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    L-motion slit door for substrate processing chamber
    1.
    发明授权
    L-motion slit door for substrate processing chamber 有权

    公开(公告)号：US11488806B2

    公开(公告)日：2022-11-01

    申请号：US16870740

    申请日：2020-05-08

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Hamid Noorbakhsh

    IPC: H01J37/32 ,  H01L21/677

    Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit includes a slit door having an arcuate profile and including a first plate coupled to a second plate, wherein the first plate is configured to be coupled to an actuator, and wherein the second plate has a processing volume facing surface that includes silicon.

    Temperature controlled secondary electrode for ion control at substrate edge
    2.
    发明授权
    Temperature controlled secondary electrode for ion control at substrate edge 有权

    公开(公告)号：US11424096B2

    公开(公告)日：2022-08-23

    申请号：US16674982

    申请日：2019-11-05

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Hamid Noorbakhsh ,  Kartik Ramaswamy ,  Anwar Husain

    IPC: H01L21/683 ,  H01J37/04 ,  H01J37/32

    Abstract: Embodiments of process kits for use in substrate processing chambers are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes an annular electrode configured to surround an electrostatic chuck, wherein the annular electrode includes an upper portion bonded to a lower portion and an annular channel disposed at an interface between the upper portion and the lower portion; wherein the annular electrode includes a first channel extending from a lower surface of the lower portion to the annular channel and a second channel extending from the lower surface of the lower portion to the annular channel; wherein the annular electrode is configured to flow a coolant from the first channel to the second channel via the annular channel to cool the annular electrode; and wherein the annular electrode includes at least one of a dielectric coating or a ceramic cap to reduce or prevent arcing between the annular electrode and the electrostatic chuck.

    Ceramic electrostatic chuck having a V-shape seal band
    3.
    发明授权
    Ceramic electrostatic chuck having a V-shape seal band 有权

    公开(公告)号：US10943808B2

    公开(公告)日：2021-03-09

    申请号：US15361365

    申请日：2016-11-25

    Applicant: Applied Materials, Inc.

    Inventor： Hamid Noorbakhsh ,  Ippei Nakagawa ,  Nobuhiro Yoshida

    IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

    Abstract: Implementations described herein provide a substrate support assembly that includes a seal band. The seal band protects an adhesive layer that is disposed between an electrostatic chuck (ESC) and a cooling plate of the substrate support assembly. In one example, a substrate support assembly includes an electrostatic chuck and a cooling plate. A bonding layer secures a bottom surface of the electrostatic chuck to a top surface of the cooling plate. The bonding layer has an adhesive layer and a seal band. The seal band circumscribes and protects the adhesive layer. The seal band has a ring shaped body. The ring shaped body has a top surface connected to a bottom surface by an inner surface and an outer surface. The top surface and the bottom surface angled less than 85 degrees from the inner surface. The outer surface has an indent formed therein.

    Showerhead having a detachable high resistivity gas distribution plate
    4.
    发明授权
    Showerhead having a detachable high resistivity gas distribution plate 有权

    公开(公告)号：US10790120B2

    公开(公告)日：2020-09-29

    申请号：US16800285

    申请日：2020-02-25

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Jason Della Rosa ,  Hamid Noorbakhsh ,  Vladimir Knyazik ,  Jisoo Kim ,  Wonseok Lee ,  Usama Dadu

    IPC: C23C16/40 ,  H01J37/32

    Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a semiconductor processing chamber may include a base having a first side and a second side opposing the first side; a gas distribution plate disposed proximate the second side of the base, wherein the gas distribution plate is formed from a material having an electrical resistivity between about 60 ohm-cm to 90 ohm-cm; a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the base; and a thermal gasket disposed in a gap between the base and gas distribution plate.

    Showerhead with reduced backside plasma ignition
    9.
    发明授权
    Showerhead with reduced backside plasma ignition 有权

    公开(公告)号：US10745807B2

    公开(公告)日：2020-08-18

    申请号：US16418994

    申请日：2019-05-21

    Applicant: Applied Materials, Inc.

    Inventor： Haitao Wang ,  Hamid Noorbakhsh ,  Chunlei Zhang ,  Sergio Fukuda Shoji ,  Kartik Ramaswamy ,  Roland Smith ,  Brad L. Mays

    IPC: C23C16/40 ,  C23C16/455 ,  C23C16/44 ,  H01J37/32

    Abstract: Embodiments of the present disclosure relate to a showerhead assembly for use in a processing chamber. The showerhead assembly includes a porous insert disposed in a space defined between a gas distribution plate and a base plate to moderate the corrosive radicals resulting from plasma ignition to reduce particle issues and metal contamination in the chamber. The porous insert is a conductive material, such as metal, used to reduce the gap electrical field strength, or may be a dielectric material such as ceramic, polytetrafluoroethylene, polyamide-imide, or other materials with a low dielectric loss and high electrical field strength under conditions of high frequency and strong electric fields. As such, the electrical breakdown threshold is enhanced. The porous insert may reduce and/or eliminate showerhead backside plasma ignition and may include multiple concentric narrow rings that cover gas holes of the gas distribution plate.

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