公开(公告)号：US20210217725A1

公开(公告)日：2021-07-15

申请号：US17129015

申请日：2020-12-21

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Seong Kim ,  Edwin J. Adlam ,  Ludovico E. Bancod ,  Gi Jung Kim ,  Robert Lanzone ,  Jae Ung Lee ,  Yung Woo Lee ,  Mi Kyeong Choi

IPC分类号： H01L25/065 ,  H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L25/00

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

公开(公告)号：US11488934B2

公开(公告)日：2022-11-01

申请号：US17129015

申请日：2020-12-21

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Seong Kim ,  Edwin J. Adlam ,  Ludovico E. Bancod ,  Gi Jung Kim ,  Robert Lanzone ,  Jae Ung Lee ,  Yung Woo Lee ,  Mi Kyeong Choi

IPC分类号： H01L25/065 ,  H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L25/00 ,  H01L23/00 ,  H01L23/538

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

公开(公告)号：US20230118400A1

公开(公告)日：2023-04-20

申请号：US17977164

申请日：2022-10-31

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Seong Kim ,  Edwin J. Adlam ,  Ludovico E. Bancod ,  Gi Jung Kim ,  Robert Lanzone ,  Jae Ung Lee ,  Yung Woo Lee ,  Mi Kyeong Choi

IPC分类号： H01L25/065 ,  H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L25/00

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

公开(公告)号：US12057434B2

公开(公告)日：2024-08-06

申请号：US17977164

申请日：2022-10-31

申请人： Amkor technology Singapore Holding Pte. Ltd.

发明人： Jin Seong Kim ,  Edwin J. Adlam ,  Ludovico E. Bancod ,  Gi Jung Kim ,  Robert Lanzone ,  Jae Ung Lee ,  Yung Woo Lee ,  Mi Kyeong Choi

IPC分类号： H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/552 ,  H01L25/50 ,  H01L21/561 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.