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公开(公告)号：US20210217725A1
公开(公告)日：2021-07-15
申请号：US17129015
申请日：2020-12-21
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L23/552 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/498 , H01L25/00
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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公开(公告)号：US11488934B2
公开(公告)日：2022-11-01
申请号：US17129015
申请日：2020-12-21
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L23/552 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/498 , H01L25/00 , H01L23/00 , H01L23/538
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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公开(公告)号：US20220302043A1
公开(公告)日：2022-09-22
申请号：US17832952
申请日：2022-06-06
发明人： Young Woo Lee , Jae Ung Lee , Byong Jin Kim , EunNaRa Cho , Ji Hoon Oh , Young Seok Kim , Jin Young Khim , Tae Kyeong Hwang , Jin Seong Kim , Gi Jung Kim
IPC分类号： H01L23/552 , H01L23/00 , H01L23/498 , H01L23/31 , H01L21/48 , H01L21/56
摘要： An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.
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公开(公告)号：US12057434B2
公开(公告)日：2024-08-06
申请号：US17977164
申请日：2022-10-31
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/552 , H01L25/00
CPC分类号： H01L25/0652 , H01L21/4853 , H01L21/56 , H01L23/31 , H01L23/3128 , H01L23/49811 , H01L23/552 , H01L25/50 , H01L21/561 , H01L23/49827 , H01L23/5383 , H01L23/5384 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06548 , H01L2225/06572 , H01L2924/15153 , H01L2924/15159 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2224/73265 , H01L2224/32145 , H01L2224/48227 , H01L2924/00012 , H01L2224/97 , H01L2224/83 , H01L2224/97 , H01L2224/81 , H01L2224/97 , H01L2224/85 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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公开(公告)号：US11855000B2
公开(公告)日：2023-12-26
申请号：US17832952
申请日：2022-06-06
发明人： Young Woo Lee , Jae Ung Lee , Byong Jin Kim , EunNaRa Cho , Ji Hoon Oh , Young Seok Kim , Jin Young Khim , Tae Kyeong Hwang , Jin Seong Kim , Gi Jung Kim
IPC分类号： H01L23/31 , H01L23/552 , H01L23/00 , H01L23/498 , H01L21/48 , H01L21/56 , H01L23/538 , H01L25/065
CPC分类号： H01L23/552 , H01L21/486 , H01L21/4853 , H01L21/4889 , H01L21/565 , H01L23/3114 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L25/0655 , H01L2224/16227 , H01L2224/73204 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/97 , H01L2224/81 , H01L2924/181 , H01L2924/00012
摘要： An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.
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公开(公告)号：US20230118400A1
公开(公告)日：2023-04-20
申请号：US17977164
申请日：2022-10-31
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L23/552 , H01L23/31 , H01L21/56 , H01L21/48 , H01L23/498 , H01L25/00
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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公开(公告)号：US11355449B2
公开(公告)日：2022-06-07
申请号：US16857439
申请日：2020-04-24
发明人： Young Woo Lee , Jae Ung Lee , Byong Jin Kim , EunNaRa Cho , Ji Hoon Oh , Young Seok Kim , Jin Young Khim , Tae Kyeong Hwang , Jin Seong Kim , Gi Jung Kim
IPC分类号： H01L23/49 , H01L23/552 , H01L23/00 , H01L23/498 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/538 , H01L25/065
摘要： An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.
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