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    MULTI-POSITION BATCH LOAD LOCK APPARATUS AND SYSTEMS AND METHODS INCLUDING SAME
    5.
    发明申请
    MULTI-POSITION BATCH LOAD LOCK APPARATUS AND SYSTEMS AND METHODS INCLUDING SAME 有权
    多位置负载锁定装置和系统及包括其中的方法

    公开(公告)号：US20140271054A1

    公开(公告)日：2014-09-18

    申请号：US14211123

    申请日：2014-03-14

    Applicant: Applied Materials, Inc.

    Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

    IPC: H01L21/677 ,  H01L21/673

    CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

    Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

    Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。

    WAFER PROCESSING SYSTEMS INCLUDING MULTI-POSITION BATCH LOAD LOCK APPARATUS WITH TEMPERATURE CONTROL CAPABILITY
    6.
    发明申请
    WAFER PROCESSING SYSTEMS INCLUDING MULTI-POSITION BATCH LOAD LOCK APPARATUS WITH TEMPERATURE CONTROL CAPABILITY 审中-公开
    包括具有温度控制能力的多位置负载锁定装置的加热处理系统

    公开(公告)号：US20160284578A1

    公开(公告)日：2016-09-29

    申请号：US15172180

    申请日：2016-06-03

    Applicant: Applied Materials, Inc.

    Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

    IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

    CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

    Abstract: Various embodiments of wafer processing systems including batch load lock apparatus with temperature control capability are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

    Abstract translation: 公开了包括具有温度控制能力的批量装载锁定装置的晶片处理系统的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了操作批量装载锁定装置的方法，以及许多其它方面。

    Multi-position batch load lock apparatus and systems and methods including same
    7.
    发明授权
    Multi-position batch load lock apparatus and systems and methods including same 有权
    多位置批量装载锁定装置及包括其的系统及方法

    公开(公告)号：US09378994B2

    公开(公告)日：2016-06-28

    申请号：US14211123

    申请日：2014-03-14

    Applicant: Applied Materials, Inc.

    Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, Jr. ,  Robert Mitchell

    IPC: H01L21/677 ,  H01L21/67

    CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

    Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

    Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。

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