J9/1692 ,  B25J9/0087 ,  B25J9/043 ,  G05B2219/39033

    Abstract: Methods of correcting positional misalignment of blades in robots, such as dual-bladed robots, are described. The methods include, in one or more embodiments, a robot including moveable arms and an end effector attached to one of the moveable arms, a flag disposed on one of the moveable arms or the end effector, a chamber adapted to be serviced by the end effector, a beam sensor positioned at a distance from the chamber, and correcting misalignment of the end effector wherein the misalignment occurs between an initial linear center-finding location and the estimated center of the chamber. Systems of such electronic device calibration are also disclosed. Numerous other aspects are provided.

    WAFER HANDLING SYSTEMS AND METHODS
    10.
    发明申请
    WAFER HANDLING SYSTEMS AND METHODS 有权
    WAFER处理系统和方法

    公开(公告)号：US20140271050A1

    公开(公告)日：2014-09-18

    申请号：US14203237

    申请日：2014-03-10

    Applicant: Applied Materials, Inc.

    Inventor： William Tyler Weaver ,  Malcolm N. Daniel, JR. ,  Robert B. Vopat ,  Jason M. Schaller ,  Jacob Newman ,  Dinesh Kanawade ,  Andrew J. Constant ,  Stephen C. Hickerson ,  Jeffrey C. Hudgens ,  Marvin L. Freeman

    IPC: H01L21/677

    CPC classification number: H01L21/67196 ,  H01L21/67742

    Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

    Abstract translation: 晶片处理系统可以包括可以在半导体处理系统的腔室之间沿着非线性轨迹移动晶片的上部和下部连接的机器人臂。 这些特征可以导致半导体处理系统可以操作的更小的占地面积，更小的传送室，处理室中的较小的开口和更小的狭缝阀，同时保持高的晶片生产量。 在一些实施例中，可以提供两个分开的室之间的同时快速晶片交换，例如负载锁和ALD（原子层沉积）转盘。 还提供了晶片处理的方法，以及其它方面。

Patent Agency Ranking